Abstract: An apparatus and method for detecting a process endpoint. The method includes receiving a first data signal and a second data signal and combining the first data signal and the second data signal to generate a combined data signal. The method also includes detecting a peak in the combined data signal, wherein the peak indicates the process endpoint. The apparatus includes a data collection unit capable of receiving a plurality of data signals and a signal analysis unit. The signal analysis unit is capable of combining the plurality of data signals received through the data collection unit to generate a combined data signal and identifying a peak in the combined data signal indicative of the process endpoint.

Abstract: The invention, in a first aspect, includes a method and apparatus for detecting the endpoint in a chemical-mechanical polishing process. The first aspect includes a chemical-mechanical polishing tool modified to receive a first and a second data signal; combine the first and second data signals to generate a combined data signal; and detect a peak in the combined data signal, wherein the peak indicates the process endpoint. In a second aspect, the invention is a method and an apparatus for detecting the endpoint in a chemical-mechanical polishing process. The second aspect includes an apparatus implementing a method in which a data signal is received. The data signal is analyzed to detect a peak indicative of the process endpoint in the received data signal.