Abstract: A backlight unit may be provided that includes a substrate, light sources, a light guide plate, at least one reflecting member, and an optical sheet. The light sources may be on the substrate. The light guide plate may include a light incident part having a light incident surface to which streaks of light respectively emitted from the light sources are laterally incident, and a light emitting part emitting the incident streaks of light upward. The reflecting member may be disposed on a lower surface of the light guide plate, and may reflect the incident light. The optical sheet may be disposed above the light guide plate. The reflecting member may include a first region having a first reflectance and a second region having a second reflectance.

Abstract: A router connects an Internet protocol (IP)-ubiquitous sensor network (USN) with an external network. The IP-USN is disclosed when the IP-USN includes one or more routers. An IP-USN with multiple routers includes one or more routers, and sensor nodes in the IP-USN may reliably communicate with the external network. The sensor nodes in the IP-USN may communicate with one another using the router if necessary. When one router does not operate, communication with the external network is performed by using other routers.

Abstract: Disclosed is an acoustic signal detector for detecting a target with moving in water. The acoustic signal detector may include a body having a front portion, the front portion having a cross section which becomes gradually narrow and an end formed to have a plane. The plane may be perpendicular to a moving direction of the acoustic signal detector. The acoustic signal detector may further include a plurality of sensor arrays configured to generate sound and detect sound returned by being reflected by a target. The plurality of sensor arrays may be mounted on a side surface of the front portion and on the plane.

Abstract: A surface light source includes a plate type light source body having a sealed discharging space formed therein, a plate type electrode unit having a plurality of regions adjacent to at least one major surface of the light source body, and a multiple voltage applying unit operable to apply voltages independently to each of the plurality of regions. In this way, brightness of the surface light source can be controlled independently in each of the plurality of regions and a local dimming for a surface light source can be realized.

Abstract: The present invention relates to a liquid crystal display device in which the light sources of a backlight unit are independently driven as a plurality of separate regions, and to a drive method for the same. In situations where there is a substantial variation in the brightness (luminance) of regions being displayed on the liquid crystal display device, the present invention can improve the visibility of boundaries due to differences in luminance in images displayed within the regions of the backlight unit emitting light at different levels of luminance as a result.

Abstract: A backlight unit may be provided that includes a substrate, light sources, a light guide plate, at least one reflecting member, and an optical sheet. The light sources may be on the substrate. The light guide plate may include a light incident part having a light incident surface to which streaks of light respectively emitted from the light sources are laterally incident, and a light emitting part emitting the incident streaks of light upward. The reflecting member may be disposed on a lower surface of the light guide plate, and may reflect the incident light. The optical sheet may be disposed above the light guide plate. The reflecting member may include a first region having a first reflectance and a second region having a second reflectance.

Abstract: A back-light unit including a plurality of substrates, a plurality of light sources respectively disposed on the plurality of substrates and configured to emit light, and N (N?2) light guide panels respectively disposed adjacent to the plurality of light sources, a corresponding light guide panel including a light incidence part having a light incidence surface for receiving light emitted from a corresponding light source, and a light emission part for emitting the received incident light. Further, the corresponding light guide panel includes protruding surface patterns protruding from an upper surface the light emission part.

Abstract: A backlight unit includes a plurality of light sources emitting light in a direct direction with a predetermined orientation angle, and a light guide panel having a light incident section and a light emitting section. The light incident section has a first surface to receive light emitted from one or more of the light sources in the first direction and the light emitting section is to emit light received from the light incident section in a second direction. In addition, a height of an elevated structure, extending from an upper surface of the light incident section to an upper surface of the light emitting section, is greater than or substantially equal to a height of a distal end of the light emitting section.

Abstract: An optical assembly includes a plurality of light sources emitting light in a first direction at a predetermined orientation angle, and a light guide panel having a light incident section and a light emitting section. The light incident section has a first surface to receive the light emitted from the light sources in the first direction and the light emitting section is to emit light received from the light incident section in a second direction. Also included is at least one cover having a first surface adjacent the light sources and a second surface adjacent at least one portion of the light emitting section.

Abstract: A back-light unit including a plurality of substrates, a plurality of light sources respectively disposed on the plurality of substrates and configured to emit light, and N (N ?2) light guide plates respectively disposed adjacent to the plurality of light sources, each light guide plate including a light incidence part having a light incidence surface for receiving light emitted in a first direction from a corresponding light source, and a light emission part for emitting the received incident light in a second direction different than the first direction. Further, at least one of the light guide plates includes light-extracting surface patterns disposed on the light emission part, and the light-extracting surface patterns comprise a first region of light-extracting surface patterns having a higher pattern-density than a second region of light-extracting surface patterns next to the first region.

Abstract: A distributed video decoder and a distributed video decoding method are provided. The distributed video decoder includes a key picture decoding unit which reconstructs a key picture received from an encoder, a hash information selecting unit which determines necessary hash information using the reconstructed key picture and/or generated previous side information, and a side information generating unit which generates side information using the reconstructed key picture and/or hash information selected based on information determined by the hash information selecting unit. The distributed video decoder further includes a channel code decoding unit which estimates a quantized value by using a parity bit received from the encoder and the generated side information, and a video reconstructing unit which reconstructs a current picture as a decoding target by using the quantized value estimated by the channel code decoding unit and the generated side information.

Abstract: A router connects an Internet protocol (IP)-ubiquitous sensor network (USN) with an external network. The IP-USN is disclosed when the IP-USN includes one or more routers. An IP-USN with multiple routers includes one or more routers, and sensor nodes in the IP-USN may reliably communicate with the external network. The sensor nodes in the IP-USN may communicate with one another using the router if necessary. When one router does not operate, communication with the external network is performed by using other routers.

Abstract: A semiconductor package includes a semiconductor die having a plurality of bond pads, a first protective layer formed at the periphery of the bond pads of the semiconductor die, UBM (Under Bump Metals) formed at the bond pads of the semiconductor die, a plurality of solder balls wetted to the UBM, and a second protective layer formed at the periphery of the solder balls. The second protective layer includes a thick collar, which is formed from the surface of the solder ball toward its periphery, so that the joint force of the solder ball can be more improved. Further, the second protective layer protects the surface of the wafer from the external environment, and absorbs and alleviates the external stress.

Abstract: A multi-function electronic fishing float having an identification number automatically generates radio frequency (RF) signals, if a fish takes bait or is hooked. The generated RF signal is sent to a receiver, and an angler can clearly identify a sign of a fish's bite or hooking through sound, vibration, or light generated by the receiver, without checking the float with eyes. A transmitter sending RF signals corresponding to the fish's bite or hooking is installed in the electronic fishing float that partially comes up above the water surface by buoyancy, and the transmitted RF signals are received by the receiver outputting sound, vibration, and light as information on the fish's bite or hooking.

Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

Abstract: The present invention provides transgenic plants and plant cells thereof which have been transformed with the soybean calmodulin isoform (SCaM5) gene to exhibit greatly enhanced resistance to a wide spectrum of plant pathogens. The present invention also provides the expression vector containing SCaM5 gene and to host cells into which the gene in the expression vector has been introduced to plant pathogens-resistant plants. Transgenic plants expressing a heterologous SCaM5 gene show increased resistance to fungi, bacteria and viruses which normally infect the plants.