Abstract: A composition for stably preparing a hollow particle by a coacervation method, a hollow particle prepared using a composition for preparing a hollow particle, and a method of preparing a hollow particle are disclosed. A mono-disperse hollow particle is stably provided by excellent coacervate forming capability, such that it is expected to be beneficially used as a carrier in various fields such as a cosmetic, a paint, plastic, rubber, a synthetic wood, a refractory material, and an agricultural chemical.

Abstract: A composition for stably preparing a hollow particle by a coacervation method, a hollow particle prepared using a composition for preparing a hollow particle, and a method of preparing a hollow particle are disclosed. A mono-disperse hollow particle is stably provided by excellent coacervate forming capability, such that it is expected to be beneficially used as a carrier in various fields such as a cosmetic, a paint, plastic, rubber, a synthetic wood, a refractory material, and an agricultural chemical.

Abstract: Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate.

Abstract: Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate.