Patents by Inventor Won-Seock Kim

Won-Seock Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Crack measuring method and apparatus
    Patent number: 8094922
    Abstract: Disclosed are a crack measuring method that may automatically measure crack growth in a surface of a structure rapidly and exactly without influencing the structure using image processing scheme, and an apparatus thereof. The crack measuring method includes: irradiating light to a surface of a structure; converting reflected light, wherein the irradiated light is reflected from the surface of a structure, into an image signal and capturing images of the surface of a structure corresponding to the image signal at predetermined scan intervals through a camera; performing continuously a line scan on the crack parts in the captured images at predetermined scan intervals; and inspecting crack growth in the surface of a structure by identifying pixels with relatively higher or lower light intensity in the scan lines.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: January 10, 2012
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Jung-Ju Lee, Won-Seock Kim
  • CRACK MEASURING METHOD AND APPARATUS
    Publication number: 20090303469
    Abstract: Disclosed are a crack measuring method that may automatically measure crack growth in a surface of a structure rapidly and exactly without influencing the structure using image processing scheme, and an apparatus thereof. The crack measuring method includes: irradiating light to a surface of a structure; converting reflected light, wherein the irradiated light is reflected from the surface of a structure, into an image signal and capturing images of the surface of a structure corresponding to the image signal at predetermined scan intervals through a camera; performing continuously a line scan on the crack parts in the captured images at predetermined scan intervals; and inspecting crack growth in the surface of a structure by identifying pixels with relatively higher or lower light intensity in the scan lines.
    Type: Application
    Filed: June 2, 2009
    Publication date: December 10, 2009
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jung-Ju LEE, Won-Seock KIM