Patents by Inventor Won-Mi Kim

Won-Mi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photoresist composition, method of forming a photoresist pattern and method of forming a protection layer in a semiconductor device using the photoresist composition
    Publication number: 20060154176
    Abstract: A photoresist composition comprising a hydrogen-bonding compound and a thermosetting resin is provided. A method of forming a photoresist pattern is also provided. The method comprises forming a photoresist film on an object by coating the object with a photoresist composition including a hydrogen-bonding compound and a thermosetting resin. Then, the photoresist film is partially removed to form the photoresist pattern.
    Type: Application
    Filed: January 11, 2006
    Publication date: July 13, 2006
    Inventors: Seok-Bong Park, Won-Mi Kim, Jae-Hyun Kim
  • Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method
    Patent number: 7026240
    Abstract: In a semiconductor device fabrication method and in a product formed according to the method, a photosensitive polyimide layer (PSPL) layer is applied to a semiconductor device in a manner which overcomes the limitations of the conventional approaches. The beneficial qualities of an added photoresist layer are utilized to avoid unwanted development of the underlying PSPL layer. In this manner, cracking of the PSPL layer is mitigated or eliminated, reducing the device soft error rate (SER) and increasing device yield. This is accomplished in a reliable and low-cost approach that employs standard device fabrication techniques.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 11, 2006
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Jae-Hyun Kim, Dong-Won Shin, Boo-Deuk Kim, Chang-Ho Lee, Won-Mi Kim, Seok-Bong Park
  • Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method
    Publication number: 20050029631
    Abstract: In a semiconductor device fabrication method and in a product formed according to the method, a photosensitive polyimide layer (PSPL) layer is applied to a semiconductor device in a manner which overcomes the limitations of the conventional approaches. The beneficial qualities of an added photoresist layer are utilized to avoid unwanted development of the underlying PSPL layer. In this manner, cracking of the PSPL layer is mitigated or eliminated, reducing the device soft error rate (SER) and increasing device yield. This is accomplished in a reliable and low-cost approach that employs standard device fabrication techniques.
    Type: Application
    Filed: February 11, 2004
    Publication date: February 10, 2005
    Inventors: Jae-Hyun Kim, Dong-Won Shin, Boo-Deuk Kim, Chang-Ho Lee, Won-Mi Kim, Seok-Bong Park