Patents by Inventor Won Yup KO

Won Yup KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of determining position of fault of equipment using sound source inputting apparatus and system of determining position of fault of equipment for performing the same
    Patent number: 10996200
    Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: May 4, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-Whan Oh, Won-Yup Ko, Won-Ki Park, Ho-Youl Lee, Young-Il Jang, Yeon-Woo Choi, Yong-Won Choi
  • Wafer perforating device
    Patent number: 10546765
    Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: January 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung Whan Oh, Yeon Woo Choi, Won Yup Ko, Min Seok Moon, Won Ki Park, Seung Hwan Lee, Yong Won Choi
  • METHOD OF DETERMINING POSITION OF FAULT OF EQUIPMENT USING SOUND SOURCE INPUTTING APPARATUS AND SYSTEM OF DETERMINING POSITION OF FAULT OF EQUIPMENT FOR PERFORMING THE SAME
    Publication number: 20190137451
    Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.
    Type: Application
    Filed: August 6, 2018
    Publication date: May 9, 2019
    Inventors: Kyoung-Whan OH, Won-Yup KO, Won-Ki PARK, Ho-Youl LEE, Young-IL JANG, Yeon-Woo CHOI, Yong-Won CHOI
  • WAFER PERFORATING DEVICE
    Publication number: 20180076060
    Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.
    Type: Application
    Filed: March 30, 2017
    Publication date: March 15, 2018
    Inventors: Kyoung Whan OH, Yeon Woo CHOI, Won Yup KO, Min Seok MOON, Won Ki PARK, Seung Hwan LEE, Yong Won CHOI