Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus provides the second semiconductor apparatus with a chip enable signal and a command address signal set, and the second semiconductor apparatus performs an internal operation based on the chip enable signal and the command address signal set. The first semiconductor apparatus provides the second semiconductor apparatus with a selection chip enable command, and the second semiconductor apparatus transmits data to the first semiconductor apparatus or receives the data from the first memory device after receiving the selection chip enable command.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus provides the second semiconductor apparatus with a chip enable signal and a command address signal set, and the second semiconductor apparatus performs an internal operation based on the chip enable signal and the command address signal set. The first semiconductor apparatus provides the second semiconductor apparatus with a selection chip enable command, and the second semiconductor apparatus transmits data to the first semiconductor apparatus or receives the data from the first memory device after receiving the selection chip enable command.

Abstract: A memory apparatus includes an instruction memory and a plurality of micro control units. The instruction memory outputs a plurality of instruction codes at a predetermined time interval in accordance with a plurality of address signals and a plurality of divided clock signals. The plurality of micro control units are coupled to each of a plurality of memory regions, provide each of the plurality of address signals to the instruction memory in accordance with each of the plurality of divided clock signals, and perform operations in accordance with corresponding instruction codes among the plurality of instruction codes.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus provides the second semiconductor apparatus with a chip enable signal and a command address signal set, and the second semiconductor apparatus performs an internal operation based on the chip enable signal and the command address signal set. The first semiconductor apparatus provides the second semiconductor apparatus with a selection chip enable command, and the second semiconductor 10 apparatus transmits data to the first semiconductor apparatus or receives the data from the first memory device after receiving the selection chip enable command.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus provides the second semiconductor apparatus with a chip enable signal and a command address signal set, and the second semiconductor apparatus performs an internal operation based on the chip enable signal and the command address signal set. The first semiconductor apparatus provides the second semiconductor apparatus with a selection chip enable command, and the second semiconductor apparatus transmits data to the first semiconductor apparatus or receives the data from the first memory device after receiving the selection chip enable command.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits an address signal during an address cycle after transmitting a command signal during a command cycle. The first semiconductor apparatus transmits a selection signal during a logical unit number selection cycle before the command cycle. The second semiconductor apparatus performs a data input and output operation based on the selection signal, the command signal, and the address signal.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits a command signal during a command cycle and transmits an address signal during an address cycle. The first semiconductor apparatus transmits a selection signal during a LUN selection cycle before the command cycle. The second semiconductor apparatus performs a data input/output operation based on the selection signal, the command signal, and the address signal.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus provides the second semiconductor apparatus with a chip enable signal and a command address signal set, and the second semiconductor apparatus performs an internal operation based on the chip enable signal and the command address signal set. The first semiconductor apparatus provides the second semiconductor apparatus with a selection chip enable command, and the second semiconductor apparatus transmits data to the first semiconductor apparatus or receives the data from the first memory device after receiving the selection chip enable command.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits an address signal during an address cycle after transmitting a command signal during a command cycle. The first semiconductor apparatus transmits a selection signal during a logical unit number selection cycle before the command cycle. The second semiconductor apparatus performs a data input and output operation based on the selection signal, the command signal, and the address signal.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits an address signal during an address cycle after transmitting a command signal during a command cycle. The first semiconductor apparatus transmits a selection signal during a logical unit number selection cycle before the command cycle. The second semiconductor apparatus performs a data input and output operation based on the selection signal, the command signal, and the address signal.

Abstract: A data storage device may include a memory device divided into a plurality of logical units, and a controller configured to generate a first read command sequence and a second read command sequence for a first logical unit and a second logical unit, respectively, among the plurality of logical units, in response to an external command and configured to continuously output the first and second read command sequences to the memory device.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits an address signal during an address cycle after transmitting a command signal during a command cycle. The first semiconductor apparatus transmits a selection signal during a logical unit number selection cycle before the command cycle. The second semiconductor apparatus performs a data input and output operation based on the selection signal, the command signal, and the address signal.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits an address signal during an address cycle after transmitting a command signal during a command cycle. The first semiconductor apparatus transmits a selection signal during a logical unit number selection cycle before the command cycle. The second semiconductor apparatus performs a data input and output operation based on the selection signal, the command signal, and the address signal.

Abstract: A data storage device may include a memory device divided into a plurality of logical units, and a controller configured to generate a first read command sequence and a second read command sequence for a first logical unit and a second logical unit, respectively, among the plurality of logical units, in response to an external command and configured to continuously output the first and second read command sequences to the memory device.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits a command signal during a command cycle and transmits an address signal during an address cycle. The first semiconductor apparatus transmits a selection signal during a LUN selection cycle before the command cycle. The second semiconductor apparatus performs a data input/output operation based on the selection signal, the command signal, and the address signal.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus provides the second semiconductor apparatus with a chip enable signal and a command address signal set, and the second semiconductor apparatus performs an internal operation based on the chip enable signal and the command address signal set. The first semiconductor apparatus provides the second semiconductor apparatus with a selection chip enable command, and the second semiconductor apparatus transmits data to the first semiconductor apparatus or receives the data from the first memory device after receiving the selection chip enable command.

Abstract: A semiconductor memory device includes a storage, a buffer, and a control logic. The storage stores a first algorithm data. The buffer stores a second algorithm data that is at least partially different from the first algorithm data. The control logic is configured to selectively receive the first algorithm data and the second algorithm data.

Abstract: A semiconductor memory device includes a storage, a buffer, and a control logic. The storage stores a first algorithm data. The buffer stores a second algorithm data that is at least partially different from the first algorithm data. The control logic is configured to selectively receive the first algorithm data and the second algorithm data.

Abstract: The memory device includes: an independent circuit configured to output an independent signal; a memory cell array formed on a top of the independent circuit, the memory cell array including a plurality of memory cells in which data is stored; a revision circuit formed on a top of the memory cell array, the revision circuit storing modified ROM data different from the independent signal, the revision circuit outputting a ROM control signal and the modified ROM data in response to a select signal when an error occurs in the independent signal in a test operation of the independent circuit formed under the memory cell array; and a selection circuit configured to output the independent signal or the modified ROM data in response to the ROM control signal.

Abstract: The memory device includes: an independent circuit configured to output an independent signal; a memory cell array formed on a top of the independent circuit, the memory cell array including a plurality of memory cells in which data is stored; a revision circuit formed on a top of the memory cell array, the revision circuit storing modified ROM data different from the independent signal, the revision circuit outputting a ROM control signal and the modified ROM data in response to a select signal when an error occurs in the independent signal in a test operation of the independent circuit formed under the memory cell array; and a selection circuit configured to output the independent signal or the modified ROM data in response to the ROM control signal.