Patents by Inventor Won Ju Jang

Won Ju Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984654
    Abstract: The present disclosure relates to an antenna element including: a dielectric layer; a radiation electrode arranged on an upper surface of the dielectric layer and including a first mesh structure; and a dummy electrode arranged on the upper surface of the dielectric layer and including a second mesh structure, in which at least one of the radiation electrode and the dummy electrode satisfies Equation 1, and an image display device including the same.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: May 14, 2024
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Won-Hee Lee, Young-Ju Kim, In-Kak Song, So-Eun Jang
  • Publication number: 20240032201
    Abstract: A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.
    Type: Application
    Filed: January 27, 2023
    Publication date: January 25, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae Yoo, Yong Gil Namgung, Jong Hoon Shin, Won Ju Jang, Yun Hwan Kim