Patents by Inventor Won Suk Chang

Won Suk Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12545799
    Abstract: A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.
    Type: Grant
    Filed: July 11, 2024
    Date of Patent: February 10, 2026
    Assignee: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
    Inventors: Seung Kwon Seol, Sang Hyeon Lee, Won Suk Chang, Jae Yeon Pyo
  • Publication number: 20240360331
    Abstract: A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.
    Type: Application
    Filed: July 11, 2024
    Publication date: October 31, 2024
    Inventors: Seung Kwon SEOL, Sang Hyeon LEE, Won Suk CHANG, Jae Yeon PYO
  • Patent number: 11926127
    Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate: in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: March 12, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Chanjae Ahn, Sun Jin Song, Won Suk Chang, Boreum Jeong, A Ra Jo, Kyeong-Sik Ju, Sungwon Choi
  • Patent number: 11907345
    Abstract: An electronic device is disclosed that includes a camera, a display, and a processor.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: February 20, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee Jun Lee, Hyeong Wook Yang, Ju Woan Yoo, Kwang Hyun Lee, Won Suk Chang, Tushar Balasaheb Sandhan, Yang Soo Lee, Ji Yoon Park, Da Som Lee
  • Patent number: 11898012
    Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: NH2-A-NH2?? Chemical Formula 1 wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: February 13, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: A Ra Jo, Chanjae Ahn, Sungwon Choi, Won Suk Chang, Boreum Jeong
  • Patent number: 11868454
    Abstract: An electronic device is disclosed that includes a camera, a display, and a processor.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: January 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee Jun Lee, Hyeong Wook Yang, Ju Woan Yoo, Kwang Hyun Lee, Won Suk Chang, Tushar Balasaheb Sandhan, Yang Soo Lee, Ji Yoon Park, Da Som Lee
  • Patent number: 11597225
    Abstract: The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: March 7, 2023
    Assignee: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
    Inventors: Seung Kwon Seol, Sang Hyeon Lee, Won Suk Chang
  • Publication number: 20230053799
    Abstract: Carbon nanotube (CNT) ink includes a CNT, a rheological modifier for controlling a flow of the CNT, and a solvent. The CNT ink exhibits a liquid-like behavior under shear stress of 10?1 to 10 Pa. A loss modulus of the CNT ink may have a larger value than that of storage modulus under shear stress of 10?1 to 10 Pa. A content of the CNT may be 1 to 20 wt %. A content of the rheological modifier in the CNT ink may be 5 to 40 wt %. A weight ratio of the content of the CNT and the content of the rheological modifier in the CNT ink may be 1:1 to 1:5. The solvent may have a boiling point of 100° C. or less.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 23, 2023
    Inventors: Seung Kwon SEOL, Won Suk CHANG
  • Patent number: 11512210
    Abstract: A method of manufacturing a carbon nanotube (CNT) composite material structure is provided. The method includes providing ink, in which a CNT composite material including a CNT and a rheological modifier is dispersed, to a nozzle, positioning the nozzle at a predetermined point on a substrate, and moving the nozzle along a predetermined path on the substrate while discharging the ink from the nozzle by surface tension of a meniscus formed at a leading end of the nozzle and printing a CNT composite material pattern corresponding to a movement path of the nozzle. In printing the CNT composite material pattern, the pattern is stacked as the CNT composite material by evaporation of a solvent within a meniscus formed by the ink extruded from the nozzle between the nozzle and the substrate.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 29, 2022
    Assignee: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
    Inventors: Seung Kwon Seol, Won Suk Chang
  • Patent number: 11198762
    Abstract: A polyimide that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and a tetracarboxylic dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, L1, L2, Ra to Rf, m, R2, R10, R12, R13, n7, and n8 are the same as defined in the specification.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: December 14, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Hyunjeong Jeon, Sun Jin Song, Sunghyun Han, Won Suk Chang
  • Publication number: 20210340397
    Abstract: A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.
    Type: Application
    Filed: October 26, 2018
    Publication date: November 4, 2021
    Inventors: Seung Kwon SEOL, Sang Hyeon LEE, Won Suk CHANG, Jae Yeon PYO
  • Publication number: 20210253796
    Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.
    Type: Application
    Filed: May 3, 2021
    Publication date: August 19, 2021
    Inventors: A Ra JO, Chanjae AHN, Sungwon CHOI, Won Suk CHANG, Boreum JEONG
  • Publication number: 20210221953
    Abstract: A film comprising a polyimide or poly(imide-amide) copolymer, wherein the film has an amplitude of a surface roughness curve of less than or equal to 270 nanometers.
    Type: Application
    Filed: March 18, 2021
    Publication date: July 22, 2021
    Inventors: A Ra JO, Chanjae AHN, Sungwon CHOI, Sun Jin SONG, Boreum JEONG, Won Suk CHANG
  • Patent number: 11028227
    Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: June 8, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: A Ra Jo, Chanjae Ahn, Sungwon Choi, Won Suk Chang, Boreum Jeong
  • Patent number: 10927218
    Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted aromatic diamine having a maximum absorption wavelength in a range from 500 nanometers (nm) to 650 nm in a visible light region, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: February 23, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Boreum Jeong, Sang Soo Jee, Won Suk Chang, Kyeong-sik Ju, Chanjae Ahn, A Ra Jo, Sungwon Choi
  • Publication number: 20210016552
    Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate: in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 21, 2021
    Inventors: Chanjae AHN, Sun Jin SONG, Won Suk CHANG, Boreum JEONG, A Ra JO, Kyeong-sik JU, Sungwon CHOI
  • Publication number: 20200401682
    Abstract: An electronic device is disclosed that includes a camera, a display, and a processor.
    Type: Application
    Filed: September 13, 2018
    Publication date: December 24, 2020
    Inventors: Hee Jun LEE, Hyeong Wook YANG, Ju Woan YOO, Kwang Hyun LEE, Won Suk CHANG, Tushar Balasaheb SANDHAN, Yang Soo LEE, Ji Yoon PARK, Da Som LEE
  • Publication number: 20200207132
    Abstract: The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate.
    Type: Application
    Filed: April 26, 2018
    Publication date: July 2, 2020
    Inventors: Seung Kwon SEOL, Sang Hyeon LEE, Won Suk CHANG
  • Patent number: 10660166
    Abstract: The microwave heating apparatus of the present invention enables microwaves to be propagated onto an object to be heated through a waveguide such that the microwaves propagate to a microwave space reduced by a wavelength controller which is arranged, as a solid-state object, to occupy a predetermined space in the waveguide. Thus, the microwave heating apparatus of the present invention heats the object to be heated which has been placed in the reduced space. The microwave heating apparatus of the present invention utilizes the effects of lengthening the wavelength of the microwaves propagating to the reduced space so as to be longer than the wavelength before entering the reduced space by a predetermined multiple depending on a near-cutoff condition.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: May 19, 2020
    Assignee: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sun Shin Jung, Dae Ho Kim, Seung Kwon Seol, Geon Woong Lee, Won Suk Chang, Seung Yol Jeong, Hee Jin Jeong, Joong Tark Han
  • Patent number: 10619045
    Abstract: A poly(amide-imide) copolymer including a reaction product of at least one tetracarboxylic acid dianhydride, at least one diamine, and at least one dicarboxylic acid derivative, wherein the at least one tetracarboxylic acid dianhydride includes a tetracarboxylic acid dianhydride represented by Chemical Formula 1, the at least one diamine includes a diamine represented by Chemical Formula 2, and the at least one dicarboxylic acid derivative includes a dicarboxylic acid derivative represented by Chemical Formula 3: wherein, R1 to R3, X1 and X2 are the same as defined in the specification.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: April 14, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Chanjae Ahn, Jungha Chae, Won Suk Chang, A Ra Jo, Sang Soo Jee, Sungwon Choi