Patents by Inventor Won-Dong Hwang Bo

Won-Dong Hwang Bo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pad structure of semiconductor package
    Patent number: 6807730
    Abstract: A pad structure for a semiconductor package is provided by forming solder lands at predetermined locations on a printed circuit board. First circular pad portions are formed protruding laterally from upper surfaces of the solder lands. Second circular pad portions are formed protruding laterally from other lateral sides of the pads. The leads are secured to the pads of the semiconductor package so that, when the first and second circular pad portions are pushed laterally, the circular pad portions do not contact each other, thereby preventing short circuits.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: October 26, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Won-Dong Hwang Bo
  • Pad structure of semiconductor package
    Publication number: 20030132026
    Abstract: A pad structure for semiconductor package. A printed circuit board with solder lands formed on predetermined locations are provided. First circular pad portions are formed protruding laterally on upper surfaces of the solder lands. Second circular pad portions are formed protruding laterally from other lateral sides of the pads. The leads are secured to the pads of the semiconductor package so that when the first and second circular pad portions are pushed laterally, the circular pad portions do not contact each other, preventing short circuits.
    Type: Application
    Filed: March 18, 2003
    Publication date: July 17, 2003
    Inventor: Won-Dong Hwang Bo
  • Pad structure of semiconductor package
    Patent number: 6570100
    Abstract: A pad structure for semiconductor package. A printed circuit board with solder lands formed on predetermined locations are provided. First circular pad portions are formed protruding laterally on upper surfaces of the solder lands. Second circular pad portions are formed protruding laterally from other lateral sides of the pads. The leads are secured to the pads of the semiconductor package so that when the first and second circular pad portions are pushed laterally, the circular pad portions do not contact each other, preventing short circuits.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: May 27, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Won-Dong Hwang Bo