Abstract: A mold-concrete composite crossbeam includes a H-steel composed of upper and lower flanges and a web connecting them; a concrete member formed in a length direction of the H-steel to expose the upper flange out but bury the lower flange and the web partially; deck plate supports installed to both upper side edges of the concrete member to support a deck plate placed thereon; a reinforcing steel bar installed around the H-steel; a mold including a bottom detachably coupled to a lower end surface of the concrete member, and sidewalls formed in parallel to both sides of the bottom and detachably coupled to both end sides of the concrete member; a lateral reinforcing member coupled across both sidewalls; a side reinforcing member installed to an outer side of the sidewalls in a length direction; and bottom reinforcing members installed across a lower surface of the bottom.

Abstract: An array substrate includes a base substrate, an input pad part, a first output part, a second output pad part, a pixel array, and a signal transmitting part. The input pad part and the first output pad part are disposed at the chip mounting area of the base substrate. The second output pad part is also disposed at the chip mounting area, but disposed within a layer different from the first output pad part. The pixel array is disposed at an array area of the array substrate. The signal transmitting part is disposed at a signal transmitting area of the array substrate. Therefore, the first and second output pad parts are disposed at different layers, respectively, so that a space utilizing efficiency of the array substrate is enhanced.

Abstract: A liquid crystal display device using a light emitting diode includes a liquid crystal panel, a light guide plate including a light inlet part, the light guide plate being arranged at rear side of the liquid crystal panel, a flexible printed circuit film electrically connected to the liquid crystal panel, and a printed circuit board electrically connected to the flexible printed circuit film including a light emitting diode package mounted on a portion close to an end of the printed circuit board contacts the light inlet part of the light guide plate.

Abstract: A backlight unit capable of reducing or effectively preventing a luminance deviation includes a plurality of light emitting diodes, a light source substrate on which the plurality of light emitting diodes is mounted, a light guide plate converting line-shaped light generated from the light emitting diodes into a surface-shaped light, an incident surface of the light guide plate contacting an emitting surface of each of the light emitting diodes, a first fixing part formed on the light source substrate in a region overlapping the light guide plate and a second fixing part formed on the light guide plate and coupled to the first fixing part.

Abstract: An array substrate comprises a first pixel part including a plurality of first effective pixels and a plurality of first dummy pixels, wherein the first effective pixels are disposed in a display area, and the first dummy pixels are disposed in a peripheral area, the peripheral area being formed around the display area, and a second pixel part including a plurality of second effective pixels and a plurality of second dummy pixels, the second pixel part being adjacent to the first pixel part, wherein the second effective pixels are disposed in the display area, and the second dummy pixels are disposed in the peripheral area.

Abstract: An array substrate includes a base substrate, an input pad part, a first output part, a second output pad part, a pixel array, and a signal transmitting part. The input pad part and the first output pad part are disposed at the chip mounting area of the base substrate. The second output pad part is also disposed at the chip mounting area, but disposed within a layer different from the first output pad part. The pixel array is disposed at an array area of the array substrate. The signal transmitting part is disposed at a signal transmitting area of the array substrate. Therefore, the first and second output pad parts are disposed at different layers, respectively, so that a space utilizing efficiency of the array substrate is enhanced.

Abstract: The method for building an underground structure capable of utilizing a part of a permanent structure as a strut for earth construction, comprises the steps of: driving in an H-section steel pile on a boundary line at which a building is installed; driving a center pile on a position where the pillar of the building is installed; carrying out a primary excavating work; coupling the H-section steel pile with a concrete retaining wall by means of a fixing shear connecting means, thereby constructing an underground composite retaining wall; installing a girder to be used as a part of a permanent structure on the composite retaining wall by means of an embedded plate an assembling and disposing the girder to the center pile; and carrying out a secondary excavating work and repeating the steps after the primary excavating work until the earth is excavated up to the lowermost part of the building.

Abstract: The method for building an underground composite retaining wall comprises determining a position where a temporary retaining wall is installed in consideration of the outside line of the underground of a building, forming holes by means of a construction equipment such as an auger drill to drive in an H-section steel pile in each of the holes, and installing an earth plate between the H-section steel piles, thereby completing the installation of the temporary retaining wall; excavating a site in the interior of the temporary retaining wall; if the site excavation is completed, installing a fixing shear connecting means on the H-section steel pile; arranging reinforcing bars on an underground retaining wall; and installing a frame in the interior of the underground retaining wall, casting concrete in the frame and curing the concrete, thereby completing the formation of the underground retaining wall.