Patents by Inventor Wonbin Jo

Wonbin Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device including printed circuit board
    Patent number: 12464646
    Abstract: An electronic device includes a housing including a front surface, a rear surface that is opposite to the front surface, and a side surface enclosing an inner space between the front surface and the rear surface, a display that is visually exposed to the outside of the electronic device, and a printed circuit board that is in the inner space. The printed circuit board includes a plurality of circuit boards that are parallel to one another and include electrical elements and one or more interposers that are between the plurality of circuit boards and connecting a pair of circuit boards adjacent to each other in a height direction. The one or more interposers include one or more via holes, a via and one or more interposer through holes.
    Type: Grant
    Filed: September 26, 2023
    Date of Patent: November 4, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juho Kim, Woochul Park, Dongyeol Kwak, Juwon Kim, Yousok Min, Wonbin Jo, Sooyong Park
  • ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
    Publication number: 20240080982
    Abstract: An electronic device includes a housing including a front surface, a rear surface that is opposite to the front surface, and a side surface enclosing an inner space between the front surface and the rear surface, a display that is visually exposed to the outside of the electronic device, and a printed circuit board that is in the inner space. The printed circuit board includes a plurality of circuit boards that are parallel to one another and include electrical elements and one or more interposers that are between the plurality of circuit boards and connecting a pair of circuit boards adjacent to each other in a height direction. The one or more interposers include one or more via holes, a via and one or more interposer through holes.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 7, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juho Kim, Woochul Park, Dongyeol Kwak, Juwon Kim, Yousok Min, Wonbin Jo, Sooyong Park