Abstract: A transparent conductor according to an exemplary embodiment of the present invention includes a transparent substrate, and a transparent conductive pattern formed on the transparent substrate, and the transparent conductor includes a nanostructure on an upper surface of at least one of the transparent substrate and the transparent conductive pattern.

Abstract: The present disclosure relates to an anti-pinch control system. The anti-pinch control system includes a motor configured to generate driving force for moving a seat of a vehicle, a current measurement sensor configured to measure a value of the current generated by the motor, a database unit configured to store the values of current measured by the current measurement sensor, and a controller configured to vary an anti-pinch value of the seat based on an average of a plurality of values of current measured every preset measurement period for a predetermined time, stored in the database unit, wherein the plurality of values of current is values of current measured before the predetermined time based on a current time.

Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: An apparatus for measuring a concentration of a target gas includes: a gas sensor including a sensing layer having an electric resistance that changes by an oxidation reaction or a reduction reaction between gas molecules and the sensing layer; and a processor configured to, in response to the target gas being introduced along with air into the gas sensor, monitor a change of the electric resistance of the sensing layer and determine the concentration of the target gas by analyzing a shape of the change of the electric resistance.

Abstract: The present invention provides a device for measuring biological information including a sensor array, wherein the sensor array includes a plurality of sensors that are either sensors for amplifying photoreactivity or sensors forming an island network connected by a plurality of multi-channels and, in the device, the average value of biological information about the skin tissues is measured based on values output from the sensor array, and a method of measuring biological information using the device.

Abstract: The present disclosure relates to an anti-pinch control system. The anti-pinch control system includes a motor configured to generate driving force for moving a seat of a vehicle, a pressure sensor configured to detect a pressure applied to the seat, a current measurement sensor configured to measure an amount of current generated by the motor, a database unit configured to store data on an amount of current required to drive the seat that corresponds to the pressure detected by the pressure sensor, and a controller configured to vary an anti-pinch value of the seat based on data corresponding to the pressure applied to the seat.

Abstract: The present disclosure relates to an anti-pinch control system. The anti-pinch control system includes a motor configured to generate driving force for moving a seat of a vehicle, a current measurement sensor configured to measure a value of the current generated by the motor, a database unit configured to store the values of current measured by the current measurement sensor, and a controller configured to vary an anti-pinch value of the seat based on an average of a plurality of values of current measured every preset measurement period for a predetermined time, stored in the database unit, wherein the plurality of values of current is values of current measured before the predetermined time based on a current time.

Abstract: The present disclosure relates to an anti-pinch control system. The anti-pinch control system includes a motor configured to generate driving force for moving a seat of a vehicle, a pressure sensor configured to detect a pressure applied to the seat, a current measurement sensor configured to measure an amount of current generated by the motor, a database unit configured to store data on an amount of current required to drive the seat that corresponds to the pressure detected by the pressure sensor, and a controller configured to vary an anti-pinch value of the seat based on data corresponding to the pressure applied to the seat.

Abstract: Disclosed is an adsorptive ball for recovering precious metals and resources, a method for manufacturing the adsorptive bale, a flow through-continuous deionization (FT-CDI) module capable of recovering precious metals by using the adsorptive ball, and a flow through-continuous deionization (FT-CDI) apparatus having the flow through-continuous deionization (FT-CDI) installed thereat.

Abstract: A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.

Abstract: A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

Abstract: A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.

Abstract: Disclosed is an adsorptive ball for recovering precious metals and resources, a method for manufacturing the adsorptive bale, a flow through-continuous deionization (FT-CDI) module capable of recovering precious metals by using the adsorptive ball, and a flow through-continuous deionization (FT-CDI) apparatus having the flow through-continuous deionization (FT-CDI) installed thereat.

Abstract: There is provided a method of fabricating a lithography mask, the method including: forming a transparent polymer layer on a surface of a first substrate where a convex-concave pattern is formed; separating the transparent polymer layer from the first substrate, the transparent polymer layer having a convex-concave surface formed by the convex-concave pattern of the first substrate transferred thereonto; depositing a metal thin film on the convex-concave surface; forming a viscous film on a second substrate; disposing the transparent polymer layer on the second substrate such that the viscous film and metal thin film are partially bonded together; and separating the transparent polymer layer from the second substrate such that a portion of the metal thin film bonded to the viscous film is removed, wherein a metal thin film pattern having the portion of the metal thin film removed therefrom is formed on the convex-concave surface.

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

Abstract: A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

Abstract: A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

Abstract: A light emitting diode package according to an aspect of the invention may include: a body receiving a light emitting diode; a lead electrically connected to the light emitting diode; and an adapter receiving a modified electrode electrically connected to the lead so that the polarity of the modified electrode is changed into the polarity of the lead, the adapter in which the body is received and fixed.

Abstract: A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface. The first and second lead frames are formed at the package body to be exposed to the bottom of the concave portion. The light emitting diode chip is mounted on the bottom of the concave portion to be electrically connected to each of the first and second lead frames. The resin covering portion is formed in the concave portion to enclose the light emitting diode chip.