Abstract: A semiconductor device comprises a plurality of gate lines composed of line shapes to function as gate electrodes in a plurality of transistors and separated from a substrate by a gate insulating layer, each having an upper metal silicide layer; and a plurality of source/drain regions formed on the substrate between said gate lines solely by carrying out impurity implantation processes.

Abstract: A method according to some embodiments of the invention includes sequentially forming first and second conductive layers, patterning the second conductive layer to form second conductive patterns, and forming a mask pattern connecting the second conductive patterns. Using the mask pattern and the second conductive patterns as an etching mask, the first conductive layer is etched to form a first conductive pattern electrically connecting the second conductive patterns. Before the second conductive layer is formed, a gate interlayer insulating layer including at least two openings exposing a top surface of the first conductive layer may be formed. The second conductive patterns are in contact with top surfaces of the first conductive pattern. During formation of the second conductive patterns, a dummy pattern may be formed on the gate interlayer insulating layer and spaced apart from the second conductive patterns.

Abstract: A semiconductor device comprises a plurality of gate lines composed of line shapes to function as gate electrodes in a plurality of transistors and separated from a substrate by a gate insulating layer, each having an upper metal silicide layer; and a plurality of source/drain regions formed on the substrate between said gate lines solely by carrying out impurity implantation processes.

Abstract: A semiconductor device comprises a plurality of gate lines composed of line shapes to function as gate electrodes in a plurality of transistors and separated from a substrate by a gate insulating layer, each having an upper metal silicide layer; and a plurality of source/drain regions formed on the substrate between said gate lines solely by carrying out impurity implantation processes.

Abstract: A non-volatile memory cell array having second floating gates with a narrow width, a large height, and slanted side walls. Critical dimension errors due to photolithographic and etching processes are decreased. The difference in the coupling ratio between the memory cells is low thereby improving speed during programming and/or erasing. A second floating gate having a narrower critical dimension than a second floating gate obtained using a photolithographic process may be designed, thereby forming a highly integrated non-volatile memory cell array.

Abstract: Provided are a non-volatile flash memory device and a method of making the non-volatile flash memory device. A common source line is formed simultaneously with the formation of stacked transistors. The common source line is formed of the same material layer as floating gate pattern. The common source region and a scribe line region are simultaneously formed thorough the same photolithography process in a semiconductor substrate. Additionally, the common source line and butted contact are patterned simultaneously through the same photolithography process. Accordingly, the common source line process can be advantageously completed with very low cost and simplicity.

Abstract: A semiconductor device comprises a plurality of gate lines composed of line shapes to function as gate electrodes in a plurality of transistors and separated from a substrate by a gate insulating layer, each having an upper metal silicide layer; and a plurality of source/drain regions formed on the substrate between said gate lines solely by carrying out impurity implantation processes.

Abstract: A non-volatile memory cell array having second floating gates with a narrow width, a large height, and slanted side walls. Critical dimension errors due to photolithographic and etching processes are decreased. The difference in the coupling ratio between the memory cells is low thereby improving speed during programming and/or erasing. A second floating gate having a narrower critical dimension than a second floating gate obtained using a photolithographic process may be designed, thereby forming a highly integrated non-volatile memory cell array.

Abstract: Provided are a non-volatile flash memory device and a method of making the non-volatile flash memory device. A common source line is formed simultaneously with the formation of stacked transistors. The common source line is formed of the same material layer as floating gate pattern. The common source region and a scribe line region are simultaneously formed thorough the same photolithography process in a semiconductor substrate. Additionally, the common source line and butted contact are patterned simultaneously through the same photolithography process. Accordingly, the common source line process can be advantageously completed with very low cost and simplicity.

Abstract: Provided are a non-volatile flash memory device and a method of making the non-volatile flash memory device. A common source line is formed simultaneously with the formation of stacked transistors. The common source line is formed of the same material layer as floating gate pattern. The common source region and a scribe line region are simultaneously formed thorough the same photolithography process in a semiconductor substrate. Additionally, the common source line and butted contact are patterned simultaneously through the same photolithography process. Accordingly, the common source line process can be advantageously completed with very low cost and simplicity.