Patents by Inventor Won Jun Kang
Won Jun Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240420768Abstract: A semiconductor device includes a memory cell connected to a word line and a bit line. The semiconductor device also includes a line driving circuit configured to apply a program voltage to the word line. The semiconductor device further includes a page buffer comprising a plurality of latches comprising at least one dynamic latch and at least one static latch and configured to control a voltage level of the bit line after the start of a program operation. The semiconductor device additionally includes a control circuit configured to control the page buffer to program, into the memory cell, data that have been stored in the static latch or store the data in the dynamic latch based on a temperature of the semiconductor device, when receiving a pause command during the program operation.Type: ApplicationFiled: October 11, 2023Publication date: December 19, 2024Applicant: SK hynix Inc.Inventors: Won Jae CHOI, Won Jun KANG
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Publication number: 20240199869Abstract: Provided are a composition having excellent gas barrier property and low-temperature impact resistance, and a liner for high-pressure gas storage tanks containing the same. Particularly, provided are a composition, in which resin particles reinforcing low-temperature impact resistance are dispersed in a gas barrier resin, thereby having excellent gas barrier property and excellent impact resistance while being easily moldable, and a liner for high-pressure gas storage tanks.Type: ApplicationFiled: May 19, 2022Publication date: June 20, 2024Applicant: HANWHA SOLUTIONS CORPORATIONInventors: Hansoo SONG, Chulee KANG, Won Jun KANG, Jaehyeok LEE, Seong Soo BAE
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Publication number: 20240001598Abstract: This disclosure relates to a foam-molding mold having channels formed therein and a physical foaming process using the same, and more specifically, the foam-molding mold is characterized by comprising a cavity formed therein for accommodating mixed resin for foaming, and having channels formed therein for guiding gas to the cavity.Type: ApplicationFiled: November 22, 2021Publication date: January 4, 2024Applicant: HANWHA SOLUTIONS CORPORATIONInventors: Seong Soo BAE, Chul Ee KANG, Jae Hyeok LEE, Won Jun KANG, Han Soo SONG
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Patent number: 10975173Abstract: The present invention relates to a high-density ethylene-based polymer comprising an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. According to the present invention, the high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.Type: GrantFiled: April 7, 2017Date of Patent: April 13, 2021Assignee: HANWHA CHEMICAL CORPORATIONInventors: In Jun Lee, Won Jun Kang, Dong Ok Kim, Song Hee Yang, Sung Woo Lee, Dong Wook Jeong, Ui Gab Joung
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Patent number: 10954321Abstract: A high-density ethylene-based polymer is provided. The high-density ethylene-based polymer contains an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. The high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.Type: GrantFiled: February 10, 2017Date of Patent: March 23, 2021Assignee: HANWHA CHEMICAL CORPORATIONInventors: In Jun Lee, Won Jun Kang, Dong Ok Kim, Song Hee Yang, Sung Woo Lee, Dong Wook Jeong, Ui Gab Joung
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Patent number: 10934375Abstract: The present invention relates to a high-density ethylene-based polymer comprising: an ethylene homopolymer; or a copolymer of ethylene and at least one comonomer selected from the group consisting of ?-olefins, cyclic olefins and linear, branched and cyclic dienes. According to the present invention, the high-density ethylene-based polymer has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.Type: GrantFiled: February 10, 2017Date of Patent: March 2, 2021Assignee: HANWHA CHEMICAL CORPORATIONInventors: Ui Gab Joung, Dong Wook Jeong, Won Jun Kang, Dong Ok Kim, Song Hee Yang, In Jun Lee
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Patent number: 10577609Abstract: The present invention relates to a DNA aptamer specifically binding to a hepatocellular carcinoma-related Glypican-3 (GPC3) protein, treatment of cancers related to the Glypican-3 protein using the same, a composition for inhibiting a cancer and a composition for diagnosing a cancer comprising the same as an active ingredient.Type: GrantFiled: March 6, 2017Date of Patent: March 3, 2020Assignees: POSTECH ACADEMY—INDUSTRY FOUNDATION, SEOUL NATIONAL UNIVERSITY HOSPITAL, YONSEI UNIVERSITY, UNIVERSITY—INDUSTRY FOUNDATION (UIF)Inventors: Eun Ju Oh, Jung Hwan Lee, Jong-Hoon Lim, Jong In Kim, Jung Hwan Yoon, Sung Ho Ryu, Jeong-Hoon Lee, Won Jun Kang, Seong Hui Jin
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Publication number: 20190169323Abstract: The present invention relates to a high-density ethylene-based polymer comprising an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. According to the present invention, the high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.Type: ApplicationFiled: April 7, 2017Publication date: June 6, 2019Applicant: HANWHA CHEMICAL CORPORATIONInventors: In Jun LEE, Won Jun KANG, Dong Ok KIM, Song Hee YANG, Sung Woo LEE, Dong Wook JEONG, Ui Gab JOUNG
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Publication number: 20190169325Abstract: A high-density ethylene-based polymer is provided. The high-density ethylene-based polymer contains an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. The high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.Type: ApplicationFiled: February 10, 2017Publication date: June 6, 2019Applicant: HANWHA CHEMICAL CORPORATIONInventors: In Jun LEE, Won Jun KANG, Dong Ok KIM, Song Hee YANG, Sung Woo LEE, Dong Wook JEONG, Ui Gab JOUNG
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Publication number: 20190136239Abstract: The present invention relates to a DNA aptamer specifically binding to a hepatocellular carcinoma-related Glypican-3(GPC3) protein, treatment of cancers related to the Glypican-3 protein using the same, a composition for inhibiting a cancer and a composition for diagnosing a cancer comprising the same as an active ingredient.Type: ApplicationFiled: March 6, 2017Publication date: May 9, 2019Inventors: Eun Ju OH, Jung Hwan Lee, Jong-Hoon Lim, Jong In Kim, Jung Hwan Yoon, Sung Ho Ryu, Jeong-Hoon Lee, Won Jun Kang, Seong Hui Jin
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Publication number: 20190127503Abstract: The present invention relates to a high-density ethylene-based polymer comprising: an ethylene homopolymer; or a copolymer of ethylene and at least one comonomer selected from the group consisting of ?-olefins, cyclic olefins and linear, branched and cyclic dienes. According to the present invention, the high-density ethylene-based polymer has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.Type: ApplicationFiled: February 10, 2017Publication date: May 2, 2019Applicant: HANWHA CHEMICAL CORPORATIONInventors: Ui Gab JOUNG, Dong Wook JEONG, Won Jun KANG, Dong Ok KIM, Song Hee YANG, In Jun LEE
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Patent number: 9309515Abstract: Disclosed are a DNA aptamer specifically binding to the Her2 (ERBB2) receptor involved in the onset of breast cancer, a composition for the suppression of cancer metastasis comprising the same as an active ingredient, and a composition for the diagnosis of cancer comprising the same as an active ingredient. Due to its binding mechanism being different from that of the conventional antibody, the aptamer can be effectively used for suppressing cancer metastasis and diagnosing cancer.Type: GrantFiled: August 10, 2011Date of Patent: April 12, 2016Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, KOREA FOOD & DRUG ADMINISTRATIONInventors: Jung Hwan Lee, Young Chan Chae, Youngdong Kim, Hyungu Kang, Jong Hun Im, Jong In Kim, Ki Seok Kim, Sung Key Jang, Il Ung Oh, Min Jeong Choi, Won Jun Kang
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Publication number: 20150005368Abstract: Disclosed are a DNA aptamer specifically binding to the Her2 (ERBB2) receptor involved in the onset of breast cancer, a composition for the suppression of cancer metastasis comprising the same as an active ingredient, and a composition for the diagnosis of cancer comprising the same as an active ingredient. Due to its binding mechanism being different from that of the conventional antibody, the aptamer can be effectively used for suppressing cancer metastasis and diagnosing cancer.Type: ApplicationFiled: August 10, 2011Publication date: January 1, 2015Applicants: KOREA FOOD & DRUG ADMINISTRATION, POSTECH ACADEMY-INDUSTRY FOUNDATIONInventors: Jung Hwan Lee, Young Chan Chae, Youndong Kim, Hyungu Kang, Jong Hun Im, Jong In Kim, Ki Seok Kim, Sung Key Jang, II Ung Oh, Min Jeong Choi, Won Jun Kang
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Patent number: 6711079Abstract: The inventions relate to a data bus sense amplifier circuit. A switching unit includes a PMOS transistor which serves as an input terminal for a sense amp enable signal for maintaining a power supply voltage precharge state of a data bus sense amp. This arrangement allows for reduced leakage current between the switching unit and a ground terminal, and a sensed width by self-asymmetry during a precharge period is decreased, to easily invert a wanted data in a read operation. In addition, the sense amp enable signal is a pulse type for facilitating a high speed sensing operation in a high pulse operation, thereby improving a speed.Type: GrantFiled: October 18, 2001Date of Patent: March 23, 2004Assignee: Hynix Semiconductor Inc.Inventor: Won Jun Kang
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Publication number: 20020048207Abstract: The inventions relate to a data bus sense amplifier circuit. A switching unit includes a PMOS transistor which serves as an input terminal for a sense amp enable signal for maintaining a power supply voltage precharge state of a data bus sense amp. This arrangement allows for reduced leakage current between the switching unit and a ground terminal, and a sensed width by self-asymmetry during a precharge period is decreased, to easily invert a wanted data in a read operation. In addition, the sense amp enable signal is a pulse type for facilitating a high speed sensing operation in a high pulse operation, thereby improving a speed.Type: ApplicationFiled: October 18, 2001Publication date: April 25, 2002Inventor: Won Jun Kang
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Patent number: 6294424Abstract: The method involves forming a N well over a cell part and a P well over a periphery part of the semiconductor substrate, etching the N well and the P well to form trenches for a storage electrode and an element isolating film, forming an insulating film over the resulting structure, thereby filling the trench on the periphery part, sequentially forming a dielectric layer pattern and a storage electrode on the trench of the cell part, forming a storage electrode, forming an intermediate layer over the resulting structure, exposing the storage electrode, forming an undoped polysilicon layer over the resulting structure, thereby connecting the undoped polysilicon layer with the storage electrode, forming a polysilicon layer pattern and an intermediate insulating pattern, and forming a MOS transistor and a bit line over the polysilicon layer pattern of the cell part and the periphery part.Type: GrantFiled: October 5, 1999Date of Patent: September 25, 2001Assignee: Hyundai Electronics Industries Co., Ltd.Inventors: Won Jun Kang, Yoon Nam Kim, Hyun Gu Yoon