Patents by Inventor Won Tae JO

Won Tae JO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240066506
    Abstract: Disclosed is a method of preparing sodium-catalyzed iron-aluminum inorganic catalyst for catalyzing a hydrogenation reaction of carbon dioxide. The method of preparing sodium-catalyzed iron-aluminum inorganic catalyst includes: a first step of mixing a precipitant solution formed by dissolving a basic precipitant with a reaction solution formed by dissolving an iron (Fe) precursor material and an aluminum (Al) precursor material, thereby forming a suspension solution; a second step of aging the suspension solution; a third step of separating powder from the aged suspension solution; a fourth step of drying the separated powder and then performing a first heat treatment, thereby forming first catalyst powder; and a fifth step of adding and stirring the first catalyst powder and a sodium precursor material to water and evaporating the water and then performing a second heat treatment, thereby preparing a sodium-introduced iron-aluminum inorganic catalyst.
    Type: Application
    Filed: August 30, 2023
    Publication date: February 29, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jae Hoon KIM, Won Joong YOON, Heun Tae JO, Muhammad Kashif KHAN
  • Patent number: 11197377
    Abstract: The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: December 7, 2021
    Assignee: STEMCO CO., LTD.
    Inventors: Hong Man Kim, Kang Dong Kim, Won Tae Jo, Duck Jae Seo, Jung Sub Kim
  • Publication number: 20200196453
    Abstract: The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: STEMCO CO., LTD.
    Inventors: Hong Man KIM, Kang Dong KIM, Won Tae JO, Duck Jae SEO, Jung Sub KIM