Patents by Inventor Won Bae

Won Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12159968
    Abstract: Embodiments of the present invention provide a lithium secondary battery including anode active material layers which have a multi-layered structure and include carbon-based active materials having different contents from each other, thereby improving mechanical stability and battery performance.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: December 3, 2024
    Assignee: SK On Co., Ltd.
    Inventors: Yong Seok Lee, Jung Hwan Kim, Sang Won Bae, Ji Hee Bae, Myung Ro Lee, Jae Yun Min
  • Publication number: 20240387801
    Abstract: An anode active material composition for a lithium secondary battery includes a carbon-based anode active material and a silicon-based anode active material, wherein the carbon-based anode active material has an orientation (I004/I110, here, I004 is a peak intensity of the (004) plane when measuring X-ray diffraction (XRD) of the carbon-based anode active material, and I110 is a peak intensity of the (110) plane when measuring XRD of the carbon-based anode active material) of 2.85 or less measured by XRD.
    Type: Application
    Filed: May 16, 2024
    Publication date: November 21, 2024
    Inventors: Yong Seok LEE, Sung Do KIM, Jae Ram KIM, Jeong A KIM, So Hyun PARK, Sang Won BAE, Seung Deok SEO, Ki Joo EOM, Jong Hyuk LEE, Hyun Joong JANG
  • Publication number: 20240363506
    Abstract: A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.
    Type: Application
    Filed: March 4, 2024
    Publication date: October 31, 2024
    Inventors: Won Bae Bang, Kwang Seok Oh
  • Publication number: 20240336839
    Abstract: A titanium nitride etchant composition and a method of forming a semiconductor device using the same are provided. The titanium nitride etchant composition includes hydrogen peroxide, phosphoric acid, and an amine compound, wherein the amine compound includes two or more nitrogen atoms.
    Type: Application
    Filed: November 14, 2023
    Publication date: October 10, 2024
    Applicants: Samsung Electronics Co,. Ltd., OCI Company Ltd.
    Inventors: GAYOUNG SONG, JUNG-MIN OH, TAE SOO KWON, JUN-EUN LEE, SANG WON BAE, Minjae SUNG, YOUN SUG YOO, WOOK CHANG
  • Publication number: 20240339666
    Abstract: A lithium secondary battery includes a cathode including a cathode active material that includes a lithium metal oxide, an anode facing the cathode and including an anode electrode active material that includes a graphite-based active material and a silicon-carbon composite, and an electrolyte solution including a lithium salt and an organic solvent, the lithium salt including lithium bis(fluorosulfonyl)imide (LiFSI) and the organic solvent including an acetate-based solvent. A content of the silicon-carbon composite is in a range from 5 wt % to 12 wt % based on a total weight of the anode active material.
    Type: Application
    Filed: April 1, 2024
    Publication date: October 10, 2024
    Inventors: Jae Yeong LEE, Jae Ram KIM, Ji Won NA, Sang Won BAE, Ji Hee BAE, Yeon Hwa SONG, Ki Joo EOM, Myung Ro LEE, Yong Seok LEE, Hyun Joong JANG
  • Patent number: 12111144
    Abstract: The present invention relates to an electronic self-destructing fuse structure which releases a safety device by means of a predetermined level of setback and centrifugal force after a 40 mm grenade is launched, thereby ensuring safety, and which can explode according to the application of an impact of a predetermined level or higher, and also self-destruct after a predetermined time elapses if the impact does not reach the predetermined level and an explosion does not occur, thereby preventing the occurrence of an unexploded grenade.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: October 8, 2024
    Assignee: SEJU ENGINEERING CO., LTD.
    Inventor: Won-Bae Lee
  • Publication number: 20240316140
    Abstract: The present invention relates to: a composition for liver protection, comprising a mixture of a porcine placenta enzymatic hydrolysate and a porcine placenta acid hydrolysate; and a composition for the prevention, amelioration or treatment of liver damage caused by alcohol, drug addiction or hangover. The composition of the present invention has a remarkable effect on liver protection and, in particular, has a remarkable effect on the prevention, amelioration or treatment of liver damage caused by alcohol, and thus can be effectively used in the pharmaceutical field and the food field.
    Type: Application
    Filed: June 30, 2021
    Publication date: September 26, 2024
    Applicant: UBIO INC.
    Inventors: Keun Nam KIM, Gun Won BAE, Jee Sun HWANG, Sun Myung YOON
  • Patent number: 12062588
    Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: August 13, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon
  • Publication number: 20240263072
    Abstract: The present disclosure relates to an etchant composition for etching silicon and silicon germanium, and/or a preparation method of a pattern using the etchant composition. The etchant composition may include an oxidizing agent, a fluorine-based compound, a surfactant represented by Chemical Formula 1 or 2, and water. The etchant composition may include the surfactant in an amount of 5% to 40% by weight based on 100% by weight of the etchant composition.
    Type: Application
    Filed: July 18, 2023
    Publication date: August 8, 2024
    Applicants: Samsung Electronics Co., Ltd., DONGWOO FINE-CHEM CO., LTD.
    Inventors: Heesuk WOO, Kyusang AHN, Jung-Min OH, Jiwon KIM, Jinkyu ROH, Hyojoong YOON, Sang Won BAE, Kyungmo SUNG
  • Publication number: 20240258182
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Application
    Filed: April 12, 2024
    Publication date: August 1, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240258225
    Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.
    Type: Application
    Filed: April 10, 2024
    Publication date: August 1, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae BANG, Byong Jin KIM, Gi Jeong KIM, Ji Young CHUNG
  • Publication number: 20240241188
    Abstract: An apparatus and method for detecting a defective battery cell is proposed. The proposed apparatus includes a charger for supplying current to cause a battery cell to maintain a constant voltage, a measurement part for measuring the voltage and current of the battery cell, and a controller for determining whether a defect exists in the battery cell on the basis of the current measured by the measurement part, whereby the defective battery cell may be detected with high accuracy, a time required for the detection may be shortened, and a space required for the detection may also be reduced.
    Type: Application
    Filed: December 22, 2023
    Publication date: July 18, 2024
    Inventors: Ji Won NA, Jae Ram KIM, Sang Won BAE, Ji Hee BAE, Yeon Hwa SONG, Ki Joo EOM, Myung Ro LEE, Jae Yeong LEE, Hyun Joong JANG
  • Patent number: 12021563
    Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: June 25, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hae Chung Kang, Eun Kyu Kang, Jong Jin Lee, Sang Jin Kwon, Won Bae Kwon, Dae Seon Kim, Dae Woong Moon, Soo Yong Jung, Gye Sul Cho
  • Patent number: 11978901
    Abstract: A cathode for a lithium secondary battery includes a cathode current collector, and a cathode active material layer formed on the cathode current collector. The cathode active material layer includes a cathode active material and a conductive material ID/IG is in a range from 0.5 to 1.25 in a Raman spectrum of the cathode active material layer. The cathode active material includes lithium metal oxide particles containing nickel and manganese and having a content of cobalt of less than 2 mol % among all elements except for lithium and oxygen.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: May 7, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Yong Seok Lee, Jae Ram Kim, Ji Won Na, Sang Won Bae, Yeon Hwa Song, Ki Joo Eom, Myung Ro Lee, Jae Yeong Lee, Hyun Joong Jang
  • Publication number: 20240130892
    Abstract: Glaucoma is a type of eye disease caused by high intraocular pressure (IOP). An increase in IOP causes damage to the appearance and function of the optic nerve and, when left untreated, leads to vision loss. However, once inserted, the conventional aqueous humor drainage devices implanted to control IOP continuously discharge a certain amount of aqueous humor regardless of how high or low the IOP is and thus have difficulty in effectively controlling the IOP. The present disclosure, which has been devised to address the above problems, relates to a novel aqueous humor drainage device for controlling IOP. The aqueous humor drainage device of the present disclosure, which is a double-layer aqueous humor drainage device having a tube made of a shape memory polymer included therein, can control both low IOP and high IOP and thus has an excellent effect of maintaining IOP within a clinically acceptable range.
    Type: Application
    Filed: June 8, 2021
    Publication date: April 25, 2024
    Inventors: Chan Yun KIM, Hyoung Won BAE, Wungrak CHOI
  • Patent number: 11961794
    Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 16, 2024
    Assignee: Amikor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Ji Young Chung
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11953181
    Abstract: A vehicle lamp includes a light emitting diode (LED) drive module (LDM) including a printed circuit board (PCB) on which an electronic element for driving a light source is mounted, and an electromagnetic interference (EMI) cover coupled to the PCB to surround the electronic element, and a lamp housing including a guide portion formed in a first direction such that the LDM is coupled thereto in a sliding manner and a seating portion in surface contact with a tip portion of the LDM in a coupled state, wherein a cover pressing portion that protrudes in a coupling direction of the LDM and presses the EMI cover in a second direction may be formed in the seating portion.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: April 9, 2024
    Assignee: Hyundai Mobis Co., Ltd.
    Inventor: Jong Won Bae
  • Publication number: 20240112975
    Abstract: In one example, an electronic device includes a substrate including a substrate first side, a conductive structure, and a substrate sidewall on the substrate first side. The substrate sidewall forms a perimeter, the substrate first side within the perimeter defines a substrate base, and the substrate sidewall and the substrate base form a substrate cavity. An electronic component includes a component first side, a component second side, and a component lateral side. The electronic component is disposed over a first portion of the substrate base within the substrate cavity and is coupled to the conductive structure. An encapsulant encapsulates at least a portion of the component lateral side, and a lid is over at least a portion of the component first side. At least a portion of the component first side is devoid of the encapsulant. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: October 3, 2022
    Publication date: April 4, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Kwang Seok PARK, Won Bae BANG, Seo Yoon CHANG
  • Publication number: 20240097148
    Abstract: The present invention relates to a reserve battery allowing a voltage to quickly rise while being activated by an impact in a normal state in which electricity is not generated and, more specifically, to a reserve battery having a stacked electrode structure, the reserve battery improving the speed of an activation operation and generating a high voltage while being easily manufactured through a structure in which a main body case, instead of an ampoule of metal and glass materials, acts as an ampoule, a cover is attached through welding in a state of directly accommodating an electrolyte, and then a substrate having an anode and a cathode formed thereon is provided as a single layer or a plurality of layers, and a through film, which is broken by pressure and pushes the electrolyte toward the electrodes, is formed at the center of the cover.
    Type: Application
    Filed: October 16, 2020
    Publication date: March 21, 2024
    Applicant: Seju Engineering Co., Ltd.
    Inventor: Won-Bae LEE