Abstract: The display device includes a display panel for displaying an image and a cover window disposed on the display panel. The cover window includes a cover glass layer, and at least one coating layer disposed on the cover glass layer. The display panel has a first color difference value in a color coordinate system, the at least one coating layer has a second color difference value in the color coordinate system, and a sum of the first color difference value and the second color difference value is adjacent to an origin of the color coordinate system.

Abstract: A cover layer for a display device, the cover layer including a sapphire substrate; a first cover layer disposed on the sapphire substrate, the first cover layer including MgF2, the first cover layer having a thickness in a range of about 16 nm to about 26 nm; a second cover layer disposed on the first cover layer, the second cover layer including Si9Al2O10, the second cover layer having a thickness in a range of about 45 nm to about 70 nm; and a third cover layer disposed on the second cover layer, the third cover layer including perfluorinated polyether (PEPE), the third cover layer having a thickness in a range of about 10 nm to about 45 nm.

Abstract: A semiconductor device includes a P-type substrate, a P-type well region, an N-type well region, an N-type guard ring region, an insulating layer, a poly gate disposed, and a bulk region. The P-type well region is disposed on the P-type substrate and includes source regions and drain regions each spaced apart from the other. The N-type well region disposed and spaced apart from the P-type well region on the P-type substrate. The N-type guard ring region is disposed around perimeters of the P-type well region and the N-type well region. The insulating layer is disposed around the P-type well region and the N-type well region on the N-type guard ring region. The poly gate is disposed around the perimeter of the P-type well region and the N-type well region, respectively, on the insulating layer. The bulk region is disposed on the N-type guard ring region adjacent the poly gate.

Abstract: A semiconductor device includes a P-type substrate, a P-type well region, an N-type well region, an N-type guard ring region, an insulating layer, a poly gate disposed, and a bulk region. The P-type well region is disposed on the P-type substrate and includes source regions and drain regions each spaced apart from the other. The N-type well region disposed and spaced apart from the P-type well region on the P-type substrate. The N-type guard ring region is disposed around perimeters of the P-type well region and the N-type well region. The insulating layer is disposed around the P-type well region and the N-type well region on the N-type guard ring region. The poly gate is disposed around the perimeter of the P-type well region and the N-type well region, respectively, on the insulating layer. The bulk region is disposed on the N-type guard ring region adjacent the poly gate.

Abstract: Disclosed is a method for removing a thermal sleeve from a cold leg of a reactor coolant system, which enables removal of an unintentionally separated thermal sleeve without implementation of a pipe cutting operation, preventing invasion of impurities into pipes and securing reliability in repetitious welding of the pipes. In particular, the method enables a remote operation and an underwater operation using wire ropes, thus being capable of minimizing a negative effect on workers due to radiation exposure.

Abstract: Disclosed is an apparatus for removing a thermal sleeve from a cold leg of a reactor coolant system, which removes an unintentionally separated thermal sleeve without pipe cutting, preventing invasion of impurities into pipes and achieving reliable pipe re-welding. The apparatus includes a sleeve removal tool including a corn head formed at a shaft, a pressure plate below the corn head to maximize hydraulic pressure inside a safety injection pipe, a spring connected to the pressure plate to keep the pressure plate unfolded, and a guide wheel to guide the sleeve removal tool into the safety injection pipe, a horizontal movement carrier including bodies connected to each other by a link, a seating rod for seating of the sleeve removal tool, and moving wheels for movement of the horizontal movement carrier, and a vertical movement carrier including first and second anti-separation bars to prevent separation of the horizontal movement carrier.

Abstract: Disclosed is an apparatus for removing a thermal sleeve from a cold leg of a reactor coolant system, which removes an unintentionally separated thermal sleeve without pipe cutting, preventing invasion of impurities into pipes and achieving reliable pipe re-welding. The apparatus includes a sleeve removal tool including a corn head formed at a shaft, a pressure plate below the corn head to maximize hydraulic pressure inside a safety injection pipe, a spring connected to the pressure plate to keep the pressure plate unfolded, and a guide wheel to guide the sleeve removal tool into the safety injection pipe, a horizontal movement carrier including bodies connected to each other by a link, a seating rod for seating of the sleeve removal tool, and moving wheels for movement of the horizontal movement carrier, and a vertical movement carrier including first and second anti-separation bars to prevent separation of the horizontal movement carrier.

Abstract: Disclosed is a method for removing a thermal sleeve from a cold leg of a reactor coolant system, which enables removal of an unintentionally separated thermal sleeve without implementation of a pipe cutting operation, preventing invasion of impurities into pipes and securing reliability in repetitious welding of the pipes. In particular, the method enables a remote operation and an underwater operation using wire ropes, thus being capable of minimizing a negative effect on workers due to radiation exposure.