Patents by Inventor Won-bin HONG

Won-bin HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11791539
    Abstract: An antenna structure according to an embodiment of the present invention includes a film antenna including a dielectric layer, an upper electrode layer disposed on an upper surface of the dielectric layer and including a radiation pattern, a transmission line, and a ground pad, and a lower ground layer disposed on a lower surface of the dielectric layer, and a flexible circuit board including a core layer, a power supply wiring layer disposed on a lower surface of the core layer and electrically connected to the transmission line, and a ground plate disposed on an upper surface of the core layer and disposed in overlapping with the power supply wiring layer in a planar direction. Thereby, it is possible to reduce a radiation signal generated from the power supply wiring through the ground plate, suppress a noise of the antenna and increase radiation efficiency.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: October 17, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Jong Min Kim, Han Sub Ryu, Dong Pil Park, Won Bin Hong
  • Patent number: 11782544
    Abstract: An image display device according to an embodiment of the present disclosure includes a display panel, a touch sensor structure and an antenna electrode layer. The display panel includes a panel substrate, and an electrode structure and an insulation structure stacked on the panel substrate. The touch sensor structure is disposed on the display panel. The antenna electrode layer is disposed on the display panel at the same level as that of the touch sensor structure and at least partially overlaps the electrode structure of the display panel in a thickness direction. The antennal electrode layer is disposed in consideration of an electrode construction of the display panel and the touch sensor structure to provide a thin-layered image display device with high reliability.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: October 10, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Yoon Ho Huh, Dong Pil Park, Young Jun Lee, Won Bin Hong
  • Patent number: 11710889
    Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiation pattern disposed on a top surface of the dielectric layer, a signal pad electrically connected to the radiation pattern, and a ground pad spaced apart from the signal pad and having an isolation space. A length of the isolation space is greater than a length of the signal pad.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: July 25, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Han Sub Ryu, Yun Seok Oh, Yoon Ho Huh, Won Bin Hong
  • Publication number: 20230225046
    Abstract: A circuit board according to an embodiment includes a core layer including a first region and a second region, and antenna power supply wirings disposed on the core layer over the first region and the second region. The antenna power supply wirings may include a first portion extending in a first direction in the first region, a second portion extending in a second direction in the first region, and a third portion extending in the first direction in the second region, and an interval between the neighboring second portions of the antenna power supply wirings is 3 times or less of an interval between the neighboring third portions of the antenna power supply wirings.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 13, 2023
    Inventors: Byung Jin CHOI, Young Ju KIM, Dong Pil PARK, Won Bin HONG
  • Publication number: 20230217584
    Abstract: A circuit board according to an embodiment includes a first substrate including an antenna feeder line formed thereon to connect an antenna driving unit and an antenna, a second substrate including a data line formed thereon to transmit data processed in the antenna driving unit to an electronic component, and a third substrate which is disposed between the first substrate and the second substrate, and includes a power supply line formed thereon to supply a power to the antenna driving unit.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 6, 2023
    Inventors: Byung Jin CHOI, Na Yeon KIM, Dong Pil PARK, Won Bin HONG
  • Publication number: 20230155288
    Abstract: A phased array antenna with a high impedance surface according to an embodiment of the present disclosure is a phased array antenna with a high impedance surface including a plurality of unit elements, and each of the plurality of unit elements includes a substrate, a partial ground plane formed at least partially on the substrate, a planar inverted-L radiator disposed on the partial ground plane, and a via wall integrated in parallel on both edges of the partial ground plane, and a one-dimensional electromagnetic bandgap (EBG) structure is embedded in an edge of the planar radiator side of the partial ground plane.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 18, 2023
    Applicant: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Jae Yeong LEE, Won Bin HONG
  • Patent number: 11637380
    Abstract: The present disclosure provides technology that proposes an ultra-high frequency band (mmWave band) vertical polarization antenna having a new structure applicable to a slim planar structure (e.g., a terminal).
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: April 25, 2023
    Assignees: SK TELECOM CO., LTD., POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Hee Chang Seong, Joon Young Shin, Sung Yong Kang, Won Bin Hong, Jun Ho Park
  • Publication number: 20230098313
    Abstract: An antenna device according to an embodiment includes a dielectric layer, a first radiator disposed on the dielectric layer in a first direction, a second radiator disposed on the dielectric layer in a second direction, a first transmission line which extends in the first direction to be connected to the first radiator, and a second transmission line which extends in the second direction to be connected to the second radiator, and intersects the first transmission line with being physically or electrically spaced apart therefrom.
    Type: Application
    Filed: December 7, 2022
    Publication date: March 30, 2023
    Inventors: Jae Hyun LEE, Dong Pil PARK, Ho Dong YOON, Byung Jin CHOI, Won Bin HONG
  • Publication number: 20230097532
    Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a first radiator disposed on the dielectric layer in a first direction, a second radiator formed in a shape different from that of the first radiator and disposed on the dielectric layer in a second direction, a first transmission line which extends in the first direction to be connected to the first radiator, and a second transmission line which extends in the second direction to be connected to the second radiator, and intersects the first transmission line with being physically or electrically spaced apart therefrom.
    Type: Application
    Filed: December 8, 2022
    Publication date: March 30, 2023
    Inventors: Jae Hyun LEE, Dong Pil PARK, Won Hee LEE, Hee Jun PARK, Won Bin HONG
  • Patent number: 11600911
    Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, an upper electrode layer disposed on the dielectric layer and including a radiation pattern, a lower electrode layer disposed on the dielectric layer, and a bending connection portion integrally connected to the upper electrode layer and the lower electrode layer on the dielectric layer. An interconnection of a ground layer is implemented with high reliability by the bending connection portion.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: March 7, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Jong Min Kim, Dong Pil Park, Yun Seok Oh, Won Bin Hong
  • Publication number: 20230058014
    Abstract: An antenna package according to an embodiment includes an antenna unit, and a circuit board electrically connected to the antenna unit. The circuit board may include a core layer, a signal transmission wiring disposed on one surface of the core layer, the signal transmission wiring having one end portion connected to the antenna unit, a ground layer disposed on an opposite surface facing the one surface of the core layer, and a first via structure formed through the core layer and arranged around the one end portion of the signa transmission wiring to be in contact with the ground layer.
    Type: Application
    Filed: November 7, 2022
    Publication date: February 23, 2023
    Inventors: Byung Jin CHOI, Ho Dong YOON, Won Hee LEE, Won Bin HONG
  • Publication number: 20230052259
    Abstract: An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.
    Type: Application
    Filed: October 31, 2022
    Publication date: February 16, 2023
    Inventors: Byung Jin CHOI, Na Yeon KIM, Young Ju KIM, Won Bin HONG
  • Patent number: 11557830
    Abstract: A film antenna-circuit connection structure according to an embodiment of the present invention includes a film antenna including radiation patterns and pads, and a circuit board electrically connected to the film antenna. The film antenna includes connection wirings each of which is electrically connected to each of the pads of the film antenna, and a dummy barrier interposed between neighboring connection wirings of the connection wirings.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: January 17, 2023
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Jong Min Kim, Chan Hee Lee, Yun Seok Oh, Won Bin Hong
  • Publication number: 20230006356
    Abstract: An antenna device according to an embodiment includes an array antenna including a plurality of antenna elements, a first flexible printed circuit board (FPCB) including a plurality of first transmission lines which are electrically connected to the plurality of antenna elements and have different lengths, and a radio frequency integrated circuit (RFIC) electrically connected to the plurality of first transmission lines.
    Type: Application
    Filed: September 13, 2022
    Publication date: January 5, 2023
    Inventors: Ho Dong YOON, Dong Pil PARK, Byung Jin CHOI, Won Bin HONG, Jun Ho PARK
  • Patent number: 11509049
    Abstract: A touch sensor-antenna module according to exemplary embodiments of the present invention includes a substrate layer, a touch sensor electrode layer disposed on a central portion of an upper surface of the substrate layer, and antenna patterns disposed on a peripheral portion of the upper surface of the substrate layer at the same level as that of the touch sensor electrode layer. Mutual interference between the touch sensor electrode layer and the antenna pattern may be reduced to improve signal reliability and process efficiency.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: November 22, 2022
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Yun Seok Oh, Jong Min Kim, Dong Pil Park, Won Bin Hong
  • Patent number: 11469492
    Abstract: A film antenna according to an embodiment of the present invention includes a dielectric layer, a first electrode on the dielectric layer, an insulation layer covering the first electrode, and a second electrode on the insulation layer to be electrically connected to the first electrode. The second electrode has a thickness different from that of the first electrode and has a transmittance lower than that of the first electrode. The film antenna having high transmittance and providing high frequency operation may be provided by a construction of the first electrode and the second electrode.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: October 11, 2022
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Yoon Ho Huh, Dong Pil Park, Yun Seok Oh, Won Bin Hong
  • Patent number: 11469507
    Abstract: The present invention relates to a communication technique for fusing a 5G communication system to support a higher data transmission rate than a 4G system, with IoT technology, and a system thereof. In addition, the present invention provides an antenna module comprising: a first plate which forms an upper surface of the antenna module and has a first opening surface on one side surface, a second plate which forms a side surface of the antenna module, forms a first angle with the first plate in contact with the first plate, and has a second opening surface on one side surface so as to extend the first opening surface, and a power supply unit which has one surface electrically connected to the first plate and is disposed on the first opening surface or the second opening surface.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: October 11, 2022
    Assignees: SAMSUNG ELECTRONICS CO., LTD., POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Jung Yub Lee, Jun Ho Park, Doo Seok Choi, Won Bin Hong, Young Ju Lee
  • Publication number: 20220320715
    Abstract: A wireless communication device includes at least one antenna configured to transmit or receive a signal, and a frequency selection surface arranged adjacent to the at least one antenna and configured to diffract the signal generated from the at least one antenna, wherein the frequency selection surface includes a transparent substrate on which a plurality of unit cells are defined, and a plurality of conductive patterns arranged in the plurality of unit cells, respectively.
    Type: Application
    Filed: July 1, 2020
    Publication date: October 6, 2022
    Inventors: Won-bin Hong, Byounggwan Kang, Young-no Yoon
  • Patent number: 11431095
    Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a first electrode layer disposed on a top surface of the dielectric layer, the first electrode layer including a radiation pattern, a second electrode layer disposed on a bottom surface of the dielectric layer, and a flexible circuit board connecting the first electrode layer and the second electrode layer with each other along a lateral portion of the dielectric layer. Efficiency of grounding and noise removing may be improved by the flexible circuit board.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: August 30, 2022
    Assignees: DONGWOO FINE-CHEM CO., LTD., KREEMO INC.
    Inventors: Yoon Ho Huh, Han Sub Ryu, Byung Jin Choi, Won Bin Hong
  • Patent number: 11424529
    Abstract: An antenna structure includes a dielectric layer, a radiation pattern on the dielectric layer and a signal pad on the dielectric layer. The signal pad includes a bonding region that is electrically connected to the radiation pattern and is configured to be bonded to an external circuit structure, and a margin region adjacent to the bonding region. Impedance mismatching is prevented by the margin region so that radiation efficiency is improved.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: August 23, 2022
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Han Sub Ryu, Yun Seok Oh, Young Jun Lee, Won Bin Hong