Abstract: A method for preparing a touch screen panel includes forming a non-conductive pattern on a non-display part on one face of a window plate, so that the thickness of the non-conductive pattern is decreased to produce a thin touch screen panel. In addition, this will prevent leakage of ink through the holes of the window plate, and improve the reliability of a conductive electrode pattern layer at a lateral side of the non-conductive pattern, thereby reducing failure rates.

Abstract: A touch screen panel and a method for preparing the same, and more specifically, a touch screen panel includes a window plate 311, a non-conductive color pattern 312 formed on a non-display part on one face of the window plate, and a non-conductive shielding pattern 313 formed on the non-conductive color pattern 312, so as to provide a non-conductive pattern having the desired colors and shielding effects, and to reduce failure rates during the formation of the non-conductive pattern, as well as a method for preparing the same.

Abstract: Provided are a photoresist composition having superior adhesion to an etch target film, a method of forming a pattern by using the photoresist composition, and a method of manufacturing a thin-film transistor (TFT) substrate. The photoresist composition includes an alkali-soluble resin; a photosensitive compound; a solvent; and 0.01 to 0.1 parts by weight of a compound represented by Formula 1: wherein R is one of hydrogen, an alkyl having 1 to 10 carbon atoms, a cycloalkyl having 4 to 8 carbon atoms, and a phenyl group.

Abstract: A photoresist composition includes an alkali-soluble resin, a dissolution inhibitor including a quinone diazide compound, a first additive including a benzenol compound represented by the following Chemical Formula 1, a second additive including an acrylic copolymer represented by the following Chemical Formula 2 and an organic solvent. Accordingly, heat resistance of a photoresist pattern may be improved, and the photoresist pattern may be readily stripped. As a result, crack formation in the photoresist pattern may be reduced and/or prevented.

Abstract: A photoresist composition includes an alkali-soluble resin, a dissolution inhibitor including a quinone diazide compound, a first additive including a benzenol compound represented by the following Chemical Formula 1, a second additive including an acrylic copolymer represented by the following Chemical Formula 2 and an organic solvent. Accordingly, heat resistance of a photoresist pattern may be improved, and the photoresist pattern may be readily stripped. As a result, crack formation in the photoresist pattern may be reduced and/or prevented.