Patents by Inventor Won Sik HONG

Won Sik HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11928298
    Abstract: Disclosed is a display device including a display panel that displays an image on a display surface and an input sensor having a sensor area and a dummy area defined therein. The input sensor includes a first conductive layer that is disposed on the display panel and that includes a first dummy electrode disposed in the sensor area and the dummy area, a second conductive layer that is disposed on the first conductive layer and that includes a sensor electrode disposed in the sensor area and a second dummy electrode disposed in the dummy area, and a pressure sensor electrode disposed between the first dummy electrode and the second dummy electrode.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: March 12, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung-Lyong Bok, Chang Sik Kim, Won-Ki Hong
  • Publication number: 20230421880
    Abstract: A camera monitoring system (CMS) disposed on a panel of a vehicle body. A housing is disposed on a vehicle body. A movable housing is movable along the housing. A CMS camera is disposed on one end of the movable housing. A motor part provides driving force by which the movable housing moves along the housing. A transparent part is disposed on the housing and is located in an area facing the CMS camera when the movable housing is retracted into the housing. A controller controls a driving amount of the motor part and controls turning on/off of the CMS camera.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 28, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SMR AUTOMOTIVE MODULES KOREA LTD.
    Inventors: Nak Kyoung Kong, Dae Hee Lee, Kyung Hwan Kim, Sang Heon Wang, Won Sik Hong, Houng Young Shin, Chang Hwan Lim, Sung Min Cho
  • Publication number: 20230398950
    Abstract: A system for driving a digital side mirror for vehicles, includes a moving case accommodating a camera for photographing the area surrounding the rear and the sides of a vehicle which is mounted in a housing and in a guide pipe mounted to a vehicle panel to be movable forwards and backwards thereof, wherein the camera accommodated in the moving case is controlled to photograph the area surrounding the rear and the sides of the vehicle even when the moving case is moved backwards and received in the housing and the guide pipe, facilitating a user to easily monitor the area surrounding the rear and the sides before turning on the vehicle or after turning off the vehicle.
    Type: Application
    Filed: December 20, 2022
    Publication date: December 14, 2023
    Applicants: Hyundai Motor Company, Kia Corporation, SMR Automotive Modules Korea Ltd.
    Inventors: Nak Kyoung KONG, Ki Hong LEE, Dae Hee LEE, Jong Min PARK, Won Sik HONG, Houng Young SHIN, Chang Hwan LIM, Sung Min CHO, Baek Joon KWON
  • Patent number: 11833970
    Abstract: The disclosure refers to an internal rearview device (1) adapted for use with a motor vehicle, comprising: a rearview element comprising at least one of a reflective element (10) and a display element, with the rearview element having a normal state and at least one anti-glare state, in which a glare experienced by a driver of the vehicle as a result of light reflected at the rearview element is reduced; a bezel (32) surrounding the rearview element and being surrounded by a housing (60); control means comprising sensor means connected to at least one printed circuit board (40, 50), which is arranged between the housing (60) and the rearview element, for controlling at least the state of the rearview element; and a mount assembly (70) which is configured to attach the housing (60) to the vehicle; wherein the perimeter edge (31) of the bezel (32) is exposed to and is viewable by the driver of the vehicle when said device (1) is normally mounted in the vehicle; said perimeter edge (31) comprises a curved surfac
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: December 5, 2023
    Assignee: Motherson Innovations Company Limited
    Inventors: Andreas Herrmann, Chang Kyun Han, Cheol Ho Yim, Ho Jin Huh, Won Sik Hong, Geon Young Choi, Chang Hwan Lim, Freshipali Ali
  • Publication number: 20220266751
    Abstract: The disclosure refers to an internal rearview device (1) adapted for use with a motor vehicle, comprising: a rearview element comprising at least one of a reflective element (10) and a display element, with the rearview element having a normal state and at least one anti-glare state, in which a glare experienced by a driver of the vehicle as a result of light reflected at the rearview element is reduced; a bezel (32) surrounding the rearview element and being surrounded by a housing (60); control means comprising sensor means connected to at least one printed circuit board (40, 50), which is arranged between the housing (60) and the rearview element, for controlling at least the state of the rearview element; and a mount assembly (70) which is configured to attach the housing (60) to the vehicle; wherein the perimeter edge (31) of the bezel (32) is exposed to and is viewable by the driver of the vehicle when said device (1) is normally mounted in the vehicle; said perimeter edge (31) comprises a curved surfac
    Type: Application
    Filed: July 23, 2020
    Publication date: August 25, 2022
    Inventors: Andreas Herrmann, Chang Kyun Han, Cheol Ho Yim, Ho Jin Huh, Won Sik Hong, Geon Young Choi, Chang Hwan Lim, Freshipali Ali
  • Publication number: 20220250547
    Abstract: The present disclosure refers to a rearview device, in particular a rearview mirror device for a motor vehicle, comprising: a rearview element including a first layer and a second layer; a housing supporting at least a portion of the rearview element; a light transmitting region formed to penetrate the second layer of the rearview element; a light emitter for emitting a first light including a first wavelength in a first direction through the light transmitting region; and a light receiver for detecting a second light entering a second direction through the light transmitting region, the second light entering the second direction including a second wavelength corresponding to the first wavelength, wherein a first function of the rearview device or an electrically operating configuration connected with the rearview device is executed when the second light including the second wavelength corresponding to the first wavelength is detected by the light receiver by a predetermined amount or more during a predetermi
    Type: Application
    Filed: July 23, 2020
    Publication date: August 11, 2022
    Inventors: Won Sik Hong, Ho Jin Huh, Geon Young Choi
  • Publication number: 20220242311
    Abstract: The present disclosure refers to a rearview device, in particular a rearview mirror device and/or a rearview display device, mountable on a vehicle through a mounting structure, the rearview device comprising: a rearview element including at least one of a reflective element and a display element; a circuit board for providing an electrical connection to at least one of the rearview element, a light module, a heating element, sensing means and a human machine interface; and a housing coupled with the mounting structure, wherein the housing provides a mounting coupling portion to which the mounting structure is connected and an internal space in which the circuit board is arranged, wherein at least one fastening member for coupling the housing and the mounting structure is engaged on the mounting coupling portion, wherein the circuit board is attached to the housing adjacent to the mounting coupling portion, and wherein the circuit board is arranged in the internal space of the housing so as to not interfere w
    Type: Application
    Filed: July 23, 2020
    Publication date: August 4, 2022
    Inventors: Andreas Herrmann, Chang Kyun Han, Cheol Ho Yim, Won Sik Hong
  • Patent number: 9156111
    Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: October 13, 2015
    Assignees: MK ELECTRON CO., LTD., HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Sung Jae Hong, Keun Soo Kim, Chang Woo Lee, Jung Hwan Bang, Yong Ho Ko, Hyuck Mo Lee, Jae Won Chang, Ja Hyun Koo, Jeong Tak Moon, Young Woo Lee, Won Sik Hong, Hui Joong Kim, Jae Hong Lee
  • Publication number: 20150219254
    Abstract: The present invention relates to a pipe connection device and a pipe connection method, wherein binding force is maintained by a polymer bonder for coupling with a metal material through ion substitution by moltenization between a fitting cover through hole of both ends of a metal material and a coupling pipe. Therefore, a connection of metallic pipes and a mutual coupling construction of plastic composite pipes can be readily carried out by using the polymer bonder which has a low cost and is coupled with the metal material through ion substitution. Additionally, a use under a high pressure condition is possible.
    Type: Application
    Filed: January 3, 2013
    Publication date: August 6, 2015
    Inventors: Jun Bae Lee, Won Sik Hong, Kyung Wook Ahn
  • Publication number: 20150151386
    Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 4, 2015
    Applicants: MK ELECTRON CO., LTD., HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION, KOREA ELECTRONICS TECHNOLOGY INSTITUTE, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Jae HONG, Keun Soo KIM, Chang Woo LEE, Jung Hwan BANG, Yong Ho KO, Hyuck Mo LEE, Jae Won CHANG, Ja Hyun KOO, Jeong Tak MOON, Young Woo LEE, Won Sik HONG, Hui Joong KIM, Jae Hong LEE