Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: Disclosed area methods for fabricating three-dimensional artificial lipid biomembrane structure arrays with sufficient reaction area and high stability on a substrate in a simpler and easier manner. The methods use constituent lipids of real cell membranes and a plurality of microwells formed on a substrate. The methods can more effectively provide biomimetic three-dimensional lipid membrane structure arrays that possess structural and/or functional properties of cell membranes.