Patents by Inventor Wong Sze Min

Wong Sze Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20080251901
    Abstract: A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects with the lead frame directly on a bottom mold and clamped by a top mold, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
    Type: Application
    Filed: April 28, 2008
    Publication date: October 16, 2008
    Inventors: Zigmund Ramirez Camacho, Wong Sze Min, Arnel Trasporto, Jeffrey D. Punzalan
  • STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20070170558
    Abstract: A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
    Type: Application
    Filed: January 24, 2006
    Publication date: July 26, 2007
    Inventors: Zigmund Camacho, Wong Sze Min, Arnel Trasporto, Jeffrey Punzalan