Abstract: Disclosed are grinding wheels, back-grinding apparatuses, and abrasive article manufacturing methods. The grinding wheel comprises a wheel body having a disk shape and an abrasive article combined with one surface of the wheel body. The abrasive article includes an abrasive body and a plurality of grinding particles in the abrasive body. The abrasive body provides a groove hole that is recessed in a first direction as a horizontal direction on a lateral surface of the abrasive body. A length in the first direction of the groove hole is less than a width in the first direction of the abrasive body.

Abstract: A back grinding apparatus includes a grinding wheel that is rotatable and movable in a vertical direction and including at least one abrasive, and a grinding gauge below the grinding wheel and configured to measure a wear amount of the at least one abrasive, where the grinding gauge includes a measuring body and a photoelectric sensor supported by the measuring body and configured to determine the wear amount of the at least one abrasive, and where the photoelectric sensor includes at least one light emitter, and at least one light receiver spaced apart from the at least one light emitter in a horizontal direction and configured to receive light emitted from the at least one light emitter.

Abstract: Provided is a chemical mechanical polishing apparatus including a head part configured to support a wafer, a buffer part on the head part and configured to support a center of the wafer, and a first polishing part that is spaced apart from the buffer part and configured to be on an edge of the wafer.

Abstract: The present disclosure relates to a chemical mechanical polishing apparatus and a method of controlling the same, and the chemical mechanical polishing apparatus includes: a polishing pad having a hollow shape and including a plurality of first grooves disposed at an edge of the polishing pad and arranged in a circumferential direction; a substrate support positioned below the polishing pad and including an edge portion that adjoins the plurality of first grooves, the substrate support being configured to mount a wafer; and a slurry supplier positioned above the wafer and configured to supply slurry to the wafer.

Abstract: A polishing process apparatus includes a carrier configured to support an object, a platen provided below the carrier and configured to accommodate at least one eddy current sensor, the at least one eddy current sensor including a coil configured to output an eddy current, a power supply circuit configured to supply power to the coil and a voltage detection circuit connected to the coil and configured to detect raw voltage data, a polishing pad on an upper surface of the platen, and a controller configured to acquire first data by receiving the raw voltage data from the voltage detection circuit a plurality of times while a polishing process is performed on the object, acquire second data by sequentially applying a first filter and a second filter to the first data, the first filter being different from the second filter and measure a thickness of a target layer included in the object based on the second data.

Abstract: A liquid crystal module includes: a liquid crystal display panel; a backlight unit that irradiates light onto the liquid crystal display panel; a panel guide that supports the liquid crystal display panel and the backlight unit in a stacked condition and ensures a panel gap between the liquid crystal display panel and the backlight unit; and a top case facing the panel guide. The panel guide includes one or more ventilation openings that penetrate side walls of the panel guide facing the panel gap.

Abstract: A liquid crystal module includes: a liquid crystal display panel; a backlight unit that irradiates light onto the liquid crystal display panel; a panel guide that supports the liquid crystal display panel and the backlight unit in a stacked condition and ensures a panel gap between the liquid crystal display panel and the backlight unit; and a top case facing the panel guide. The panel guide includes one or more ventilation openings that penetrate side walls of the panel guide facing the panel gap.