Abstract: Described are systems and methods for predicting an overlay of a patterned wafer. Methods can include receiving a machine data set comprising parameters at a plurality of positions of a wafer, generating an integrated data set by aggregating the parameters and mapping the aggregated parameters to an equispatial grid, generating, using a trained machine learning (ML) model, a predicted overlay for the patterned wafer based at least in part on processing the integrated data set.

Abstract: Systems and methods for detecting and quantifying images are disclosed. Systems and methods can include a metrology platform comprising: a customizable or user-configurable pipeline that is configured to enable a user to automatically and longitudinally obtain a plurality of metrology metrics from a process environment; and a graphical user interface (GUI) for implementing the pipeline, wherein the GUI comprises (1) a plurality of graphical functions configured to permit the user to interact with or to customize the pipeline and (2) one or more visual display areas configured to display the plurality of metrology metrics and a set of metrology images associated thereof.