Patents by Inventor Won-kyoung Chio

Won-kyoung Chio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-chip bonding structure of light-emitting element using metal column
    Publication number: 20060138444
    Abstract: A flip-chip bonding structure of a light-emitting element is provided. The structure improves a heat emission efficiency by using a metal column having a high thermal conductivity instead of a solder bump. The structure includes a light-emitting element, a sub-mount, and a metal column. The metal column connects the light-emitting element with the sub-mount electrically and thermally.
    Type: Application
    Filed: September 8, 2005
    Publication date: June 29, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won-kyoung Chio, Tae-hoon Jang, Su-hee Chae, Hyung-kun Kim