Patents by Inventor Won Suk Lee

Won Suk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12687675
    Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector, a first waveguide core coupled to the photodetector, and a second waveguide core coupled to the photodetector. The structure further comprises a third waveguide core including a section disposed laterally between a section of the first waveguide core and a section of the second waveguide core.
    Type: Grant
    Filed: December 11, 2023
    Date of Patent: July 21, 2026
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Sujith Chandran, Yusheng Bian, Abdelsalam Aboketaf, Won Suk Lee
  • Publication number: 20260158872
    Abstract: A heat pump system for a vehicle improves the overall cooling performance and efficiency of a vehicle by heating the vehicle interior by using a high-temperature coolant. Additionally, the heat pump system further employs a separate condenser for subcooling the refrigerant by using the coolant supplied from a dedicated radiator.
    Type: Application
    Filed: June 18, 2025
    Publication date: June 11, 2026
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.
    Inventors: Jeawan Kim, Hochan An, Yeon Ho Kim, Gwi Taek Kim, Hoyoung Jeong, Yeong Jun Kim, Jae Yeon Kim, Man Hee Park, Won Suk Lee, Tae Min Park, Soon-Jong Lee
  • Patent number: 12625320
    Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector including a pad and a semiconductor layer on the pad. The structure further comprises a waveguiding structure including a first waveguide core, a second waveguide core, a slot between the first waveguide core and the second waveguide core, and a plurality of waveguide core segments. The waveguiding structure is adjoined to a side edge of the pad adjacent to the semiconductor layer. Each of the plurality of waveguide core segments includes a portion that is disposed in the slot.
    Type: Grant
    Filed: January 10, 2024
    Date of Patent: May 12, 2026
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Won Suk Lee, Sujith Chandran, Abdelsalam Aboketaf
  • Publication number: 20260084491
    Abstract: A heat pump system for a vehicle includes a compressor, an HVAC module, a heat-exchanger, a first expansion valve, a first connection line, a chiller, a second expansion valve, a gas injection device, a second connection line, a third connection line, and a fourth connection line. The heat pump system improves cooling and heating performance by applying a gas injection device selectively operating in an air conditioning mode of vehicle interior to increase the flow rate of the refrigerant.
    Type: Application
    Filed: May 23, 2025
    Publication date: March 26, 2026
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.
    Inventors: Jeawan Kim, Hochan An, Yeon Ho Kim, Gwi Taek Kim, Hoyoung Jeong, Yeong Jun Kim, Jae Yeon Kim, Man Hee Park, Won Suk Lee, Mingyu Lee, Chul Min Kim
  • Publication number: 20260063844
    Abstract: Structures for a photonic chip that include a photodetector and a grating coupler, and methods of forming such structures. The structure comprises a photodetector including a semiconductor layer, and a grating coupler adjacent to the semiconductor layer of the photodetector. The structure further comprises a waveguide core including a portion that is laterally spaced from the grating coupler.
    Type: Application
    Filed: September 5, 2024
    Publication date: March 5, 2026
    Inventors: Abdelsalam Aboketaf, Yusheng Bian, Won Suk Lee
  • Publication number: 20260036749
    Abstract: Structures for a wavelength-division-multiplexing filter and methods of forming a structure for a wavelength-division-multiplexing filter. The structure comprises a first waveguide core including a first phase delay arm and a second waveguide core including a second phase delay arm. The first phase delay arm has a first section and a second section connected to the first section. The first section of the first phase delay arm and the second section of the first phase delay arm are asymmetrical.
    Type: Application
    Filed: July 31, 2024
    Publication date: February 5, 2026
    Inventors: Aneesh Dash, Sujith Chandran, Yusheng Bian, Avijit Chatterjee, Won Suk Lee, Michal Rakowski
  • Patent number: 12539739
    Abstract: A refrigerant circulating apparatus of a vehicle includes a compressor configured to compress a refrigerant, at least one heat-exchanger configured to heat-exchange the refrigerant, at least one valve configured to selectively flow the refrigerant to the at least one heat-exchanger, and a refrigerant fluid line unit mounted with the compressor, the at least one heat-exchanger, and the at least one valve, and interiorly formed with a plurality of fluid lines to flow the refrigerant to the compressor and the at least one heat-exchanger by a selective operation of the at least one valve, where the refrigerant fluid line unit includes a first fluid line mounting plate and a second fluid line mounting plate coupled to each other.
    Type: Grant
    Filed: October 19, 2023
    Date of Patent: February 3, 2026
    Assignees: Hyundai Motor Company, Kia Corporation, Hanon Systems, Doowon Climate Control Co., Ltd.
    Inventors: Jeawan Kim, Dongwook Lee, Wan Je Cho, Yeonho Kim, Hoyoung Jeong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Hochan An, Hae Jun Lee, Sang Gu Woo, Moo Joong Kim, Won Suk Lee, Soon-Jong Lee, Tae Min Park
  • Publication number: 20260016631
    Abstract: Structures for a photonic chip that include a photonic component and delay lines and methods of forming such structures. The structure comprises a photonic component, a first waveguide core including a section coupled to the photonic component, and a second waveguide core including a section coupled to the photonic component. The section of the first waveguide core has a first length, and the section of the second waveguide core having a second length that is greater than the first length.
    Type: Application
    Filed: July 15, 2024
    Publication date: January 15, 2026
    Inventors: Sujith Chandran, Yusheng Bian, Won Suk Lee, Abdelsalam Aboketaf
  • Patent number: 12504653
    Abstract: Structures for a thermo-optic phase shifter and methods of forming a thermo-optic phase shifter. The structure comprises a semiconductor substrate, and a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element. The first resistive heating element and the second resistive heating element have a first thickness, and the slab layer has a second thickness that is less than the first thickness. The structure further comprises a waveguide core including a portion that is laterally positioned between the first resistive heating element and the second resistive heating element. The slab layer of the heater is disposed between the portion of the waveguide core and the semiconductor substrate.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: December 23, 2025
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Sujith Chandran, Yusheng Bian, Won Suk Lee
  • Patent number: 12496875
    Abstract: A refrigerant circulating apparatus of a vehicle includes a compressor configured to compress a refrigerant, at least one heat-exchanger configured to exchange with the refrigerant, at least one valve configured to selectively provide the refrigerant to the at least one heat-exchanger, a bracket that supports the compressor, and a fluid line plate that is coupled to the bracket and disposed adjacent to the at least one heat-exchanger and the at least one valve. The fluid line plate includes a plurality of fluid lines defined inside the fluid line plate and configured to provide the refrigerant to the at least one heat-exchanger based on operation of the at least one valve.
    Type: Grant
    Filed: October 19, 2023
    Date of Patent: December 16, 2025
    Assignees: Hyundai Motor Company, Kia Corporation, Hanon Systems, Doowon Climate Control Co., LTD.
    Inventors: Jeawan Kim, Dongwook Lee, Wan Je Cho, Yeonho Kim, Hoyoung Jeong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Hochan An, Hae Jun Lee, Sang Gu Woo, Moo Joong Kim, Won Suk Lee, Soon-Jong Lee, Tae Min Park
  • Patent number: 12476184
    Abstract: A semiconductor device is provided. The semiconductor device includes: a first interlayer insulating film defining a lower wiring trench; a lower wiring structure including a first lower barrier film which extends along sidewalls of the lower wiring trench, and a lower filling film which is on the first lower barrier film; a second interlayer insulating film on the first interlayer insulating film, the second interlayer insulating film defining an upper wiring trench which exposes at least part of the lower wiring structure; and an upper wiring structure provided in the upper wiring trench and connected to the lower wiring structure. An upper surface of the first lower barrier film is closer to a bottom surface of the lower wiring trench than each of an upper surface of the first interlayer insulating film and an upper surface the lower filling film. The upper surface of the first lower barrier film is concave.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: November 18, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: John Soo Kim, Min Wook Chung, Kyoung Suk Kim, Soo Kyung Kim, Won Suk Lee, Jong Jin Lee
  • Publication number: 20250328055
    Abstract: Structures for a modulator and methods of forming a structure for a modulator. The structure comprises a first waveguide core including a delay section, and a second waveguide core including a delay section. The delay section of the second waveguide core has a shorter length than the delay section of the first waveguide core. The structure further comprises an optical phase shifter including a p-n junction in a portion of the delay section of the first waveguide core.
    Type: Application
    Filed: April 18, 2024
    Publication date: October 23, 2025
    Inventors: Sujith Chandran, Yusheng Bian, Won Suk Lee, Abdelsalam Aboketaf
  • Publication number: 20250293083
    Abstract: A method for fabricating a semiconductor device includes sequentially forming an insulating material layer and a lower mask material layer on an upper surface of the substrate, forming first and second middle mask patterns on an upper surface of the lower mask material layer forming a spacer material layer on the upper surface of the lower mask material layer, a sidewall and an upper surface of the first middle mask pattern, and a sidewall and an upper surface of the second middle mask pattern, forming a first upper mask material layer on an upper surface of the spacer material layer, forming a first photoresist pattern having a first hole pattern on an upper surface of the first upper mask material layer for exposing a portion of the first upper mask material layer between the first and second middle mask patterns.
    Type: Application
    Filed: October 24, 2024
    Publication date: September 18, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong Soon PARK, Won Suk LEE, Hyon Wook RA, Sang Hyun LEE
  • Publication number: 20250224560
    Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector including a pad and a semiconductor layer on the pad. The structure further comprises a waveguiding structure including a first waveguide core, a second waveguide core, a slot between the first waveguide core and the second waveguide core, and a plurality of waveguide core segments. The waveguiding structure is adjoined to a side edge of the pad adjacent to the semiconductor layer. Each of the plurality of waveguide core segments includes a portion that is disposed in the slot.
    Type: Application
    Filed: January 10, 2024
    Publication date: July 10, 2025
    Inventors: Yusheng Bian, Won Suk Lee, Sujith Chandran, Abdelsalam Aboketaf
  • Publication number: 20250224578
    Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector including a pad and a semiconductor layer on the pad. The pad includes a side edge and a first waveguide core that extends from the side edge adjacent to the semiconductor layer. The structure further comprises a second waveguide core including a section adjoined to the side edge of the pad adjacent to the first waveguide core.
    Type: Application
    Filed: January 5, 2024
    Publication date: July 10, 2025
    Inventors: Yusheng Bian, Sujith Chandran, Won Suk Lee, Abdelsalam Aboketaf
  • Publication number: 20250189721
    Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector, a first waveguide core coupled to the photodetector, and a second waveguide core coupled to the photodetector. The structure further comprises a third waveguide core including a section disposed laterally between a section of the first waveguide core and a section of the second waveguide core.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 12, 2025
    Inventors: Sujith Chandran, Yusheng Bian, Abdelsalam Aboketaf, Won Suk Lee
  • Patent number: 12321009
    Abstract: Structures for a photonic chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector including a pad, a first semiconductor layer on the pad, and a second semiconductor layer on the pad. The second semiconductor layer is laterally spaced from the first semiconductor layer. The structure further comprises a first waveguide core connected to the pad adjacent to the first semiconductor layer, and a second waveguide core connected to the pad adjacent to the second semiconductor layer.
    Type: Grant
    Filed: August 16, 2024
    Date of Patent: June 3, 2025
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Abdelsalam Aboketaf, Yusheng Bian, Won Suk Lee
  • Publication number: 20250147235
    Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector that is disposed on a substrate and that includes a light-absorbing layer. The light-absorbing layer includes a sidewall and a notch in the sidewall. The structure further comprises a waveguide core including a section adjacent to the notch in the sidewall of the light-absorbing layer.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 8, 2025
    Inventors: Yusheng Bian, Andreas D. Stricker, Abdelsalam Aboketaf, Judson R. Holt, Kevin K. Dezfulian, Kenneth J. Giewont, Alexander Derrickson, Won Suk Lee, Sujith Chandran, Ryan W. Sporer, Teng-Yin Lin
  • Patent number: 12284296
    Abstract: Provided is a method of managing a data history and a device performing the method. The method of managing the data history includes generating second data based on first data, calculating a second hash value for the second data based on the second data and a first hash value for the first data, and storing the second hash value on a blockchain network to verify the second data, and a history of the first data is verified using the first hash value stored on the blockchain network.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: April 22, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Min Kyo In, Won Suk Lee, Suwook Ha
  • Patent number: 12271030
    Abstract: Structures for an optical coupler and methods of forming a structure for an optical coupler. The structure comprises a stacked waveguide core including a first waveguide core and a second waveguide core. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned to overlap with the first tapered section. The structure further comprises a third waveguide core including a third tapered section positioned adjacent to the first tapered section of the first waveguide core and the second tapered section of the second waveguide core.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: April 8, 2025
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Won Suk Lee