Abstract: A display device including a display panel for displaying an image on a front surface of the display panel; a touch sensing unit provided on the display panel to sense a touch; an insulating film covering the touch sensing unit; a first circuit board of which one end is connected to the touch sensing unit; and a polarizing layer covering the touch sensing unit and a portion of the first circuit board.

Abstract: A display device including a display panel for displaying an image on a front surface of the display panel; a touch sensing unit provided on the display panel to sense a touch; an insulating film covering the touch sensing unit; a first circuit board of which one end is connected to the touch sensing unit; and a polarizing layer covering the touch sensing unit and a portion of the first circuit board.

Abstract: A display device including a display panel for displaying an image on a front surface of the display panel; a touch sensing unit provided on the display panel to sense a touch; an insulating film covering the touch sensing unit; a first circuit board of which one end is connected to the touch sensing unit; and a polarizing layer covering the touch sensing unit and a portion of the first circuit board.

Abstract: A display device includes a first substrate, a flexible printed circuit, and a film. The flexible printed circuit is disposed on a first area of the first substrate. The film is disposed on the first substrate and the flexible printed circuit. The flexible printed circuit includes a second substrate, a pad area, and a dummy pad. The pad area comprises pads disposed on the second substrate. The pads extend in a first direction and are spaced apart from one another in a second direction crossing the first direction. The dummy pad is disposed on the second substrate. The dummy pad is spaced apart from the pad area.

Abstract: A display device including a display panel for displaying an image on a front surface of the display panel; a touch sensing unit provided on the display panel to sense a touch; an insulating film covering the touch sensing unit; a first circuit board of which one end is connected to the touch sensing unit; and a polarizing layer covering the touch sensing unit and a portion of the first circuit board.

Abstract: A display device including a first film, a flexible printed circuit, and a second film. The first film includes a substrate and a non-adhesive pattern, where the substrate includes a first area and a second area adjacent to the first area, and the non-adhesive pattern is formed on at least a portion of the second area. The flexible printed circuit is disposed on the first area of the first film. The second film is disposed on the flexible printed circuit and the first film.

Abstract: A display device including a first film, a flexible printed circuit, and a second film. The first film includes a substrate and a non-adhesive pattern, where the substrate includes a first area and a second area adjacent to the first area, and the non-adhesive pattern is formed on at least a portion of the second area. The flexible printed circuit is disposed on the first area of the first film. The second film is disposed on the flexible printed circuit and the first film.

Abstract: A display device includes a first substrate, a flexible printed circuit, and a film. The flexible printed circuit is disposed on a first area of the first substrate. The film is disposed on the first substrate and the flexible printed circuit. The flexible printed circuit includes a second substrate, a pad area, and a dummy pad. The pad area comprises pads disposed on the second substrate. The pads extend in a first direction and are spaced apart from one another in a second direction crossing the first direction. The dummy pad is disposed on the second substrate. The dummy pad is spaced apart from the pad area.

Abstract: A display device including a display panel for displaying an image on a front surface of the display panel; a touch sensing unit provided on the display panel to sense a touch; an insulating film covering the touch sensing unit; a first circuit board of which one end is connected to the touch sensing unit; and a polarizing layer covering the touch sensing unit and a portion of the first circuit board.

Abstract: A substrate of an electronic device may include a first test region and a second test region to measure resistance at a connection portion. The first test region and the second test region each includes a plurality of measuring pad portions, a protective layer disposed on the plurality of measuring pad portions, and a contact assistance member disposed on the protective layer. The protective layer in the first test region includes a first contact hole exposing the plurality of measuring pad portions. The contact assistance member in the first test region contacts the measuring pad portion exposed through the first contact hole. The protective layer in the second test region includes two second contact holes exposing one measuring pad portion, and the contact assistance member in the second test region contacts the one measuring pad portion through the two second contact holes.

Abstract: A display device according to an exemplary embodiment of the present invention includes: a display panel displaying an image; a window disposed on a first surface of the display panel; a first cover film disposed on a second surface of the display panel; a flexible printed circuit (FPC) disposed under the first cover film; a flexible printed circuit film connecting the display panel and the flexible printed circuit (FPC); and a second cover film disposed under the first cover film and the flexible printed circuit film. The second cover film and the flexible printed circuit film are adhered by an adhesive.

Abstract: A substrate of an electronic device may include a first test region and a second test region to measure resistance at a connection portion. The first test region and the second test region each comprise a plurality of measuring pad portions, a protective layer disposed on the plurality of measuring pad portions, and a contact assistance member disposed on the protective layer. The protective layer in the first test region comprises a first contact hole exposing the plurality of measuring pad portions. The contact assistance member in the first test region contacts the measuring pad portion exposed through the first contact hole. The protective layer in the second test region comprises two second contact holes exposing one measuring pad portion, and the contact assistance member in the second test region contacts the one measuring pad portion through the two second contact holes.

Abstract: Display device and method for fabricating a display device comprising a display panel displaying an image, a window positioned opposite to the display panel, and an adhesive layer interposed between the display panel and the window, wherein the adhesive layer includes a first adhesive layer formed on the window, and a second adhesive layer formed on the first adhesive layer and made of a different material from the first adhesive layer.

Abstract: A semiconductor chip and manufacturing method thereof, the semiconductor chip including a plurality of bumps connected to a driving circuit integrated on a semiconductor substrate and an organic insulating layer disposed on the driving circuit. The organic insulating layer extends from the semiconductor substrate less than the plurality of bumps such that a lower edge of the plurality of bumps protrudes further than a lower edge of the organic insulating layer.

Abstract: A display device includes a display panel, a driving chip, and a non-conductive adhesive film. The display panel includes a pad member having a plurality of conductive pads. The driving chip includes a body and a plurality of bumps. The body has a driving circuit. The bumps are protruded from the body to make contact with the pads, respectively. The non-conductive adhesive film fixes the driving chip to the pad member. Therefore, a manufacturing cost is decreased, and a yield is increased.

Abstract: A bonding method of a flexible film is provided, which includes: positioning an anisotropic conductive film on a plurality of first signal lines formed on the flexible film to be bonded to a thin film transistor (TFT) panel; arranging the anisotropic conductive film on the TFT panel to align the first signal lines formed on the flexible film and a plurality of second signal lines formed on the TFT panel; positioning at least one portion of a protection film for protecting the second signal lines of the flexible film to be overlapped with the TFT panel; and pressing the flexible film and the TFT panel.

Abstract: In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

Abstract: In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

Abstract: A display device includes a display panel, a driving chip, and a non-conductive adhesive film. The display panel includes a pad member having a plurality of conductive pads. The driving chip includes a body and a plurality of bumps. The body has a driving circuit. The bumps are protruded from the body to make contact with the pads, respectively. The non-conductive adhesive film fixes the driving chip to the pad member. Therefore, a manufacturing cost is decreased, and a yield is increased.

Abstract: A bonding method of a flexible film is provided, which includes: positioning an anisotropic conductive film on a plurality of first signal lines formed on the flexible film to be bonded to a thin film transistor (TFT) panel; arranging the anisotropic conductive film on the TFT panel to align the first signal lines formed on the flexible film and a plurality of second signal lines formed on the TFT panel; positioning at least one portion of a protection film for protecting the second signal lines of the flexible film to be overlapped with the TFT panel; and pressing the flexible film and the TFT panel.