Patents by Inventor Won Geol Lee

Won Geol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing thereof
    Patent number: 11848310
    Abstract: Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: December 19, 2023
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Won Geol Lee, Won Chul Do, Ji Hun Yi
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
    Publication number: 20220068889
    Abstract: Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
    Type: Application
    Filed: August 2, 2021
    Publication date: March 3, 2022
    Inventors: Won Geol Lee, Won Chul Do, Ji Hun Yi
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20220045037
    Abstract: In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.
    Type: Application
    Filed: October 26, 2021
    Publication date: February 10, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: In Su Mok, Won Geol Lee, Il Bok Lee, Won Myoung Ki
  • Semiconductor device and method of manufacturing a semiconductor device
    Patent number: 11158615
    Abstract: In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: October 26, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: In Su Mok, Won Geol Lee, Il Bok Lee, Won Myoung Ki
  • Semiconductor device and method of manufacturing thereof
    Patent number: 11081470
    Abstract: Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: August 3, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Geol Lee, Won Chul Do, Ji Hun Yi
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20200381404
    Abstract: In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.
    Type: Application
    Filed: May 28, 2019
    Publication date: December 3, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: In Su Mok, Won Geol Lee, Il Bok Lee, Won Myoung Ki
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
    Publication number: 20200219849
    Abstract: Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
    Type: Application
    Filed: November 11, 2019
    Publication date: July 9, 2020
    Inventors: Won Geol Lee, Won Chul Do, Ji Hun Yi
  • Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof
    Patent number: 10475770
    Abstract: Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: November 12, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Won Geol Lee, Won Chul Do, Ji Hun Yi
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
    Publication number: 20180247916
    Abstract: Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
    Type: Application
    Filed: February 28, 2017
    Publication date: August 30, 2018
    Inventors: Won Geol Lee, Won Chul Do, Ji Hun Yi