Abstract: An apparatus for fabricating semiconductor devices includes a chamber having a bottom plane, a side wall and a lid. An irradiating unit is at an interior of the chamber. A substrate mounting unit is between the bottom plane of the chamber and the irradiating unit. The irradiating unit includes an irradiating tube and a hole penetrating the central region of the irradiating tube. The irradiating tube has a hollow disk shape, and a lower surface of the irradiating tube is opened to the substrate mounting unit.

Abstract: A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.

Abstract: A method of forming a semiconductor package includes attaching a semiconductor substrate on a support substrate, wherein the semiconductor substrate includes a plurality of first semiconductor chips and a chip cutting region that separates respective ones of the semiconductor chips. A first cutting groove is formed that has a first kerf width between first and second ones of the plurality of first semiconductor chips. A plurality of second semiconductor chips is attached to the plurality of first semiconductor chips. A molding layer is formed so as to fill the first cutting groove and a second cutting groove having a second kerf width that is less than the first kerf width is formed in the molding layer so as to form individual molding layers covering one of the plurality of first semiconductor chips and one of the plurality of second semiconductor chips.

Abstract: A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.

Abstract: A color electronic paper using RGBW color particles and a driving method thereof are provided. The color electronic paper using RGBW color particles includes an upper substrate and a lower substrate spaced apart from each other; partitions disposed between the upper substrate and the lower substrate and forming a red subpixel, a green subpixel, a blue subpixel, and a transparent subpixel; a medium mixed with first charged particles and second charged particles and stored to the red subpixel, the green subpixel, the blue subpixel, and the transparent subpixel respectively; and a controller for applying the same voltage value as a smallest voltage value among voltage values applied to the red subpixel, the green subpixel, and the blue subpixel, to the transparent subpixel.

Abstract: A substrate unit for an electronic paper is provided. The substrate unit for the electronic paper includes a substrate; an electrode formed on the substrate; and a hydrophobic polymer layer formed on at least one of an outer side of the substrate and the electrode.

Abstract: Provided are a thermal conductive substrate having high thermal conductivity, which dissipates heat through as small as possible area thereof, and a method of manufacturing the thermal conductive substrate. The thermal conductive substrate includes a lower heat sink layer, a thermal conductive layer including thermal conductors formed to contact the lower heat sink layer, and an insulating adhesive portion filled between the thermal conductors, and an upper layer formed on the thermal conductor, wherein the upper layer contacts the thermal conductor so as to dissipate heat to the lower heat sink layer.

Abstract: A semiconductor package forming method includes mounting a backgrinding-underfill film which includes a laminated backgrinding film and a laminated underfill film on a semiconductor wafer so that the underfill film adheres to a front side of the semiconductor wafer; backgrinding a back side of the semiconductor wafer on which the backgrinding-underfill film has been mounted and removing the backgrinding film of the backgrinding-underfill film from the semiconductor wafer. The method further includes dicing the semiconductor wafer from which the backgrinding film has been removed, so that semiconductor chips are separated from the semiconductor wafer.

Abstract: A semiconductor package forming method includes mounting a backgrinding-underfill film which includes a laminated backgrinding film and a laminated underfill film on a semiconductor wafer so that the underfill film adheres to a front side of the semiconductor wafer; backgrinding a back side of the semiconductor wafer on which the backgrinding-underfill film has been mounted and removing the backgrinding film of the backgrinding-underfill film from the semiconductor wafer. The method further includes dicing the semiconductor wafer from which the backgrinding film has been removed, so that semiconductor chips are separated from the semiconductor wafer.

Abstract: An apparatus for processing a wafer includes a chamber, a boat, microwave generators and reflective plates. The boat is disposed in the chamber. One or more wafers are stacked in the boat. One or more microwave generators are connected to the chamber. The microwave generators generate microwaves for heating the wafers. The reflective plates reflect the microwaves onto the wafers such that the microwaves are uniformly applied to the wafers. Each of the reflective plates faces at least one of both sides of the wafer. The reflective plates include at least one of a fat side, a concave side and a convex side.

Abstract: A method of forming a backside protection film includes forming a first coating layer on a first heterogeneous film, the first coating layer being at a C-stage state, forming a second coating layer on a second heterogeneous film, the second coating layer being at a B-stage state, separating the first coating layer from the first heterogeneous film, and attaching the first coating layer to the second coating layer, the second coating layer being between the second heterogeneous film and the first coating layer, and each of the first and second heterogeneous films being formed by coating a first material layer with a second material.

Abstract: The present invention relates to a method for fabricating a conductive particle, the method comprising steps of: (a) preparing a particle based on a macromolecular resin; (b) forming a layer of a nano powder on a surface of the particle; and (c) subjecting the layer of the nano powder to an electroless plating. In accordance with the present invention, a nano powder is bonded on a particle based on a macromolecular resin and an electroless conductive layer is plated such that a pretreatment process of a plating process for forming a conductive particle is omitted and the plating process is simplified from twice to once, thereby reducing a toxic substance generated in a conventional process to improve a stability of the process and reduce a manufacturing cost.

Abstract: Disclosed herein are an adhesive film having a multiple filler distribution and a method of manufacturing the same, and a chip stack package having the adhesive film and a method of manufacturing the same. The adhesive film may have an upper film layer with a high concentration of fillers with a small particle size, and a lower film layer with a low concentration of fillers of a large particle size. The adhesive film having a multiple filler distribution may be manufactured using a lamination method or a consecutive coating method. The adhesive film may include two film layers having identical chemical properties while having different physical properties.

Abstract: A structure and method of connecting a plurality of PSC-I beams (PSC-I beams) to each other using steel brackets.