Patents by Inventor Wonil Kim
Wonil Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240404955Abstract: A semiconductor package includes a redistribution structure, a lower semiconductor device arranged on the redistribution structure and including first through electrodes each having a first horizontal width, a connecting substrate arranged on the redistribution structure and spaced apart from the lower semiconductor device in a horizontal direction and including second through electrodes each having a second horizontal width greater than the first horizontal width, a first molding layer arranged on the redistribution structure and surrounding a side surface of the lower semiconductor device and a side surface of the connecting substrate, and an upper semiconductor device arranged on the lower semiconductor device and the connecting substrate, the upper semiconductor device electrically connected to the first and second through electrodes.Type: ApplicationFiled: August 12, 2024Publication date: December 5, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sunkyoung SEO, Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee, Sanguk Han
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Patent number: 12153016Abstract: A detection device includes a transfer device to travel along a rail while gripping a carrier, and a detection structure mounted on the carrier. The detection structure includes a collector to suck in air, a detector connected to the collector, the detector including a plurality of sensors, a plurality of sensor control boards receiving electrical signals from the plurality of sensors, the plurality of sensor control boards generating, based on the electrical signals, type data and concentration data regarding pollutants included in the air sucked in by the collector, and a communication control board connected to the plurality of sensor control boards.Type: GrantFiled: October 12, 2021Date of Patent: November 26, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dusik Bae, Euihyun Roh, Sangyoon Shin, Yongjun Ahn, Youngwook Kim, Mira Park, Hyunwoo Lee, Jeonghun Lim, Wonil Choi, Sojung Park, Jiwoong Shin, Sangkyung Lee, Dongchol Choi
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Patent number: 12148228Abstract: Certain aspects of the present disclosure are generally directed to apparatus and techniques for event state detection. One example method generally includes receiving a plurality of sensor signals at a computing device, determining, at the computing device, probabilities of sub-event states based on the plurality of sensor signals using an artificial neural network for each of a plurality of time intervals, and detecting, at the computing device, the event state based on the probabilities of the sub-event states via a state sequence model.Type: GrantFiled: October 8, 2019Date of Patent: November 19, 2024Assignee: QUALCOMM IncorporatedInventors: Mingu Lee, Wonil Chang, Yeonseok Kim, Kyu Woong Hwang, Yin Huang, Ruowei Wang, Haijun Zhao, Janghoon Cho
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Patent number: 12140547Abstract: The present disclosure relates to a surface-enhanced Raman spectroscopy complex probe capable of effectively detecting a catecholamine compound even at extremely low concentrations. The complex probe includes a nanolaminate including a nanogap and metal nanoparticles. In this case, the nanolaminate and the metal nanoparticles are modified to a compound that may be bound to each functional group included in catecholamine, and thus, catecholamine included in an analyte is doubly recognized by the complex probe. In addition, since a hotspot emitting a strong SERS signal is formed by a nanogap included in a nanolaminate, it is possible to effectively detect a catecholamine compound even at extremely low concentrations.Type: GrantFiled: January 28, 2022Date of Patent: November 12, 2024Assignees: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE, VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Eun-Ah You, Zhou Wei, Wonil Nam, Wansun Kim
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Patent number: 12087696Abstract: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.Type: GrantFiled: January 11, 2023Date of Patent: September 10, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sunkyoung Seo, Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee, Sanguk Han
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Patent number: 12080691Abstract: A semiconductor device including an interposer including a central region and an edge region entirely surrounding the central region, wherein the interposer includes a wiring structure disposed in the first region and a metal structure disposed continuously within the entirety of the second region, a first semiconductor chip mounted in the central region and connected to the wiring structure, and a second semiconductor chip mounted in the central region adjacent to the first semiconductor chip and connected to the second wiring structure.Type: GrantFiled: January 26, 2022Date of Patent: September 3, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Sungwoo Park, Heonwoo Kim, Sangcheon Park, Wonil Lee
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Publication number: 20240274553Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.Type: ApplicationFiled: April 23, 2024Publication date: August 15, 2024Inventors: Yukyung Park, Ungcheon Kim, Wonil Lee
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Patent number: 12062404Abstract: A voltage trimming circuit including: a first resistance circuit having a first resistance value determined by up codes and down codes; a second resistance circuit having a second resistance value determined by the up codes and the down codes; and a comparator to output a voltage detection signal by comparing a voltage level of a reference voltage trimming node to that of a feedback node, wherein the voltage detection signal adjusts the up and down codes, which increase the first resistance value and decrease the second resistance value when the voltage level of the reference voltage trimming node is higher than that of the feedback node, and adjusts the up and down codes, which decrease the first resistance value and increase the second resistance value when the voltage level of the reference voltage trimming node is lower than that of the feedback node.Type: GrantFiled: August 29, 2023Date of Patent: August 13, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minho Choi, Jaeseong Lim, Kyungryun Kim, Daehyun Kim, Wonil Bae, Hohyun Shin, Sanghoon Jung, Hyongryol Hwang
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Patent number: 12039968Abstract: System and method for operating an always-on ASR (automatic speech recognition) system by selecting target keywords and continuously detecting the selected target keywords in voice commands in a mobile device are provided. In the mobile device, a processor is configured to collect keyword candidates, collect usage frequency data for keywords in the keyword candidates, collect situational usage frequency data for the keywords in the keyword candidates, select target keywords from the keyword candidates based on the usage frequency data and the situational usage frequency data, and detect one or more of the target keywords in a voice command using continuous detection of the target keywords.Type: GrantFiled: September 30, 2020Date of Patent: July 16, 2024Assignee: QUALCOMM IncorporatedInventors: Wonil Chang, Jinseok Lee, Mingu Lee, Jinkyu Lee, Byeonggeun Kim, Dooyong Sung, Jae-Won Choi, Kyu Woong Hwang
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Publication number: 20220323330Abstract: The present invention relates to: a composition for wound healing, containing a metal-organic framework (MOF)as an active ingredient; and a wound dressing material comprising a hydrophilic superabsorbent polymer and the MOF, and the composition and the wound dressing material have a wound healing ability, specifically, the excellent effect of healing a wound by promoting fibroblast movement, do not significantly differ from a control group with respect to cytotoxicity, thereby exhibiting excellent safety when applied to a wound site, and have the excellent effect of having a wound recovery rate high enough to be checked with the naked eye over time.Type: ApplicationFiled: December 11, 2020Publication date: October 13, 2022Inventors: Chan Yeong HEO, Sun-Young NAM, Jae Heon JEONG, Kyungmin CHOI, Dong-Sik SHIN, Un Jin RYU, Seongsoo KIM, Wonil KIM, Jaejin PARK, Mingi SEO
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Patent number: 7131911Abstract: A slope controllable foot plate for a golf swing practice apparatus which includes a actuating oil pressure motor providing the power for controlling the slope, a transformation device for transforming the rotating driving power to linear driving power, and a slope control oil pressure cylinder for controlling the slope of the foot plate, whereby a lower height and a simplified structure of the foot plate is obtained.Type: GrantFiled: February 27, 2004Date of Patent: November 7, 2006Assignee: Golfzon Co. LtdInventor: Wonil Kim
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Publication number: 20050153787Abstract: The present invention relates to the slope controllable foot plate for golf swing practice apparatus. The invention is characterized by the actuating oil pressure motor (3, 4) providing the power for controlling the slope, transformation device (5, 8, 9) for transforming rotating driving power to linear driving power, and slope control oil pressure cylinder (11, 12, 13, 14) for controlling the slope of the foot plate. By this constitution, the invention accomplishes the lower height and the simplified structure of the foot plate.Type: ApplicationFiled: February 27, 2004Publication date: July 14, 2005Inventor: Wonil Kim