Patents by Inventor Wongyu Seol

Wongyu Seol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module and vehicle having the same
    Patent number: 10653050
    Abstract: A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: May 12, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Industry-Academic Cooperation Foundation Gyeongsang National University
    Inventors: SeungHyun Han, Jongpil Kim, Yongoh Choi, Wongyu Seol, Se-Kyo Chung
  • ELECTRONIC MODULE AND VEHICLE HAVING THE SAME
    Publication number: 20190029148
    Abstract: A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.
    Type: Application
    Filed: December 4, 2017
    Publication date: January 24, 2019
    Inventors: SeungHyun Han, Jongpil Kim, Yongoh Choi, Wongyu Seol, Se-Kyo Chung