Patents by Inventor Won Kook SON
Won Kook SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10487996Abstract: A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices includes a non-conductive substrate; a first light emitting diode chip, a second light emitting diode chip and nth, where n?1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends; two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the nth light emitting diode chip connected an output terminal; two extending terminals connected the first connection mean and the second connection mean respectively; and a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals, wherein the nth light emitting diode chip formed a firsType: GrantFiled: January 29, 2019Date of Patent: November 26, 2019Assignee: LUMENS CO., LTD.Inventors: Dae Won Kim, Yong Wook Cho, Min Pyo Kim, Jung Hye Park, Won Kook Son
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Publication number: 20190178452Abstract: A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices includes a non-conductive substrate; a first light emitting diode chip, a second light emitting diode chip and nth, where n?1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends; two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the nth light emitting diode chip connected an output terminal; two extending terminals connected the first connection mean and the second connection mean respectively; and a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals, wherein the nth light emitting diode chip formed a firsType: ApplicationFiled: January 29, 2019Publication date: June 13, 2019Applicant: LUMENS CO., LTD.Inventors: Dae Won KIM, Yong Wook CHO, Min Pyo KIM, Jung Hye PARK, Won Kook SON
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Patent number: 10234088Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.Type: GrantFiled: September 11, 2018Date of Patent: March 19, 2019Assignee: LUMENS CO., LTD.Inventors: Dae Won Kim, Yong Wook Cho, Min Pyo Kim, Jung Hye Park, Won Kook Son
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Publication number: 20190011093Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.Type: ApplicationFiled: September 11, 2018Publication date: January 10, 2019Applicant: LUMENS CO., LTD.Inventors: Dae Won KIM, Yong Wook CHO, Min Pyo KIM, Jung Hye PARK, Won Kook SON
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Patent number: 10109775Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.Type: GrantFiled: October 26, 2016Date of Patent: October 23, 2018Assignee: LUMENS CO., LTD.Inventors: Dae Won Kim, Yong Wook Cho, Min Pyo Kim, Jung Hye Park, Won Kook Son
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Publication number: 20180209597Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.Type: ApplicationFiled: October 26, 2016Publication date: July 26, 2018Applicant: Lumens Co., Ltd.Inventors: Dae Won KIM, Yong Wook CHO, Min Pyo KIM, Jung Hye PARK, Won Kook SON
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Publication number: 20170336038Abstract: Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.Type: ApplicationFiled: October 26, 2016Publication date: November 23, 2017Applicant: Lumens Co., Ltd.Inventors: Dae Won KIM, Yong Wook CHO, Min Pyo KIM, Jung Hye PARK, Won Kook SON