Abstract: Disclosed are a backplane substrate, which achieves improved interface bonding characteristics via a recess configuration at the interface of an organic layer with an inorganic layer, thereby preventing peeling due to repeated folding, and a flexible display using the same. An organic layer is introduced into a recess provided in an inorganic layer so as to achieve improved interface bonding characteristics.

Abstract: Disclosed are a backplane substrate, which has a modified dummy pixel configuration, thereby preventing water permeation and cracks from the side surface due to repeated folding, and a flexible display using the same. A plurality of slits is provided in a dummy pixel portion and separates an interlayer insulation stack for respective dummy pixels.

Abstract: The present invention relates to a method using chemical reaction transparency of graphene, and more specifically to a method capable of forming a desired material by a catalytic reaction on a graphene surface using the graphene which inhibits oxygen diffusion without blocking electron delivery, and an applied method thereof.

Abstract: An anti-finger print hard coating resin composition is described that includes a high hardness ultra-violet (UV) curable resin having a weight percent of about 5% to about 99% and including at least one of siloxane compound and urethane acrylate compound; a UV curable fluoro-based compound having a weight percent of about 0.02% to about 2% with respect to the high hardness UV curable resin; an optical initiator having a weight percent of about 0.1% to about 10% with respect to the high hardness-UV curable resin; and an acrylate monomer of residual amount.

Abstract: The present invention relates to a semiconductor light-emitting device including a separation region for separating a light-emitting surface, so as to exhibit an excellent current dispersion effect and improve brightness characteristics. The semiconductor light-emitting device of the present invention can obtain the effect for improving uniformity of effective current density by including the separation region for separating the light-emitting region, and can expect an improvement in optical efficiency through the excellent current dispersion effect.

Abstract: Disclosed are a light-emitting device having excellent light-emitting efficiency by a current spreading effect and a method for manufacturing the same. The light-emitting device, according to the present invention, comprises: a light-emitting structure which is formed on a substrate, includes a first semiconductor layer, an active layer, and a second semiconductor layer, and in which a plurality of trenches are formed up to the second semiconductor layer and the active layer; a first electrode formed to come in contact with the second semiconductor layer of the light-emitting structure; and a second electrode formed to come in contact with the first semiconductor layer along at least one edge of the substrate.

Abstract: Disclosed is a nitride semiconductor light-emitting device having excellent brightness and ESD protection properties. The nitride semiconductor light-emitting device according to the present invention includes an electron blocking layer that is disposed between a p-type nitride semiconductor layer and an active layer, wherein said electron blocking layer includes AlInGaN, and the concentration of indium increases in the electron blocking layer as said layer progressively moves away from the active layer.

Abstract: Disclosed are a nitride semiconductor light-emitting element having a superior current spreading effect as a result of using a current spreading part containing current spreading impurities, and a method for manufacturing same. The nitride semiconductor light-emitting element according to the present invention comprises: an n-type nitride layer; a current spreading part, which is formed from nitride comprising current spreading impurities, and which is disposed on the n-type nitride layer; an activation layer disposed on the current spreading part; and a p-type nitride layer disposed on the activation layer, wherein the current spreading impurities comprise carbon (C).

Abstract: Disclosed are a nitride semiconductor light-emitting element and a method for manufacturing the same. The nitride semiconductor light-emitting element according to the present invention comprises: a current blocking part disposed between a substrate and an n-type nitride layer; an activation layer disposed on the top surface of the n-type nitride layer; and a p-type nitride layer disposed on the top surface of the activation layer, wherein the current blocking part is an AlxGa(1-x)N layer, and the Al content x times layer thickness (?m) is in the range of 0.01-0.06. Accordingly, the nitride semiconductor light-emitting element can increase the luminous efficiency by having a current blocking part which prevents current leakage from occurring.

Abstract: A method of removing dust from granular polysilicon includes introducing a stream of granular polysilicon, dispersing the longitudinal stream of granular polysilicon by redirecting the stream into a radially outward flow having a circular pattern, and introducing a counter flow of gas in an opposite direction to that of the longitudinal stream of granular polysilicon to contact the radially outward flow to separate the dust from the granular polysilicon.

Abstract: A method of removing dust from granular polysilicon includes introducing a stream of granular polysilicon, dispersing the longitudinal stream of granular polysilicon by redirecting the stream into a radially outward flow having a circular pattern, and introducing a counter flow of gas in an opposite direction to that of the longitudinal stream of granular polysilicon to contact the radially outward flow to separate the dust from the granular polysilicon.

Abstract: Disclosed are a nitride semiconductor light-emitting element having a superior current spreading effect as a result of using a current spreading part containing current spreading impurities, and a method for manufacturing same. The nitride semiconductor light-emitting element according to the present invention comprises: an n-type nitride layer; a current spreading part, which is formed from nitride comprising current spreading impurities, and which is disposed on the n-type nitride layer; an activation layer disposed on the current spreading part; and a p-type nitride layer disposed on the activation layer, wherein the current spreading impurities comprise carbon (C).

Abstract: An anti-finger print hard coating resin composition is described that includes a high hardness ultra-violet (UV) curable resin having a weight percent of about 5% to about 99% and including at least one of siloxane compound and urethane acrylate compound; a UV curable fluoro-based compound having a weight percent of about 0.02% to about 2% with respect to the high hardness UV curable resin; an optical initiator having a weight percent of about 0.1% to about 10% with respect to the high hardness-UV curable resin; and an arylate monomer of residual amount.

Abstract: Disclosed are a nitride semiconductor light-emitting element and a method for manufacturing the same. The nitride semiconductor light-emitting element according to the present invention comprises: a current blocking part disposed between a substrate and an n-type nitride layer; an activation layer disposed on the top surface of the n-type nitride layer; and a p-type nitride layer disposed on the top surface of the activation layer, wherein the current blocking part is an AlxGa(1-x)N layer, and the Al content x times layer thickness (?m) is in the range of 0.01-0.06. Accordingly, the nitride semiconductor light-emitting element can increase the luminous efficiency by having a current blocking part which prevents current leakage from occurring.

Abstract: A method of manufacturing a monolithic expanded beam mode electroabsorption modulator including a waveguide layer with a two expansion/contraction sections and an electroabsorption section arranged along a longitudinal axis. At least one patterned growth retarding layer is formed on the top surface of a substrate. The waveguide layer is formed on a portion of the top surface of the substrate by selective area growth and has an index of refraction different from the substrate. An electroabsorption portion of the waveguide layer has a thickness which is greater than thicknesses in its other portions. The semiconductor layer is formed on the waveguide layer and includes an index of refraction different from the waveguide. The waveguide and semiconductor layers are defined and etched to form the expansion/contraction and electroabsorption sections of the waveguide layer. Electrical contacts are formed, one electrically coupled to the substrate and another electrically coupled to the semiconductor layer.

Abstract: A method of manufacturing a monolithic expanded beam mode electroabsorption modulator including a waveguide layer with a two expansion/contraction sections and an electroabsorption section arranged along a longitudinal axis. At least one patterned growth retarding layer is formed on the top surface of a substrate. The waveguide layer is formed on a portion of the top surface of the substrate by selective area growth and has an index of refraction different from the substrate. An electroabsorption portion of the waveguide layer has a thickness which is greater than thicknesses in its other portions. The semiconductor layer is formed on the waveguide layer and includes an index of refraction different from the waveguide. The waveguide and semiconductor layers are defined and etched to form the expansion/contraction and electroabsorption sections of the waveguide layer. Electrical contacts are formed, one electrically coupled to the substrate and another electrically coupled to the semiconductor layer.

Abstract: A monolithic single pass expanded beam mode active optical device includes: a substrate; a waveguide layer coupled to the top surface of the substrate; a semiconductor layer coupled to the waveguide layer; first and second electrodes for receiving an electric signal coupled to the substrate and the semiconductor layer, respectively. The waveguide layer includes a plurality of sublayers, forming a quantum well structure, which is responsive to the electric signal. The waveguide layer has three sections, two expansion/contraction sections and an active section, which extends between and adjacent to the two expansion/contraction sections. The thickness of at least one of the plurality of sublayers varies within the expansion/contraction portions of the quantum well structure. Possible interactions of the active region with the light include: absorption in the case of an electro-absorptive modulator and optical gain.

Abstract: A monolithic single pass expanded beam mode active optical device includes: a substrate; a waveguide layer coupled to the top surface of the substrate; a semiconductor layer coupled to the waveguide layer; first and second electrodes for receiving an electric signal coupled to the substrate and the semiconductor layer, respectively. The waveguide layer includes a plurality of sublayers, forming a quantum well structure, which is responsive to the electric signal. The waveguide layer has three sections, two expansion/contraction sections and an active section, which extends between and adjacent to the two expansion/contraction sections. The thickness of at least one of the plurality of sublayers varies within the expansion/contraction portions of the quantum well structure. Possible interactions of the active region with the light include: absorption in the case of an electro-absorptive modulator and optical gain.

Abstract: Semiconductor laser diode in which an SCL (Strain Compensated Layer) is formed at an active layer of a 635 nm band semiconductor laser diode for having very low threshold current, is disclosed, including a first conduction type clad layer; a first optical guide layer; a strain compensated layer; an active layer having a strain applied thereto; a strain compensated layer; a second optical guide layer; and, a second conduction type clad layer, wherein the above layers are formed on a first conduction type substrate in succession.