Patents by Inventor Won-Mook Kim

Won-Mook Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing multilayer ceramic substrates
    Patent number: 8496770
    Abstract: In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: July 30, 2013
    Assignee: KoMiCo Co. Ltd.
    Inventor: Won-Mook Kim
  • METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATES
    Publication number: 20120061002
    Abstract: In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.
    Type: Application
    Filed: May 26, 2010
    Publication date: March 15, 2012
    Applicant: KoMiCo LTD.
    Inventor: Won-Mook Kim