Patents by Inventor Wolfram Koestler

Wolfram Koestler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Termination structure, a mask for manufacturing a termination structure, a lithographic process and a semiconductor device with a termination structure
    Publication number: 20080028359
    Abstract: Termination structure for a pattern, especially an at least partially regular spaced pattern used in the manufacturing of semiconductor devices, especially DRAM-chips, wherein the termination structure comprises at least a first line-shaped element and at least one extension element adjacent to the first line-shaped element partially increasing the width of the first line-shaped element.
    Type: Application
    Filed: July 31, 2006
    Publication date: January 31, 2008
    Inventors: Stefan Blawid, Wolfram Koestler, Ralf Ziebold
  • Imaging system and method for producing semiconductor structures on a wafer by imaging a mask on the wafer with a dipole diaphragm
    Publication number: 20060183258
    Abstract: An imaging system having a dipole diaphragm (2) having two diaphragm openings (2b) arranged one behind the other in a dipole axis (y), and a mask having mask structures (20, 23) is used for producing semiconductor structures (10?, 13?) on a wafer (15?) by imaging the mask (25) onto the wafer (15?). The dipole diaphragm (2) is provided for the imaging of the mask (25), and the mask (25), for producing main semiconductor structures (10; 10?) on the wafer (15?), has main mask structures (20) parallel to an imaging axis (x) running perpendicular to the dipole axis (y). At least one connecting mask structure (23?) oriented obliquely with respect to the dipole axis (y) at least in sections is formed on the mask (25), which structure connects at least two main mask structures (20) to one another.
    Type: Application
    Filed: January 19, 2006
    Publication date: August 17, 2006
    Inventors: Mario Hennig, Wolfram Koestler, Molela Moukara, Joerg Thiele, Thorsten Winkler, Karsten Zeiler
  • Method for producing semiconductor patterns on a wafer
    Publication number: 20060177773
    Abstract: A method is used to produce semiconductor patterns (10?, 13?) on a wafer (15?). For this purpose, a mask (25) and a dipole aperture (2) with two aperture openings (2b) arranged behind one another in a dipole axis (y) are used. The mask (25) is imaged on the wafer (15?) by means of the dipole aperture (2) and, by the imaging of the mask (25) on the wafer (15?), main semiconductor patterns (10?) are produced which are aligned perpendicularly to the dipole axis (y) and in parallel with an imaging axis (x). A second mask (35) with at least one connecting mask pattern (33) is imaged on the wafer (15?) by means of a second aperture (6), as a result of which a connecting semiconductor pattern (13) is produced on the wafer (15?), by means of which at least two of the main semiconductor patterns (10?) are connected to one another.
    Type: Application
    Filed: January 19, 2006
    Publication date: August 10, 2006
    Inventors: Mario Hennig, Wolfram Koestler, Molela Moukara, Joerg Thiele, Thorsten Winkler, Karsten Zeiler