Abstract: A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective film is useful in flexible OLED device fabrication processes, e.g., for protection of passivation layers.

Abstract: A silsesquioxane resin, photoresist composition comprising the silsesquioxane resin and a photoacid generator, etching mask composition comprising the silsesquioxane resin, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same. The silsesquioxane resin comprises silicon-bonded hydrogen atom T-units and T-units having a silicon-bonded group of formula —CH2CH2CH2CO2C(R1a)3 or —CH(CH3)CH2CO2C(R1a)3, wherein each R1a is independently an unsubstituted (C1-C2)alkyl.

Abstract: A silicone pressure sensitive adhesive composition includes an alkenyl-terminated polydiorganosiloxane, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. The composition cures to form a pressure sensitive adhesive with selective adhesion to different substrates, including urethane foam. The pressure sensitive adhesive composition, pressure sensitive adhesive, and urethane foam article including the pressure sensitive adhesive are useful in electronics applications for the protection of display devices.

Abstract: A silicone pressure sensitive adhesive composition includes an alkenyl-terminated polydiorganosiloxane, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. The composition cures to form a pressure sensitive adhesive with selective adhesion to different substrates, including urethane foam. The pressure sensitive adhesive composition, pressure sensitive adhesive, and urethane foam article including the pressure sensitive adhesive are useful in electronics applications for the protection of display devices.

Abstract: A silsesquioxane-containing composition comprising a silsesquioxane resin and an oxaamine of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.

Abstract: A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective film is useful in flexible OLED device fabrication processes, e.g., for protection of passivation layers.

Abstract: A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a mixture of an aromatic solvent, and an aliphatic alcohol or an aliphatic ester. Although the silicone pressure-sensitive adhesive composition can be cured by heating at relatively low temperatures, the residual solvent in a silicone pressure-sensitive adhesive can be reduced.

Abstract: A silsesquioxane resin, photoresist composition comprising the silsesquioxane resin and a photoacid generator, etching mask composition comprising the silsesquioxane resin, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same. The silsesquioxane resin comprises silicon-bonded hydrogen atom T-units and T-units having a silicon-bonded group of formula —CH2CH2CH2CO2C(R1a)3 or —CH(CH3)CH2CO2C(R1a)3, wherein each R1a is independently an unsubstituted (C1-C2)alkyl.

Abstract: A silsesquioxane-containing composition comprising a silsesquioxane resin and an oxaamine of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.

Abstract: A silsesquioxane-containing composition comprising a silsesquioxane resin and a silyl-anhydride of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.

Abstract: A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a mixture of an aromatic solvent, and an aliphatic alcohol or an aliphatic ester. Although the silicone pressure-sensitive adhesive composition can be cured by heating at relatively low temperatures, the residual solvent in a silicone pressure-sensitive adhesive can be reduced.