Patents by Inventor Won Myoung Ki
Won Myoung Ki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145369Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with the conductive structure, an encapsulant over the top side of the substrate and adjacent a lateral side of the electronic component, and a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure comprises a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends above the upper dielectric layer. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Soo Hyun Kim, Won Myoung Ki, Dong Hoon Han, Tae Kyeong Hwang
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Publication number: 20240113090Abstract: In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 30, 2022Publication date: April 4, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Myoung KI, In Su MOK, Soo Hyun KIM, Tae Kyeong HWANG, Shaun BOWERS, George SCOTT
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Patent number: 11948808Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: December 6, 2021Date of Patent: April 2, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Publication number: 20220165582Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: ApplicationFiled: December 6, 2021Publication date: May 26, 2022Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Publication number: 20220045037Abstract: In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.Type: ApplicationFiled: October 26, 2021Publication date: February 10, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: In Su Mok, Won Geol Lee, Il Bok Lee, Won Myoung Ki
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Patent number: 11195726Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: February 4, 2020Date of Patent: December 7, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Patent number: 11158615Abstract: In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.Type: GrantFiled: May 28, 2019Date of Patent: October 26, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: In Su Mok, Won Geol Lee, Il Bok Lee, Won Myoung Ki
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Publication number: 20200381404Abstract: In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.Type: ApplicationFiled: May 28, 2019Publication date: December 3, 2020Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: In Su Mok, Won Geol Lee, Il Bok Lee, Won Myoung Ki
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Publication number: 20200321222Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: ApplicationFiled: February 4, 2020Publication date: October 8, 2020Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Patent number: 10553451Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: June 25, 2018Date of Patent: February 4, 2020Assignee: Amkor Technology, Inc.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Publication number: 20180308712Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do Do, Jae Hun Bae Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Patent number: 10008393Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: February 11, 2016Date of Patent: June 26, 2018Assignee: AMKOR TECHNOLOGY, INC.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do Do, Jae Hun Bae Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Publication number: 20160276174Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: ApplicationFiled: February 11, 2016Publication date: September 22, 2016Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do Do, Jae Hun Bae Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Patent number: 8946883Abstract: A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.Type: GrantFiled: August 9, 2013Date of Patent: February 3, 2015Assignee: Amkor Technology, Inc.Inventors: Sung Kyu Kim, Jin Young Kim, Yoon Joo Kim, Jin Han Kim, Seung Jae Lee, Se Woong Cha, Jae Hun Bae, Dong Jin Kim, Won Myoung Ki
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Publication number: 20140077366Abstract: A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.Type: ApplicationFiled: August 9, 2013Publication date: March 20, 2014Inventors: Sung Kyu Kim, Jin Young Kim, Yoon Joo Kim, Jin Han Kim, Seung Jae Lee, Se Woong Cha, Jae Hun Bae, Dong Jin Kim, Won Myoung Ki