Abstract: A substrate processing apparatus includes a lower plate in a chamber, an electrostatic chuck on the lower plate, the electrostatic chuck including a first step surface, an intermediate ring disposed on the first step surface of the electrostatic chuck, a lower ring surrounding a portion of the intermediate ring and an outer sidewall of the electrostatic chuck on the lower plate, an upper ring covering an upper portion of the intermediate ring, a screw extending through the electrostatic chuck into the lower plate, and a socket connected to each of the screw and the intermediate ring. Each of the screw, the socket and the intermediate ring includes a conductor.

Abstract: Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.

Abstract: Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.