Patents by Inventor Won Hun KIM

Won Hun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240140195
    Abstract: The present disclosure relates to a transmission of an agricultural work vehicle, the transmission comprising: a pre-shift part for performing speed shifting on driving transmitted from an engine of an agricultural work vehicle; a clutch part connected to the pre-shift part so as to selectively output driving transmitted from the pre-shift part; an adjusting part connected to the clutch part so as to perform speed shifting on driving transmitted from the clutch part; and a subsequent shift part connected to the adjusting part so as to perform speed shifting on driving transmitted from the adjusting part.
    Type: Application
    Filed: December 21, 2023
    Publication date: May 2, 2024
    Inventors: Jung Su HAN, Ki Taeg LEE, Won Woo PARK, Ji Hun YU, Taek Seong KIM, Young-Gyu LEE
  • Publication number: 20240109858
    Abstract: The present invention relates to a compound capable of lowering the flammability of a non-aqueous electrolyte when included in the non-aqueous electrolyte and improving the life properties of a battery by forming an electrode-electrolyte interface which is stable at high temperatures and low in resistance, and relates to a compound represented by Formula I descried herein, a non-aqueous electrolyte solution and a lithium secondary battery both including the compound, n, m, Ak, and X are described herein.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 4, 2024
    Applicants: LG Chem, Ltd., LG Energy Solution, Ltd.
    Inventors: Jung Keun Kim, Su Jeong Kim, Mi Sook Lee, Won Kyun Lee, Duk Hun Jang, Jeong Ae Yoon, Kyoung Hoon Kim, Chul Haeng Lee, Mi Yeon Oh, Kil Sun Lee, Jung Min Lee, Esder Kang, Chan Woo Noh, Chul Eun Yeom
  • Patent number: 11948808
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 2, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Publication number: 20240100340
    Abstract: Provided is a device for relieving headache and pain caused by temporomandibular joint disorders may include: a body having a neck band surroundingly worn on a user's neck, first connectors extending forwardly from both ends of the neck band by first set lengths, and second connectors extending upwardly from front ends of the first connectors by second set lengths; first low frequency electrostimulators disposed on the second connectors and coming into close contact with the temporalis muscles, when the body is worn on the user's head, to apply low frequencies to the temporalis muscles; and second low frequency electrostimulators disposed on the connected portions between the first connectors and the second connectors and coming into close contact with the masseter muscles, when the body is worn on the user's head, to apply low frequencies to the masseter muscles.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Inventors: Tae Hun KIM, Won Sik BAE, Jae Hyeong OH, Dong Jin YOU
  • Publication number: 20240098880
    Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Jun Woo YANG
  • Publication number: 20240098885
    Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
  • Publication number: 20240098275
    Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 21, 2024
    Inventors: Je Chang JEONG, Ki Baek KIM, Won Jin LEE, Hye Jin SHIN, Jong Sang YOO, Jang Hyeok YUN, Kyung Jun LEE, Jae Hun KIM, Sang Gu LEE
  • Publication number: 20240088553
    Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Bae Mook JEONG, Kyo Sung JI, Chi Back RYU, Won Jun PARK, Jun Woo YANG, Seong Min AHN, Ki Hun PARK, Jae Eun KIM
  • Patent number: 11435918
    Abstract: Provided is a module mounted in a server to share a block-level storage and resources. The module includes: a HBA card unit for connection to an external server; an internal disk unit providing a storage space inside a server; a setting unit allocating the storage space of the internal disk unit; a target driver unit implementing a SCSI protocol, communicating with the external server and setting volumes to a storage mode or a server mode; and a target core unit routing data of the internal disk unit and the target driver unit depending on the storage mode or the server mode. The storage mode allows the volumes to be used as a storage of the external server. The server mode allows the volumes to be used as a storage inside the server. The target driver unit can switch the volumes from the server mode to the storage mode.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: September 6, 2022
    Assignee: NCLOUD CO., LTD
    Inventors: Dong Soo Lee, Won Hun Kim
  • Publication number: 20210311630
    Abstract: Provided is a module mounted in a server to share a block-level storage and resources. The module includes: a HBA card unit for connection to an external server; an internal disk unit providing a storage space inside a server; a setting unit allocating the storage space of the internal disk unit; a target driver unit implementing a SCSI protocol, communicating with the external server and setting volumes to a storage mode or a server mode; and a target core unit routing data of the internal disk unit and the target driver unit depending on the storage mode or the server mode. The storage mode allows the volumes to be used as a storage of the external server. The server mode allows the volumes to be used as a storage inside the server. The target driver unit can switch the volumes from the server mode to the storage mode.
    Type: Application
    Filed: October 30, 2020
    Publication date: October 7, 2021
    Inventors: Dong Soo LEE, Won Hun KIM