Abstract: A display device in one example includes a display panel, a supporting frame supporting the display panel, and an adhesive between the display panel and the supporting frame. The supporting frame includes a case, and a thermal shape changing part constituting a portion of the case. The thermal shape changing part includes a shape memory material.

Abstract: There is further provided a transparent adhesive composition including a silicon acrylate monomer; a silanol compound; an alkoxy silane compound; and an optical initiator.

Abstract: A display device comprises a cover window including a first area of a curved shape and a second area of a flat shape and having a first end connected to the first area, wherein the first area has a plurality of first concave patterns at its inner surface; a display panel under the cover window; and an adhesive layer between the cover window and the display panel.

Abstract: A display device comprises a cover window including a first area of a curved shape and a second area of a flat shape and having a first end connected to the first area, wherein the first area has a plurality of first concave patterns at its inner surface; a display panel under the cover window; and an adhesive layer between the cover window and the display panel.

Abstract: A display device in one example includes a display panel, a supporting frame supporting the display panel, and an adhesive between the display panel and the supporting frame. The supporting frame includes a case, and a thermal shape changing part constituting a portion of the case. The thermal shape changing part includes a shape memory material.

Abstract: A display device can include: a display panel configured to include a first substrate and a second substrate, and a cover substrate disposed on the display panel and configured to contain a carbonate compound.

Abstract: There is further provided a transparent adhesive composition including a silicon acrylate monomer; a silanol compound; an alkoxy silane compound; and an optical initiator.

Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member, and a sub frame having a design of at least one color and disposed on the bezel area.

Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member and a sub frame disposed on the bezel area and combined with the main frame.

Abstract: A display device can include: a display panel configured to include a first substrate and a second substrate, and a cover substrate disposed on the display panel and configured to contain a carbonate compound.

Abstract: Disclosed are a flexible liquid crystal display (LCD) device and a method of manufacturing the same. The flexible LCD device comprises a first flexible substrate and a second flexible substrate. A layer is disposed on the first flexible substrate and first pixel control lines are disposed on the second flexible substrate. The LCD device also includes polymer walls disposed between the first flexible substrate and the second flexible substrate that maintain a cell gap between the first flexible substrate and the second flexible substrate. The polymer walls are substantially aligned with the first pixel control lines and light transparent gaps in the layer disposed on the first flexible substrate.

Abstract: Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).

Abstract: Disclosed are a flexible liquid crystal display (LCD) device and a method of manufacturing the same. The flexible LCD device comprises a first flexible substrate and a second flexible substrate. A layer is disposed on the first flexible substrate and first pixel control lines are disposed on the second flexible substrate. The LCD device also includes polymer walls disposed between the first flexible substrate and the second flexible substrate that maintain a cell gap between the first flexible substrate and the second flexible substrate. The polymer walls are substantially aligned with the first pixel control lines and light transparent gaps in the layer disposed on the first flexible substrate.

Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member and a sub frame disposed on the bezel area and combined with the main frame.

Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member, and a sub frame having a design of at least one color and disposed on the bezel area.

Abstract: Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).

Abstract: A device isolation film in a semiconductor device and a method for forming the same are provided. The method includes etching a middle portion of a device isolation film having a deposition structure including a Spin-On-Dielectric (SOD) oxide film and a High Density Plasma (HDP) oxide film to form a hole and filling an upper portion of the hole with an oxide film having poor step coverage characteristics to form a second hole extending along the middle portion of the device isolation film. The second hole serves as a buffer for stress generated at the interface between an oxide film, which can be a device isolation film, and a silicon layer, which can be a semiconductor substrate, thereby increasing the operating current of a transistor and improving the electrical characteristics of the resulting device.

Abstract: A device isolation film in a semiconductor device and a method for forming the same are provided. The method includes etching a middle portion of a device isolation film having a deposition structure including a Spin-On-Dielectric (SOD) oxide film and a High Density Plasma (HDP) oxide film to form a hole and filling an upper portion of the hole with an oxide film having poor step coverage characteristics to form a second hole extending along the middle portion of the device isolation film. The second hole serves as a buffer for stress generated at the interface between an oxide film, which can be a device isolation film, and a silicon layer, which can be a semiconductor substrate, thereby increasing the operating current of a transistor and improving the electrical characteristics of the resulting device.

Abstract: This invention provides novel epoxy-polyimide composites and process for producing the same which has excellent thermal stability and mechanical properties whereby soluble reactive polyimide containing hydroxyl functional group were used as a curing agent. The novel epoxy-polyimide composites, which is polymerized by reacting epoxy resin and polyimide during curing process, can be widely used as insulating intermediate layer in integrated circuits and electronic circuit encapsulants. The invention also provides an epoxy resin/polyimide composition comprising an epoxy resin and a polyimide.