Patents by Inventor Won-mi CHOI

Won-mi CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966106
    Abstract: An optical path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; and a light conversion part disposed between the first electrode and the second electrode, wherein: each of the first substrate and the second substrate includes a first direction, a second direction different from the first direction, and a third direction defined as a thickness-direction of the first substrate and the second substrate; the light conversion part includes a partition wall part and a reception part alternately arranged; and the reception part has a light transmittance changing according to application of a voltage, extends in a fourth direction, and has a lower surface inclined at an acute angle with respect to one side surface of the first substrate.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: April 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: In Hae Lee, Won Seok Choi, Chan Mi Ju
  • Publication number: 20230207211
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein 0.46 to 1.08 at% is a range of an indium (In) content compared to nickel (Ni) and indium (In) contents in a surface layer portion of the internal electrode.
    Type: Application
    Filed: June 15, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Hong Oh, Jun Oh Kim, Byung Kun Kim, Min Jung Cho, Won Mi Choi, Su Yeon Lee, Kyung Ryul Lee, Yun Sung Kang
  • Patent number: 11313018
    Abstract: Present invention is about a transformation-induced plasticity high-entropy alloy which can provide improved mechanical properties compared to those obtained by conventional methods, due to the phase transformation occurring at the time of deformation at a cryogenic temperature. According to the present invention, the high-entropy alloy (HEA) includes 10-35 at % of Co, 3-15 at % of Cr, 3-15 at % of V, 35-48 at % of Fe, and 0-25 at % of Ni (exclusive of 25), and mainly consists of an FCC phase at room temperature, wherein transformation-induced plasticity, in which at least part of the FCC phase changes to a BCC phase, occurs at a cryogenic temperature (?196° C.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 26, 2022
    Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Byeong-joo Lee, Sung-hak Lee, Seok-su Sohn, Hyoung-seop Kim, Dong-geun Kim, Yong-hee Jo, Won-mi Choi
  • Patent number: 11168386
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: November 9, 2021
    Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY
    Inventors: Byeong-joo Lee, Sung-hak Lee, Hyoung-seop Kim, Young-sang Na, Sun-ig Hong, Won-mi Choi, Chang-woo Jeon, Seung-mun Jung
  • Publication number: 20210269900
    Abstract: Present invention is about a transformation-induced plasticity high-entropy alloy which can provide improved mechanical properties compared to those obtained by conventional methods, due to the phase transformation occurring at the time of deformation at a cryogenic temperature. According to the present invention, the high-entropy alloy (HEA) includes 10-35 at % of Co, 3-15 at % of Cr, 3-15 at % of V, 35-48 at % of Fe, and 0-25 at % of Ni (exclusive of 25), and mainly consists of an FCC phase at room temperature, wherein transformation-induced plasticity, in which at least part of the FCC phase changes to a BCC phase, occurs at a cryogenic temperature (?196° C.
    Type: Application
    Filed: March 30, 2018
    Publication date: September 2, 2021
    Applicant: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Byeong-joo LEE, Sung-hak LEE, Seok-su SOHN, Hyoung-seop KIM, Dong-geun KIM, Yong-hee JO, Won-mi CHOI
  • Patent number: 10988834
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Cr: 3-18 at %; Fe: 3-60 at %; Mn: 3-40 at% ; Ni: 20-80 at %: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: April 27, 2021
    Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY
    Inventors: Byeong-joo Lee, Sung-hak Lee, Hyoung-seop Kim, Young-sang Na, Sun-ig Hong, Won-mi Choi, Chang-woo Jeon, Seung-mun Jung
  • Publication number: 20190071755
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.
    Type: Application
    Filed: March 21, 2017
    Publication date: March 7, 2019
    Inventors: Byeong-joo LEE, Sung-hak LEE, Hyoung-seop KIM, Young-sang NA, Sun-ig HONG, Won-mi CHOI, Chang-woo JEON, Seung-mun JUNG
  • Publication number: 20190055630
    Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Cr: 3-18 at %; Fe: 3-60 at %; Mn: 3-40 at% ; Ni: 20-80 at %: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less.
    Type: Application
    Filed: March 21, 2017
    Publication date: February 21, 2019
    Inventors: Byeong-joo LEE, Sung-hak LEE, Hyoung-seop KIM, Young-sang NA, Sung-ig HONG, Won-mi CHOI, Chang-woo JEON, Seung-mum JUNG