Patents by Inventor Won Jun Kang

Won Jun Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240420768
    Abstract: A semiconductor device includes a memory cell connected to a word line and a bit line. The semiconductor device also includes a line driving circuit configured to apply a program voltage to the word line. The semiconductor device further includes a page buffer comprising a plurality of latches comprising at least one dynamic latch and at least one static latch and configured to control a voltage level of the bit line after the start of a program operation. The semiconductor device additionally includes a control circuit configured to control the page buffer to program, into the memory cell, data that have been stored in the static latch or store the data in the dynamic latch based on a temperature of the semiconductor device, when receiving a pause command during the program operation.
    Type: Application
    Filed: October 11, 2023
    Publication date: December 19, 2024
    Applicant: SK hynix Inc.
    Inventors: Won Jae CHOI, Won Jun KANG
  • Publication number: 20240199869
    Abstract: Provided are a composition having excellent gas barrier property and low-temperature impact resistance, and a liner for high-pressure gas storage tanks containing the same. Particularly, provided are a composition, in which resin particles reinforcing low-temperature impact resistance are dispersed in a gas barrier resin, thereby having excellent gas barrier property and excellent impact resistance while being easily moldable, and a liner for high-pressure gas storage tanks.
    Type: Application
    Filed: May 19, 2022
    Publication date: June 20, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: Hansoo SONG, Chulee KANG, Won Jun KANG, Jaehyeok LEE, Seong Soo BAE
  • Publication number: 20240001598
    Abstract: This disclosure relates to a foam-molding mold having channels formed therein and a physical foaming process using the same, and more specifically, the foam-molding mold is characterized by comprising a cavity formed therein for accommodating mixed resin for foaming, and having channels formed therein for guiding gas to the cavity.
    Type: Application
    Filed: November 22, 2021
    Publication date: January 4, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: Seong Soo BAE, Chul Ee KANG, Jae Hyeok LEE, Won Jun KANG, Han Soo SONG
  • Patent number: 10975173
    Abstract: The present invention relates to a high-density ethylene-based polymer comprising an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. According to the present invention, the high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: April 13, 2021
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: In Jun Lee, Won Jun Kang, Dong Ok Kim, Song Hee Yang, Sung Woo Lee, Dong Wook Jeong, Ui Gab Joung
  • Patent number: 10954321
    Abstract: A high-density ethylene-based polymer is provided. The high-density ethylene-based polymer contains an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. The high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: March 23, 2021
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: In Jun Lee, Won Jun Kang, Dong Ok Kim, Song Hee Yang, Sung Woo Lee, Dong Wook Jeong, Ui Gab Joung
  • Patent number: 10934375
    Abstract: The present invention relates to a high-density ethylene-based polymer comprising: an ethylene homopolymer; or a copolymer of ethylene and at least one comonomer selected from the group consisting of ?-olefins, cyclic olefins and linear, branched and cyclic dienes. According to the present invention, the high-density ethylene-based polymer has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: March 2, 2021
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: Ui Gab Joung, Dong Wook Jeong, Won Jun Kang, Dong Ok Kim, Song Hee Yang, In Jun Lee
  • Patent number: 10577609
    Abstract: The present invention relates to a DNA aptamer specifically binding to a hepatocellular carcinoma-related Glypican-3 (GPC3) protein, treatment of cancers related to the Glypican-3 protein using the same, a composition for inhibiting a cancer and a composition for diagnosing a cancer comprising the same as an active ingredient.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: March 3, 2020
    Assignees: POSTECH ACADEMY—INDUSTRY FOUNDATION, SEOUL NATIONAL UNIVERSITY HOSPITAL, YONSEI UNIVERSITY, UNIVERSITY—INDUSTRY FOUNDATION (UIF)
    Inventors: Eun Ju Oh, Jung Hwan Lee, Jong-Hoon Lim, Jong In Kim, Jung Hwan Yoon, Sung Ho Ryu, Jeong-Hoon Lee, Won Jun Kang, Seong Hui Jin
  • Publication number: 20190169323
    Abstract: The present invention relates to a high-density ethylene-based polymer comprising an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. According to the present invention, the high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Application
    Filed: April 7, 2017
    Publication date: June 6, 2019
    Applicant: HANWHA CHEMICAL CORPORATION
    Inventors: In Jun LEE, Won Jun KANG, Dong Ok KIM, Song Hee YANG, Sung Woo LEE, Dong Wook JEONG, Ui Gab JOUNG
  • Publication number: 20190169325
    Abstract: A high-density ethylene-based polymer is provided. The high-density ethylene-based polymer contains an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. The high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Application
    Filed: February 10, 2017
    Publication date: June 6, 2019
    Applicant: HANWHA CHEMICAL CORPORATION
    Inventors: In Jun LEE, Won Jun KANG, Dong Ok KIM, Song Hee YANG, Sung Woo LEE, Dong Wook JEONG, Ui Gab JOUNG
  • Publication number: 20190136239
    Abstract: The present invention relates to a DNA aptamer specifically binding to a hepatocellular carcinoma-related Glypican-3(GPC3) protein, treatment of cancers related to the Glypican-3 protein using the same, a composition for inhibiting a cancer and a composition for diagnosing a cancer comprising the same as an active ingredient.
    Type: Application
    Filed: March 6, 2017
    Publication date: May 9, 2019
    Inventors: Eun Ju OH, Jung Hwan Lee, Jong-Hoon Lim, Jong In Kim, Jung Hwan Yoon, Sung Ho Ryu, Jeong-Hoon Lee, Won Jun Kang, Seong Hui Jin
  • Publication number: 20190127503
    Abstract: The present invention relates to a high-density ethylene-based polymer comprising: an ethylene homopolymer; or a copolymer of ethylene and at least one comonomer selected from the group consisting of ?-olefins, cyclic olefins and linear, branched and cyclic dienes. According to the present invention, the high-density ethylene-based polymer has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Application
    Filed: February 10, 2017
    Publication date: May 2, 2019
    Applicant: HANWHA CHEMICAL CORPORATION
    Inventors: Ui Gab JOUNG, Dong Wook JEONG, Won Jun KANG, Dong Ok KIM, Song Hee YANG, In Jun LEE
  • Patent number: 9309515
    Abstract: Disclosed are a DNA aptamer specifically binding to the Her2 (ERBB2) receptor involved in the onset of breast cancer, a composition for the suppression of cancer metastasis comprising the same as an active ingredient, and a composition for the diagnosis of cancer comprising the same as an active ingredient. Due to its binding mechanism being different from that of the conventional antibody, the aptamer can be effectively used for suppressing cancer metastasis and diagnosing cancer.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: April 12, 2016
    Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, KOREA FOOD & DRUG ADMINISTRATION
    Inventors: Jung Hwan Lee, Young Chan Chae, Youngdong Kim, Hyungu Kang, Jong Hun Im, Jong In Kim, Ki Seok Kim, Sung Key Jang, Il Ung Oh, Min Jeong Choi, Won Jun Kang
  • Publication number: 20150005368
    Abstract: Disclosed are a DNA aptamer specifically binding to the Her2 (ERBB2) receptor involved in the onset of breast cancer, a composition for the suppression of cancer metastasis comprising the same as an active ingredient, and a composition for the diagnosis of cancer comprising the same as an active ingredient. Due to its binding mechanism being different from that of the conventional antibody, the aptamer can be effectively used for suppressing cancer metastasis and diagnosing cancer.
    Type: Application
    Filed: August 10, 2011
    Publication date: January 1, 2015
    Applicants: KOREA FOOD & DRUG ADMINISTRATION, POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Jung Hwan Lee, Young Chan Chae, Youndong Kim, Hyungu Kang, Jong Hun Im, Jong In Kim, Ki Seok Kim, Sung Key Jang, II Ung Oh, Min Jeong Choi, Won Jun Kang
  • Patent number: 6711079
    Abstract: The inventions relate to a data bus sense amplifier circuit. A switching unit includes a PMOS transistor which serves as an input terminal for a sense amp enable signal for maintaining a power supply voltage precharge state of a data bus sense amp. This arrangement allows for reduced leakage current between the switching unit and a ground terminal, and a sensed width by self-asymmetry during a precharge period is decreased, to easily invert a wanted data in a read operation. In addition, the sense amp enable signal is a pulse type for facilitating a high speed sensing operation in a high pulse operation, thereby improving a speed.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: March 23, 2004
    Assignee: Hynix Semiconductor Inc.
    Inventor: Won Jun Kang
  • Publication number: 20020048207
    Abstract: The inventions relate to a data bus sense amplifier circuit. A switching unit includes a PMOS transistor which serves as an input terminal for a sense amp enable signal for maintaining a power supply voltage precharge state of a data bus sense amp. This arrangement allows for reduced leakage current between the switching unit and a ground terminal, and a sensed width by self-asymmetry during a precharge period is decreased, to easily invert a wanted data in a read operation. In addition, the sense amp enable signal is a pulse type for facilitating a high speed sensing operation in a high pulse operation, thereby improving a speed.
    Type: Application
    Filed: October 18, 2001
    Publication date: April 25, 2002
    Inventor: Won Jun Kang
  • Patent number: 6294424
    Abstract: The method involves forming a N well over a cell part and a P well over a periphery part of the semiconductor substrate, etching the N well and the P well to form trenches for a storage electrode and an element isolating film, forming an insulating film over the resulting structure, thereby filling the trench on the periphery part, sequentially forming a dielectric layer pattern and a storage electrode on the trench of the cell part, forming a storage electrode, forming an intermediate layer over the resulting structure, exposing the storage electrode, forming an undoped polysilicon layer over the resulting structure, thereby connecting the undoped polysilicon layer with the storage electrode, forming a polysilicon layer pattern and an intermediate insulating pattern, and forming a MOS transistor and a bit line over the polysilicon layer pattern of the cell part and the periphery part.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: September 25, 2001
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Won Jun Kang, Yoon Nam Kim, Hyun Gu Yoon