Abstract: Proposed is a composition for preventing or treating lung diseases. The composition may contain CD47-overexpressing mesenchymal stem cells as an active ingredient. CD47-overexpressing mesenchymal stem cells, even when not autologous, show a high survival rate in vivo and the ability to migrate to lung tissue, reduce the inflammatory response in lung tissue, and exhibit a fibrosis-inhibiting effect. CD47-overexpressing mesenchymal stem cells can be widely used for the prevention or treatment of various lung diseases related to inflammation or fibrosis of the lungs.

Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: An input sensor including a first electrode and a second electrode, which cross each other. The first electrode includes a first main portion extending in a first direction and first sensing portions and second sensing portions, which are disposed with the first main portion therebetween in a second direction and each of which extends from the first main portion. Each of the first sensing portions and the second sensing portions includes first sub-portions extending in the first direction and first middle portions disposed between the first sub-portions and between one of the first sub-portions and the first main portion.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: A semiconductor package includes a lower semiconductor chip, a first semiconductor chip, a first through-electrode vertically penetrating the first semiconductor substrate, a first upper pad connected to the first through electrode, a first circuit layer disposed on the lower surface of the first semiconductor substrate, and a first lower pad disposed on a lower surface of the first circuit layer. A second semiconductor chip includes a second through-electrode spaced apart from the first through-electrode and vertically penetrating the second semiconductor substrate. A second upper pad is connected to the second through electrode. A second circuit layer is disposed on the lower surface of the second semiconductor substrate, and a second lower pad is connected to the second through-electrode on the lower surface of the second circuit layer through the second circuit layer and is integrally formed with the first upper pad.

Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: A semiconductor package includes a first semiconductor chip including a first main region and a first edge region, and a second semiconductor chip on the first semiconductor chip and including a second main region and a second edge region. The first semiconductor chip includes a first main pad and a first dummy pad respectively on the first main region and the first edge region on a top surface of the first semiconductor chip. The second semiconductor chip includes a first semiconductor substrate, a wiring layer below the first semiconductor substrate and including a wiring dielectric layer and wiring patterns, a second main pad and a second dummy pad respectively on the second main region and the second edge region below the wiring layer. A thickness of the wiring layer is greater on the second main region than on the second edge region.

Abstract: Light field microscope-based image acquisition apparatuses and methods are provided. The light field microscope-based image acquisition apparatus includes a lenslet synthesis processing unit configured to acquire a virtual lenslet image using a multi-lenslet image group; a sub-aperture image conversion unit configured to convert the virtual lenslet image generated in the lenslet synthesis processing unit into a sub-aperture image; and a 3D conversion unit configured to convert the sub-aperture image generated in the sub-aperture image conversion unit into a focal-stack image.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: A method of testing an antibiotic susceptibility includes dispensing and cultivating sample solution into culture wells including one or more comparative wells and a plurality of antibiotic wells receiving two or more kinds of antibiotics, respectively, receiving the sample solution into a plurality of preprocessing wells each including magnetic particles and fluorescent particles that bond to one or more kinds of bacteria such that the bacteria and the magnetic particles and fluorescent particles bond to each other, receiving the sample solution into a plurality of image wells having magnetic members thereunder such that the magnetic particles bonding to the bacteria are arranged on the bottoms of the image wells, removing the sample solution from the image wells that have undergone the planarizing step, taking fluorescent images of the image wells washed in the washing step, and determining an antibiotic tolerance/susceptibility of the sample solution by analyzing the fluorescent images.

Abstract: Provided is a display device including a display panel and an input sensing layer including an effective region and a non-effective region. The input sensing layer includes a plurality of sensing electrodes, a plurality of signal lines, and a plurality of input pads. The non-effective region includes a first region, a second region, and a third region, and the signal lines include first sub-lines in the first region and connected to the sensing electrodes, second sub-lines in the second region and connected to the input pads, and third sub-lines in the third region and connecting the first sub-lines and the second sub-lines. An interval between the third sub-lines in the third region is a first interval which is a constant, and the first interval is smaller than a second interval between the first sub-lines and a third interval between the second sub-lines.

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: Provided is a display device including a display panel and an input sensing layer including an effective region and a non-effective region. The input sensing layer includes a plurality of sensing electrodes, a plurality of signal lines, and a plurality of input pads. The non-effective region includes a first region, a second region, and a third region, and the signal lines include first sub-lines in the first region and connected to the sensing electrodes, second sub-lines in the second region and connected to the input pads, and third sub-lines in the third region and connecting the first sub-lines and the second sub-lines. An interval between the third sub-lines in the third region is a first interval which is a constant, and the first interval is smaller than a second interval between the first sub-lines and a third interval between the second sub-lines.

Abstract: A display device, including a display panel that displays an image; a flexible printed circuit board including an attaching part attached to one end of the display panel and a curved part extending from the attaching part and not overlapping with the display panel; a window assembly on an upper surface of the display panel; an adhesive part between the window assembly and the display panel to couple the display panel and the window assembly; and a compensating part not overlapping with the display panel, overlapping with the curved part, and on a same layer as the attaching part.

Abstract: A method of testing an antibiotic susceptibility includes dispensing and cultivating sample solution into culture wells including one or more comparative wells and a plurality of antibiotic wells receiving two or more kinds of antibiotics, respectively, receiving the sample solution into a plurality of preprocessing wells each including magnetic particles and fluorescent particles that bond to one or more kinds of bacteria such that the bacteria and the magnetic particles and fluorescent particles bond to each other, receiving the sample solution into a plurality of image wells having magnetic members thereunder such that the magnetic particles bonding to the bacteria are arranged on the bottoms of the image wells, removing the sample solution from the image wells that have undergone the planarizing step, taking fluorescent images of the image wells washed in the washing step, and determining an antibiotic tolerance/susceptibility of the sample solution by analyzing the fluorescent images.

Abstract: A display device has a first area, and a second area that extends from the first area and has a bent shape, the display device including a display module including a display panel, which has a corner portion in the second area, an input-sensing member on the display panel and including a body portion, which overlaps with the display panel, and an extension, which extends from the body portion, is in the second area, and does not overlap with the display panel, and a first bonding layer between the display module and the input-sensing member, wherein an edge of the extension extends beyond an edge of the corner portion.

Abstract: A composite sheet, including: a buffer sheet; and a heat dissipation sheet on one surface of the buffer sheet. One surface of the heat dissipation sheet facing the one surface of the buffer sheet may have a smaller area than the one surface of the buffer sheet. A display device includes a display panel and a composite sheet on one surface of the display panel.