Patents by Inventor Wonshin KWAK

Wonshin KWAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cu—Co—Si—Fe—P-based alloy with excellent bending formability and production method thereof
    Patent number: 11591682
    Abstract: Disclosed are a copper-cobalt-silicon-iron-phosphorus (Cu—Co—Si—Fe—P)-based alloy having strength, electrical conductivity, and excellent bending formability, and a method for producing the alloy. The copper alloy contains 1.2 to 2.5% by mass of cobalt (Co); 0.2 to 1.0% by mass of silicon (Si); 0.01 to 0.5% by mass of iron (Fe); 0.001 to 0.2% by mass of phosphorus (P); a balance amount of copper (Cu); unavoidable impurities; and optionally, 0.05% by mass or smaller of each of at least one selected from a group consisting of nickel (Ni), manganese (Mn) and magnesium (Mg), wherein a ratio between cobalt (Co) mass and silicon (Si) mass meets a relationship: 3.5?Co/Si?4.5, wherein a ratio between iron (Fe) mass and phosphorus (P) mass meets a relationship: 1.0<Fe/P. A bimodal structure improves the bending formability while maintaining the electrical conductivity and strength.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: February 28, 2023
    Assignee: POONGSAN CORPORATION
    Inventors: Sidam Lee, Wonshin Kwak, Wonseok Jeong
  • BAFF-R/CD19 TARGETED CHIMERIC ANTIGEN RECEPTOR-MODIFIED T CELLS AND USE THEREOF
    Publication number: 20220125840
    Abstract: Chimeric antigen receptors targeting both BAFF-R and CD19 are described as are methods for their use.
    Type: Application
    Filed: February 20, 2020
    Publication date: April 28, 2022
    Inventors: Hong Qin, Xiuli Wang, Larry Wonshin Kwak, Stephen J. Forman
  • CU-CO-SI-FE-P-BASED ALLOY WITH EXCELLENT BENDING FORMABILITY AND PRODUCTION METHOD THEREOF
    Publication number: 20210230727
    Abstract: Disclosed are a copper-cobalt-silicon-iron-phosphorus (Cu—Co—Si—Fe—P)-based alloy having strength, electrical conductivity, and excellent bending formability, and a method for producing the alloy. The copper alloy contains 1.2 to 2.5% by mass of cobalt (Co); 0.2 to 1.0% by mass of silicon (Si); 0.01 to 0.5% by mass of iron (Fe); 0.001 to 0.2% by mass of phosphorus (P); a balance amount of copper (Cu); unavoidable impurities; and optionally, 0.05% by mass or smaller of each of at least one selected from a group consisting of nickel (Ni), manganese (Mn) and magnesium (Mg), wherein a ratio between cobalt (Co) mass and silicon (Si) mass meets a relationship: 3.5?Co/Si?4.5, wherein a ratio between iron (Fe) mass and phosphorus (P) mass meets a relationship: 1.0<Fe/P. A bimodal structure improves the bending formability while maintaining the electrical conductivity and strength.
    Type: Application
    Filed: January 20, 2020
    Publication date: July 29, 2021
    Applicant: Poongsan Corporation
    Inventors: Sidam LEE, Wonshin KWAK, Wonseok JEONG