Patents by Inventor Wong Heng

Wong Heng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating lead frame packages
    Publication number: 20050287715
    Abstract: A method of encapsulating a plurality of IC chips attached to a lead frame strip that includes an outer frame and a plurality of vertical and horizontal connecting bars attached to the outer frame in a manner that defines a plurality of inner frames arranged in a matrix pattern within the outer frame, each inner frame including an area where an IC chip from the plurality of IC chips is attached.
    Type: Application
    Filed: February 25, 2005
    Publication date: December 29, 2005
    Applicant: Carsem Semiconductor SDN. BHD.
    Inventors: Richard Yee Lum, Wong Heng, Lau Chuan, Goh Siang, Yip Sang