Patents by Inventor Wong Hing Kuong

Wong Hing Kuong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10541223
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (a) supporting a substrate on a material handling system of the wire bonding machine; (b) changing a bend profile of the substrate; and (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: January 21, 2020
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Wong Hing Kuong, Samuel Capistrano, III, Peter Peh, Liu Yang, Kamal Gupta
  • Publication number: 20180323167
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (a) supporting a substrate on a material handling system of the wire bonding machine; (b) changing a bend profile of the substrate; and (c) securing, after step (b), the substrate against a support structure of the wire bonding machine using a clamping element of the wire bonding machine, the support structure for supporting the substrate during a wire bonding operation, and the clamping element for securing the substrate to the support structure during the wire bonding operation.
    Type: Application
    Filed: April 30, 2018
    Publication date: November 8, 2018
    Inventors: Wong Hing Kuong, Samuel Capistrano, III, Peter Peh, Liu Yang, Kamal Gupta