Patents by Inventor Wonsik Seo

Wonsik Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing a substrate for a semiconductor package
    Patent number: 5739055
    Abstract: A method for making a substrate for a semiconductor package comprising forming a conductive layer having a desired circuit pattern on the substrate; curing the conductive layer; and coining the cured conductive layer to make its surface uniform. The cured conductive layer may be plated with Ni, and subsequently with Au, and shaped to form a Au-plated board.
    Type: Grant
    Filed: February 28, 1996
    Date of Patent: April 14, 1998
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Jaechul Ryu, Wonsik Seo