Patents by Inventor Won-ki Hur

Won-ki Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING
    Publication number: 20200071566
    Abstract: A slurry composition for a chemical mechanical polishing (CMP) process includes about 0.1% by weight to about 10% by weight of polishing particles, about 0.001% by weight to about 1% by weight of an amine compound, about 0.001% by weight to about 1% by weight of a first cationic compound that is amino acid, about 0.001% by weight to about 1% by weight of a second cationic compound that is organic acid, and about 1% by weight to about 5% by weight of polyhydric alcohol including at least two hydroxyl groups.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Applicant: KCTECH CO., LTD.
    Inventors: Sang-hyun Park, Hyo-san Lee, Won-ki Hur, Jung-yoon Kim, Jun-ha Hwang, Chang-gil Kwon, Sung-pyo Lee
  • Method of fabricating integrated circuit device by using slurry composition
    Patent number: 9991127
    Abstract: A method of fabricating an integrated circuit device may include forming a polishing stop layer and a semiconductor layer on a substrate, and selectively polishing the semiconductor layer from a surface which simultaneously exposes the polishing stop layer and the semiconductor layer, by using a slurry composition including a compound composition and polishing particles. The compound composition may include a sulfonate compound and a terminal amine group-including compound.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: June 5, 2018
    Assignees: SAMSUNG ELECTRONICS CO., LTD., K.C. TECH CO., LTD.
    Inventors: Sang-hyun Park, Jae-hak Lee, Bo-hyeok Choi, Sang-kyun Kim, Won-ki Hur
  • METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE BY USING SLURRY COMPOSITION
    Publication number: 20170207100
    Abstract: A method of fabricating an integrated circuit device may include forming a polishing stop layer and a semiconductor layer on a substrate, and selectively polishing the semiconductor layer from a surface which simultaneously exposes the polishing stop layer and the semiconductor layer, by using a slurry composition including a compound composition and polishing particles. The compound composition may include a sulfonate compound and a terminal amine group-including compound.
    Type: Application
    Filed: October 6, 2016
    Publication date: July 20, 2017
    Applicants: Samsung Electronics Co., Ltd., K.C. TECH Co., Ltd.
    Inventors: Sang-hyun Park, Jae-hak Lee, Bo-hyeok Choi, Sang-kyun Kim, Won-ki Hur