Abstract: Disclosed are a source driver and a method of detecting crack of a display panel. A source driver may comprise a first circuit configured to apply first data to data lines connected to sub-pixels of a display panel to charge a first driving voltage; and a second circuit formed on the display panel that applies the first driving voltage to a detection line formed on the display panel to detect the presence of cracks in the display panel based on the illumination status of the sub-pixels, wherein the detection line includes a first detection node and a second detection node formed on one side of the display panel along its extension direction, wherein the first detection node is connected to data lines of the first and third sub-pixels, and wherein the second detection node is connected to data line of the second sub-pixel.

Abstract: A battery mounted semiconductor device is provided. A battery mounted semiconductor device comprises a semiconductor silicon wafer, an electric power supply formed on a backside of the semiconductor silicon wafer and a circuit pattern formed on a front side of the semiconductor silicon wafer.

Abstract: A battery mounted semiconductor device is provided. A battery mounted semiconductor device comprises a semiconductor silicon wafer, an electric power supply formed on a backside of the semiconductor silicon wafer and a circuit pattern formed on a front side of the semiconductor silicon wafer.

Abstract: Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has been left unused, the semiconductor chip can have a self-supplied power, realizing the self-powered semiconductor chip with an increased efficiency. Further, since the electric power supply is installed on the wafer, not the semiconductor chip, the fabrication procedure becomes very simple, and the battery can be mounted on any type of chip.

Abstract: Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has been left unused, the semiconductor chip can have a self-supplied power, realizing the self-powered semiconductor chip with an increased efficiency. Further, since the electric power supply is installed on the wafer, not the semiconductor chip, the fabrication procedure becomes very simple, and the battery can be mounted on any type of chip.