Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.

Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A wireless charging apparatus according to an embodiment of the present disclosure includes a pad determinor configured to determine a receiving pad mounted on an electric vehicle entering a wireless charging station, and a power transmitter configured to select a transmitting pad to correspond to the receiving pad determined by the pad determinor, and transmit charging power to the receiving pad through the transmitting pad.

Abstract: A method for performing switching synchronization of a bridgeless rectifier in an electric vehicle (EV) wireless power transfer system may include receiving, by an EV control module, an input voltage of a transmission-side resonance circuit from a transmission-side of the EV wireless power transfer system; calculating, by the EV control module, a phase difference between the received input voltage and a voltage or a current selected in the bridgeless rectifier and a reception-side resonance circuit; and controlling, by an EV control module, switching time points of switches included in the bridgeless rectifier to decrease the calculated phase difference. The reception-side resonance circuit may be electromagnetically coupled to the transmission-side resonance circuit, and the bridgeless rectifier may be configured to rectify an output of the reception-side resonance circuit and to output the rectified output.

Abstract: A method for controlling wireless power transfer to an EV using a bridgeless rectifier may include detecting a phase difference between an input voltage of a transmission-side resonance circuit and an output voltage of a reception-side resonance circuit; after detecting the phase difference, predicting a resonance frequency change direction according to a preconfigured design condition; and controlling switching time points of switches included in the bridgeless rectifier in a direction compensating for the predicted change direction.

Abstract: A method for performing switching synchronization of a bridgeless rectifier in an electric vehicle (EV) wireless power transfer system may include receiving, by an EV control module, an input voltage of a transmission-side resonance circuit from a transmission-side of the EV wireless power transfer system; calculating, by the EV control module, a phase difference between the received input voltage and a voltage or a current selected in the bridgeless rectifier and a reception-side resonance circuit; and controlling, by an EV control module, switching time points of switches included in the bridgeless rectifier to decrease the calculated phase difference. The reception-side resonance circuit may be electromagnetically coupled to the transmission-side resonance circuit, and the bridgeless rectifier may be configured to rectify an output of the reception-side resonance circuit and to output the rectified output.

Abstract: A method for controlling wireless power transfer to an EV using a bridgeless rectifier may include detecting a phase difference between an input voltage of a transmission-side resonance circuit and an output voltage of a reception-side resonance circuit; after detecting the phase difference, predicting a resonance frequency change direction according to a preconfigured design condition; and controlling switching time points of switches included in the bridgeless rectifier in a direction compensating for the predicted change direction.

Abstract: A light emitting device package is provided. The light emitting device package may include a frame, a first lead frame spaced apart from the frame, a second lead frame spaced apart from the frame, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices on the frame exposed through the first cavity. The body may include a reflective part provided inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency.

Abstract: A light emitting device package is provided. The light emitting device package may include a frame, a first lead frame spaced apart from the frame, a second lead frame spaced apart from the frame, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices on the frame exposed through the first cavity. The body may include a reflective part provided inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency.

Abstract: A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.

Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

Abstract: A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.

Abstract: A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.

Abstract: A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.

Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

Abstract: A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.

Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

Abstract: A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.