Patents by Inventor Won Jong Baek
Won Jong Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240343640Abstract: A window includes a tempered glass substrate that includes a base layer and a compressive stress layer including a first region and a second region. The second region includes a first portion that includes a first point and is adjacent to the first region, a second portion that includes a second point and is adjacent to the base layer, and a third portion that includes a third point and that is disposed between the first portion and the second portion. A compressive stress at the first point is in a range of about 100 MPa to about 250 MPa, a compressive stress at the second point is in a range of about 50 MPa to about 150 MPa, and a compressive stress at the third point is in a range of about 70 MPa to about 200 MPa.Type: ApplicationFiled: January 8, 2024Publication date: October 17, 2024Applicant: Samsung Display Co., Ltd.Inventors: TAEHO AN, WON-JONG BAEK, MYUNGHUN BAEK, JEONG SEOK LEE
-
Publication number: 20240307909Abstract: A window deposition apparatus includes a chamber, a seating part disposed in the chamber and on which a window is disposed and in which an open portion that exposes a portion of the window is formed, and a spray part disposed in the chamber and that faces a bottom surface of the seating part. An inner surface of the seating part that defines the open portion includes a first inner surface, an inducing surface that connects the first inner surface and the bottom surface of the seating part to each other, a second inner surface disposed on the first inner surface, and a guide surface that connects the second inner surface and a top surface of the seating part to each other. The first inner surface protrudes inward from the second inner surface.Type: ApplicationFiled: December 21, 2023Publication date: September 19, 2024Inventors: SEONGSIK CHOI, JAEHONG KIM, CHAEKYEONG LEE, JONGSEOK JOO, SUNGWOO KIM, WON-JONG BAEK
-
METHOD OF MANUFACTURING WINDOW, WINDOW MANUFACTURED THEREBY, AND DISPLAY DEVICE INCLUDING THE WINDOW
Publication number: 20240101472Abstract: Provided is a method of manufacturing a window, which includes preparing a first preliminary glass substrate including Li+ ions and Na+ ions, providing a first strengthening molten salt including Na+ ions onto the first preliminary glass substrate and forming a second preliminary glass substrate, providing a second strengthening molten salt including Rb+ ions onto the second preliminary glass substrate and forming a third preliminary glass substrate, and providing a third strengthening molten salt including K+ ions onto the third preliminary glass substrate and forming a strengthened glass substrate.Type: ApplicationFiled: July 19, 2023Publication date: March 28, 2024Applicant: Samsung Display Co., Ltd.Inventors: WON-JONG BAEK, TAEHO AN -
Patent number: 11406027Abstract: In a method of manufacturing a release film for a window, the method includes: providing the window comprising a light transmitting area and a light shielding area; forming a window print layer on the window to entirely overlap the light transmitting area and the light shielding area; and curing the window print layer, wherein the window print layer comprises a polyvinyl chloride.Type: GrantFiled: October 21, 2019Date of Patent: August 2, 2022Assignee: Samsung Display Co., Ltd.Inventor: Won-jong Baek
-
Patent number: 11056482Abstract: A semiconductor device includes a P-type substrate, a P-type well region, an N-type well region, an N-type guard ring region, an insulating layer, a poly gate disposed, and a bulk region. The P-type well region is disposed on the P-type substrate and includes source regions and drain regions each spaced apart from the other. The N-type well region disposed and spaced apart from the P-type well region on the P-type substrate. The N-type guard ring region is disposed around perimeters of the P-type well region and the N-type well region. The insulating layer is disposed around the P-type well region and the N-type well region on the N-type guard ring region. The poly gate is disposed around the perimeter of the P-type well region and the N-type well region, respectively, on the insulating layer. The bulk region is disposed on the N-type guard ring region adjacent the poly gate.Type: GrantFiled: November 13, 2019Date of Patent: July 6, 2021Assignee: Key Foundry Co., LtdInventor: Won Jong Baek
-
Publication number: 20200373293Abstract: A semiconductor device includes a P-type substrate, a P-type well region, an N-type well region, an N-type guard ring region, an insulating layer, a poly gate disposed, and a bulk region. The P-type well region is disposed on the P-type substrate and includes source regions and drain regions each spaced apart from the other. The N-type well region disposed and spaced apart from the P-type well region on the P-type substrate. The N-type guard ring region is disposed around perimeters of the P-type well region and the N-type well region. The insulating layer is disposed around the P-type well region and the N-type well region on the N-type guard ring region. The poly gate is disposed around the perimeter of the P-type well region and the N-type well region, respectively, on the insulating layer. The bulk region is disposed on the N-type guard ring region adjacent the poly gate.Type: ApplicationFiled: November 13, 2019Publication date: November 26, 2020Applicant: MagnaChip Semiconductor, Ltd.Inventor: Won Jong BAEK
-
Publication number: 20200196457Abstract: In a method of manufacturing a release film for a window, the method includes: providing the window comprising a light transmitting area and a light shielding area; forming a window print layer on the window to entirely overlap the light transmitting area and the light shielding area; and curing the window print layer, wherein the window print layer comprises a polyvinyl chloride.Type: ApplicationFiled: October 21, 2019Publication date: June 18, 2020Inventor: Won-jong BAEK
-
Patent number: 8509375Abstract: Disclosed is a method for removing a thermal sleeve from a cold leg of a reactor coolant system, which enables removal of an unintentionally separated thermal sleeve without implementation of a pipe cutting operation, preventing invasion of impurities into pipes and securing reliability in repetitious welding of the pipes. In particular, the method enables a remote operation and an underwater operation using wire ropes, thus being capable of minimizing a negative effect on workers due to radiation exposure.Type: GrantFiled: March 11, 2010Date of Patent: August 13, 2013Assignee: KPS Co., Ltd.Inventors: Won Jong Baek, Sung Ho Jang, Bum Suk Lee
-
Patent number: 8243870Abstract: Disclosed is an apparatus for removing a thermal sleeve from a cold leg of a reactor coolant system, which removes an unintentionally separated thermal sleeve without pipe cutting, preventing invasion of impurities into pipes and achieving reliable pipe re-welding. The apparatus includes a sleeve removal tool including a corn head formed at a shaft, a pressure plate below the corn head to maximize hydraulic pressure inside a safety injection pipe, a spring connected to the pressure plate to keep the pressure plate unfolded, and a guide wheel to guide the sleeve removal tool into the safety injection pipe, a horizontal movement carrier including bodies connected to each other by a link, a seating rod for seating of the sleeve removal tool, and moving wheels for movement of the horizontal movement carrier, and a vertical movement carrier including first and second anti-separation bars to prevent separation of the horizontal movement carrier.Type: GrantFiled: April 14, 2010Date of Patent: August 14, 2012Assignee: KPS Co., Ltd.Inventors: Won Jong Baek, Sung Ho Jang, Bum Suk Lee, Ki Tae Song
-
Publication number: 20110142187Abstract: Disclosed is a method for removing a thermal sleeve from a cold leg of a reactor coolant system, which enables removal of an unintentionally separated thermal sleeve without implementation of a pipe cutting operation, preventing invasion of impurities into pipes and securing reliability in repetitious welding of the pipes. In particular, the method enables a remote operation and an underwater operation using wire ropes, thus being capable of minimizing a negative effect on workers due to radiation exposure.Type: ApplicationFiled: March 11, 2010Publication date: June 16, 2011Applicant: KPS CO., LTD.Inventors: Won Jong BAEK, Sung Ho JANG, Bum Suk LEE
-
Publication number: 20110142188Abstract: Disclosed is an apparatus for removing a thermal sleeve from a cold leg of a reactor coolant system, which removes an unintentionally separated thermal sleeve without pipe cutting, preventing invasion of impurities into pipes and achieving reliable pipe re-welding. The apparatus includes a sleeve removal tool including a corn head formed at a shaft, a pressure plate below the corn head to maximize hydraulic pressure inside a safety injection pipe, a spring connected to the pressure plate to keep the pressure plate unfolded, and a guide wheel to guide the sleeve removal tool into the safety injection pipe, a horizontal movement carrier including bodies connected to each other by a link, a seating rod for seating of the sleeve removal tool, and moving wheels for movement of the horizontal movement carrier, and a vertical movement carrier including first and second anti-separation bars to prevent separation of the horizontal movement carrier.Type: ApplicationFiled: April 14, 2010Publication date: June 16, 2011Applicant: KPS CO., LTD.Inventors: Won Jong BAEK, Sung Ho JANG, Bum Suk LEE, Ki Tae SONG